JPS63182570U - - Google Patents
Info
- Publication number
- JPS63182570U JPS63182570U JP7489287U JP7489287U JPS63182570U JP S63182570 U JPS63182570 U JP S63182570U JP 7489287 U JP7489287 U JP 7489287U JP 7489287 U JP7489287 U JP 7489287U JP S63182570 U JPS63182570 U JP S63182570U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- component mounting
- circuit board
- based circuit
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489287U JPS63182570U (US20030220297A1-20031127-C00074.png) | 1987-05-19 | 1987-05-19 | |
| US07/406,401 US4993148A (en) | 1987-05-19 | 1989-09-12 | Method of manufacturing a circuit board |
| US07/540,389 US5081562A (en) | 1987-05-19 | 1990-06-19 | Circuit board with high heat dissipations characteristic |
| US07/794,281 US5173844A (en) | 1987-05-19 | 1991-11-19 | Integrated circuit device having a metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489287U JPS63182570U (US20030220297A1-20031127-C00074.png) | 1987-05-19 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182570U true JPS63182570U (US20030220297A1-20031127-C00074.png) | 1988-11-24 |
Family
ID=30920533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7489287U Pending JPS63182570U (US20030220297A1-20031127-C00074.png) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182570U (US20030220297A1-20031127-C00074.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013041633A (ja) * | 2011-08-11 | 2013-02-28 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法 |
-
1987
- 1987-05-19 JP JP7489287U patent/JPS63182570U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013041633A (ja) * | 2011-08-11 | 2013-02-28 | Dainippon Printing Co Ltd | サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法 |
