JPS6318327B2 - - Google Patents

Info

Publication number
JPS6318327B2
JPS6318327B2 JP54141897A JP14189779A JPS6318327B2 JP S6318327 B2 JPS6318327 B2 JP S6318327B2 JP 54141897 A JP54141897 A JP 54141897A JP 14189779 A JP14189779 A JP 14189779A JP S6318327 B2 JPS6318327 B2 JP S6318327B2
Authority
JP
Japan
Prior art keywords
wire
tool
guide hole
horn
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54141897A
Other languages
Japanese (ja)
Other versions
JPS5681946A (en
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP14189779A priority Critical patent/JPS5681946A/en
Publication of JPS5681946A publication Critical patent/JPS5681946A/en
Publication of JPS6318327B2 publication Critical patent/JPS6318327B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Abstract

PURPOSE:To perform a stabilized bonding for a stamp having a projected outer circumference by a method wherein a wire is provided and bonded to a guide hole or a slit on a horn at the angle larger than the tilt angle of the guide hole of a tool. CONSTITUTION:When the wire 3 is cut or when it is slid out to the lower surface 2b of the tool 2 tip using the horn 11 for 60 deg. and the tool 2 for 30 deg., a clamper 4 is shifted toward the 30 deg. direction. In this constitution, the tail of the wire 3, which has been shifted out to the lower surface 2b of the tool tip by the clamper 4, is stabilized and the wire does not come into contact with the projected section even when the sample having the projected outer circumference is used because the horn is for use at 60 deg.. Also when the cutting and shifting out of the wire are performed by shifting the clamper to the 30 deg. direction, the scratch which will be generated by the friction between the rear end 2c of the tool guide hole 2a and the wire 3 can be prevented.

Description

【発明の詳細な説明】 本発明は超音波ワイヤボンデイング方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic wire bonding method.

周知の如く、IC、LSIの如く半導体部品にワイ
ヤボンデイングを施す超音波ワイヤボンデイング
装置は、第１図に示すようにホーン１の先端に取
付けられたツール２の先端にはワイヤ３が挿通さ
れる傾斜した案内孔２ａが設けられ、この案内孔
２ａの近傍にはワイヤ３をクランプするクランパ
ー４が設けられている。またホーン１にもワイヤ
リール（図示せず）から供給されるワイヤ３を案
内する案内孔１ａが設けられ、ワイヤ３は案内孔
１ａ、クランパー４、案内孔２ａを通してツール
２の先端下面２ｂに案内されるようになつてい
る。 As is well known, in an ultrasonic wire bonding device that performs wire bonding on semiconductor components such as ICs and LSIs, a wire 3 is inserted through the tip of a tool 2 attached to the tip of a horn 1, as shown in FIG. An inclined guide hole 2a is provided, and a clamper 4 for clamping the wire 3 is provided near the guide hole 2a. Further, the horn 1 is also provided with a guide hole 1a for guiding a wire 3 supplied from a wire reel (not shown), and the wire 3 is guided to the lower surface 2b of the tip of the tool 2 through the guide hole 1a, the clamper 4, and the guide hole 2a. It is becoming more and more common.

