JPS633612U - - Google Patents
Info
- Publication number
- JPS633612U JPS633612U JP9624686U JP9624686U JPS633612U JP S633612 U JPS633612 U JP S633612U JP 9624686 U JP9624686 U JP 9624686U JP 9624686 U JP9624686 U JP 9624686U JP S633612 U JPS633612 U JP S633612U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductor
- dielectric constant
- constant material
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Waveguide Aerials (AREA)
Description
第1図は、この考案の一実施例によるマイクロ
ストリツプアンテナを示す図、第2図はその断面
図、第3図は従来のマイクロストリツプアンテナ
を示す図、第4図はその断面図である。図中、1
は低誘電率材料から成る第一の基板、2,3は高
誘電率材料から成る第二、第三の基板、4は地導
体面、5はストリツプ導体、6は給電線路、7は
給電用コネクタ、8は棒状導体を示す。なお、図
中同一符号は同一又は相当部分を示す。
Fig. 1 is a diagram showing a microstrip antenna according to an embodiment of the invention, Fig. 2 is a cross-sectional view thereof, Fig. 3 is a diagram showing a conventional microstrip antenna, and Fig. 4 is a cross-sectional view thereof. It is a diagram. In the figure, 1
1 is a first substrate made of a low dielectric constant material, 2 and 3 are second and third substrates made of a high dielectric constant material, 4 is a ground conductor surface, 5 is a strip conductor, 6 is a power supply line, and 7 is for power supply. The connector 8 indicates a rod-shaped conductor. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
も薄い高誘電率材料から成る第二、第三の基板で
挾んで構成した多層基板の第二の基板の第一の基
板と接する面とは反対側の面を地導体面とし、第
三の基板の第一の基板と接する面とは反対側の面
にストリツプ導体を設けて構成したマイクロスト
リツプアンテナにおいて、給電線路を第一の基板
と第二の基板の間に配置し、ストリツプ導体上の
一点と給電線路の終端部分を棒状導体により直接
接続して構成したことを特徴とするスイクロスト
リツプアンテナ。 The surface of the second substrate in contact with the first substrate of a multilayer substrate configured by sandwiching a first substrate made of a low dielectric constant material between second and third substrates made of a thinner high dielectric constant material; In a microstrip antenna, the opposite surface is a ground conductor surface, and a strip conductor is provided on the surface of the third substrate opposite to the surface in contact with the first substrate. A cyclostrip antenna is arranged between a substrate and a second substrate, and is constructed by directly connecting one point on the strip conductor to the terminal end of a feed line using a rod-shaped conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9624686U JPS633612U (en) | 1986-06-24 | 1986-06-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9624686U JPS633612U (en) | 1986-06-24 | 1986-06-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS633612U true JPS633612U (en) | 1988-01-11 |
Family
ID=30961776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9624686U Pending JPS633612U (en) | 1986-06-24 | 1986-06-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS633612U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076736A (en) * | 2000-08-31 | 2002-03-15 | Nec Corp | Chip antenna |
JP2019537850A (en) * | 2016-09-01 | 2019-12-26 | ウェハー エルエルシーWafer Llc | Software controlled antenna |
-
1986
- 1986-06-24 JP JP9624686U patent/JPS633612U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002076736A (en) * | 2000-08-31 | 2002-03-15 | Nec Corp | Chip antenna |
JP2019537850A (en) * | 2016-09-01 | 2019-12-26 | ウェハー エルエルシーWafer Llc | Software controlled antenna |
JP2020014231A (en) * | 2016-09-01 | 2020-01-23 | ウェハー エルエルシーWafer Llc | Method for producing software controlled antenna |