JPS63185270U - - Google Patents
Info
- Publication number
- JPS63185270U JPS63185270U JP7584387U JP7584387U JPS63185270U JP S63185270 U JPS63185270 U JP S63185270U JP 7584387 U JP7584387 U JP 7584387U JP 7584387 U JP7584387 U JP 7584387U JP S63185270 U JPS63185270 U JP S63185270U
- Authority
- JP
- Japan
- Prior art keywords
- perforations
- dividing
- alumina
- recess
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の第一の実施例である多数個取
り厚膜回路基板の裏面側斜視図、第２図は本考案
の第二の実施例である多数個取り厚膜回路基板の
裏面側斜視図、第３図は従来の多数個取り厚膜回
路基板の上面側斜視図である。
１……（セラミツク）基板、２……厚膜回路、
３……分割用ミシン目（分割溝）、４……凹部、
５……基板ミミ部。
FIG. 1 is a perspective view of the back side of a multi-chip thick film circuit board that is the first embodiment of the present invention, and FIG. 2 is a back side view of the multi-chip thick film circuit board that is the second embodiment of the present invention. FIG. 3 is a top perspective view of a conventional multi-chip thick film circuit board. 1... (ceramic) substrate, 2... thick film circuit,
3... Division perforation (dividing groove), 4... Recessed part,
5...Board ear part.
Claims (1)
ナを主成分とする平板状の多数個取り基板におい
て、分割用ミシン目を形成する部分の１部分ある
いは、全部に基板厚が０．４mm以下で、幅が０．
２mm以上の凹部を有することを特徴とする多数個
取り基板。 In a flat multi-piece substrate mainly made of alumina that has perforations for dividing by a laser, the substrate thickness is 0.4 mm or less in one or all of the parts where the perforations are formed, and the width is 0. ．．
A multi-cavity board characterized by having a recess of 2 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7584387U JPS63185270U (en) | 1987-05-19 | 1987-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7584387U JPS63185270U (en) | 1987-05-19 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63185270U true JPS63185270U (en) | 1988-11-29 |
Family
ID=30922359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7584387U Pending JPS63185270U (en) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63185270U (en) |
-
1987
- 1987-05-19 JP JP7584387U patent/JPS63185270U/ja active Pending
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