このような装置でボンデイングを行なうには、
試料５を試料位置決め台６に位置決めし、試料５
の第１ボンデイング点５ａにワイヤ３の先端をボ
ンデイングし、次にホーン１及びクランパー４が
次の第２ボンデイング点５ｂ上に移動し、この点
にボンデイングする。そして、クランパー４によ
りワイヤ３をクランプし、クランパー４をツール
２から遠ざかる方向でワイヤの挿通方向に沿つて
移動してワイヤ３をツール先端下面２ｂの端部よ
り切断する。このようにして一対の相互に接続さ
れる２つのボンデイング点がワイヤにより接続さ
れる。また次の一対のボンデイング点をボンデイ
ングするために、クランパー４をワイヤの挿通方
向に沿つてツール２の方向に移動させ、ツール２
の先端下面２ｂにワイヤ３を繰り出す。 To perform bonding with such equipment,
Position the sample 5 on the sample positioning table 6, and
The tip of the wire 3 is bonded to the first bonding point 5a, and then the horn 1 and clamper 4 are moved to the next second bonding point 5b and bonded to this point. Then, the wire 3 is clamped by the clamper 4, and the clamper 4 is moved along the wire insertion direction in a direction away from the tool 2 to cut the wire 3 from the end of the lower surface 2b of the tool tip. In this way, a pair of two mutually connected bonding points are connected by a wire. Further, in order to bond the next pair of bonding points, the clamper 4 is moved in the direction of the tool 2 along the wire insertion direction, and the clamper 4 is moved toward the tool 2 along the wire insertion direction.
The wire 3 is fed out onto the lower surface 2b of the tip.

さて、かかる超音波ワイヤボンデイング方法に
おいては、一般にワイヤ３の挿通方向が水平に対
して30゜になるように、ホーン１の案内孔１ａ及
びツール２の案内孔２ａがそれぞれ30゜をなす30゜
用ホーン１及び30゜用ツール２を用い、ワイヤ切
断及びツール先端下面２ｂへのワイヤ繰り出しは
クランパー４を水平に対して30゜方向に移動させ
て行なつている。しかしながら、第２図に示すよ
うに外周が突出しボンデイング点７ａ，７ｂが凹
部にある試料をボンデイングする場合は、前記し
たような傾斜角の小さい30゜用ホーン１、30゜用ツ
ール２では、ワイヤ３が試料７の突出部７ｃに当
接しボンデイングできない。そこで、かかる試料
７には、第３図に示すようにワイヤ３の挿通方向
が60゜になるように60゜の案内孔１１ａを設けた60゜
用ホーン１１及び60゜の案内孔１２ａを設けた60゜
用ツール１２を用い、クランパー４を60゜方向に
移動させてワイヤ切断及びワイヤ繰り出しを行な
つている。しかし、かかる60゜用ツール１２を用
いると、ワイヤ３をクランパー４でツール１２の
先端下面に繰り出す時に、第４図に示すようにワ
イヤ３の先端が試料７に当り、ワイヤ３のテール
（ツール１２の先端下面１２ｂより突出したワイ
ヤ長さ）がバラツク欠点がある。このようにテー
ルがバラツクとテールを長めに設定しなければな
らなく、テールが長くなると試料７上の他の配線
とシヨートする問題があつた。 Now, in such an ultrasonic wire bonding method, generally the guide hole 1a of the horn 1 and the guide hole 2a of the tool 2 are angled at 30 degrees so that the insertion direction of the wire 3 is at an angle of 30 degrees with respect to the horizontal. Cutting the wire and feeding the wire to the lower surface 2b of the tip of the tool are carried out by moving the clamper 4 in the direction of 30 degrees with respect to the horizontal. However, when bonding a sample whose outer periphery protrudes and the bonding points 7a and 7b are in recesses as shown in FIG. 3 comes into contact with the protrusion 7c of the sample 7, and bonding cannot be performed. Therefore, as shown in FIG. 3, this sample 7 is provided with a 60° horn 11 with a 60° guide hole 11a and a 60° guide hole 12a so that the wire 3 is inserted in the 60° direction. Using the 60° tool 12, the clamper 4 is moved in the 60° direction to cut the wire and feed out the wire. However, when such a 60° tool 12 is used, when the wire 3 is fed out to the lower surface of the tip of the tool 12 with the clamper 4, the tip of the wire 3 hits the sample 7 as shown in FIG. There is a drawback that the length of the wire protruding from the lower surface 12b of the tip of the wire 12 varies. In this way, the tail had to be set to be long because of the variation in the tail, and when the tail became long, there was a problem that it would shoot with other wiring on the sample 7.

本発明は上記従来技術の欠点を除去した超音波
ワイヤボンデイング方法を提供することを目的と
する。 SUMMARY OF THE INVENTION An object of the present invention is to provide an ultrasonic wire bonding method that eliminates the drawbacks of the prior art described above.

以下、本発明を図示の実施例により説明する。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.

第５図は本発明の方法の一実施例を示す説明図
である。本発明は、ホーンとしては60゜用ホーン
１１を、ツールとしては30゜用ツール２を用い、
ワイヤ３を前記の如く切断及びツール２の先端下
面２ｂに繰り出す時はクランパー４を30゜方向に
移動させて行なうことを特徴とする。 FIG. 5 is an explanatory diagram showing an embodiment of the method of the present invention. The present invention uses a 60° horn 11 as a horn, a 30° tool 2 as a tool,
The wire 3 is cut as described above and fed out onto the lower surface 2b of the tip of the tool 2 by moving the clamper 4 in the 30° direction.

このように、ツール２は30゜用であるので、ツ
ール先端下面２ｂにクランパー４で繰り出された
ワイヤ３のテールが安定し、またホーン１１は
60゜用であるので、外周が突出した試料７にも問
題なくボンデイングできる。またクランパー４を
30゜方向に移動させてワイヤ切断及び繰り出しを
行なうことにより、ツール２の案内孔２ａの後端
２ｃとワイヤ３との摩擦によるワイヤ３への傷は
防止される。 In this way, since the tool 2 is for 30 degrees, the tail of the wire 3 fed out by the clamper 4 is stabilized on the lower surface 2b of the tool tip, and the horn 11 is
Since it is for 60°, it can be bonded to sample 7 with a protruding outer periphery without any problem. Also clamper 4
By cutting and feeding out the wire by moving it in the 30° direction, damage to the wire 3 due to friction between the wire 3 and the rear end 2c of the guide hole 2a of the tool 2 is prevented.

なお、上記実施例においては60゜の案内孔１１
ａを設けたホーン１１を用いた場合について説明
したが、第６図に示すようにワイヤ３がホーン１
１に60゜の角度で配設されるようにホーン１１の
軸線方向に沿つたスリツト１１ｂを設けてもよ
い。また、ツール２の案内孔２ａの傾斜角は30゜
に、またホーン１１の案内孔１１ａ又はスリツト
１１ｂに挿入されるワイヤ３の傾斜角は60゜に限
定されるものではなく、試料によつてツール２の
案内孔の傾斜角より大きな傾斜角でホーンの案内
孔又はスリツトにワイヤが配設されるようにホー
ンの案内孔又はスリツトを形成すればよい。 In addition, in the above embodiment, the 60° guide hole 11
Although the case where the horn 11 provided with the wire 3 is used has been described, as shown in FIG.
A slit 11b may be provided along the axial direction of the horn 11 so as to be disposed at an angle of 60 degrees to the horn 11. Furthermore, the inclination angle of the guide hole 2a of the tool 2 is not limited to 30 degrees, and the inclination angle of the wire 3 inserted into the guide hole 11a or slit 11b of the horn 11 is not limited to 60 degrees, but may vary depending on the sample. The guide hole or slit of the horn may be formed such that the wire is disposed in the guide hole or slit of the horn at an angle of inclination greater than the angle of inclination of the guide hole of the tool 2.

以上の説明から明らかな如く、本発明になる超
音波ワイヤボンデイング方法によれば、ツールの
案内孔の傾斜角より大きな傾斜角になるようにホ
ーンの案内孔又はスリツトにワイヤを配設してボ
ンデイングするので、外周が突出した試料におい
ても安定してボンデイングを行なうことができ
る。 As is clear from the above description, according to the ultrasonic wire bonding method of the present invention, bonding is performed by arranging the wire in the guide hole or slit of the horn so that the inclination angle is greater than the inclination angle of the guide hole of the tool. Therefore, even a sample with a protruding outer periphery can be bonded stably.

【図面の簡単な説明】[Brief explanation of the drawing]

図は超音波ワイヤボンデイング方法を示し、第
１図、第２図、第３図、第４図はそれぞれ従来例
の説明図、第５図は本発明の一実施例を示す説明
図、第６図は本発明の他の一実施例を示し、ａは
平面図、ｂは正面図である。 １，１１……ホーン、１ａ，１１ａ……案内
孔、２，１２……ツール、２ａ，１２ａ……案内
孔、２ｂ，１２ｂ……ツール先端下面、３……ワ
イヤ、４……クランパー、５，７……試料、５
ａ，５ｂ，７ａ，７ｂ……ボンデイング点。 The drawings show an ultrasonic wire bonding method, and FIG. 1, FIG. 2, FIG. 3, and FIG. 4 are explanatory diagrams of conventional examples, respectively. FIG. The figures show another embodiment of the present invention, in which a is a plan view and b is a front view. 1, 11... Horn, 1a, 11a... Guide hole, 2, 12... Tool, 2a, 12a... Guide hole, 2b, 12b... Lower surface of tool tip, 3... Wire, 4... Clamper, 5 ,7...Sample,5
a, 5b, 7a, 7b...bonding points.

Claims (1)

【特許請求の範囲】 １ ワイヤをホーンに設けた案内孔又はスリツ
ト、クランパー及びホーンの先端に設けたツール
の案内孔を通してツールの先端下面に案内し、試
料にワイヤをボンデイングする超音波ワイヤボン
デイング方法において、前記ツールの案内孔の後
端から前記ホーンの案内孔又はスリツトに伸びる
ワイヤの傾斜角を前記ツールの案内孔の傾斜角よ
り大きな傾斜角になるように配設してボンデイン
グし、クランパーを前記ツールの案内孔の傾斜角
とほぼ等しい傾斜角で上下動させてワイヤ切断及
びワイヤをツール先端下面に繰り出すことを特徴
とする超音波ワイヤボンデイング方法。 ２ ツールの案内孔の傾斜角は30゜で、ホーンの
案内孔又はスリツトに配設されたワイヤの傾斜角
は60゜であることを特徴とする特許請求の範囲第
１項記載の超音波ワイヤボンデイング方法。[Claims] 1. An ultrasonic wire bonding method in which the wire is guided to the lower surface of the tip of the tool through a guide hole or slit provided in the horn, a clamper, and a guide hole of the tool provided at the tip of the horn, and the wire is bonded to the sample. The wire extending from the rear end of the guide hole of the tool to the guide hole or slit of the horn is arranged and bonded so that the inclination angle of the wire is larger than the inclination angle of the guide hole of the tool, and the clamper is bonded. An ultrasonic wire bonding method characterized in that the wire is cut and the wire is fed out to the lower surface of the tip of the tool by moving the tool up and down at an inclination angle that is approximately equal to the inclination angle of a guide hole of the tool. 2. The ultrasonic wire according to claim 1, wherein the inclination angle of the guide hole of the tool is 30 degrees, and the inclination angle of the wire disposed in the guide hole or slit of the horn is 60 degrees. Bonding method.
JP14189779A 1979-11-01 1979-11-01 Ultrasonic wave wire bonding method Granted JPS5681946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14189779A JPS5681946A (en) 1979-11-01 1979-11-01 Ultrasonic wave wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14189779A JPS5681946A (en) 1979-11-01 1979-11-01 Ultrasonic wave wire bonding method

Publications (2)

Publication Number Publication Date
JPS5681946A JPS5681946A (en) 1981-07-04
JPS6318327B2 true JPS6318327B2 (en) 1988-04-18

Family

ID=15302701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14189779A Granted JPS5681946A (en) 1979-11-01 1979-11-01 Ultrasonic wave wire bonding method

Country Status (1)

Country Link
JP (1) JPS5681946A (en)

Also Published As

Publication number Publication date
JPS5681946A (en) 1981-07-04

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