JPS63181491A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JPS63181491A JPS63181491A JP1466487A JP1466487A JPS63181491A JP S63181491 A JPS63181491 A JP S63181491A JP 1466487 A JP1466487 A JP 1466487A JP 1466487 A JP1466487 A JP 1466487A JP S63181491 A JPS63181491 A JP S63181491A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor laser
- laser element
- monitor light
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体レーザ素子との固定を金属により行い
、かつ半導体レーザ素子のモニタ光を効率良く受光素子
に結合させることを目的としたヒートシンクに関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat sink that is fixed to a semiconductor laser element using metal and is intended to efficiently couple monitor light from the semiconductor laser element to a light receiving element. It is.
従来の技術
最近、半導体レーザ素子を搭載するためのヒートシンク
は、光通信等の分野で盛んに利用されるようになってき
た。このヒートシンクは、例えば、特開昭５９−９８５
６８号公報に記載されている構成が知られている。BACKGROUND OF THE INVENTION Recently, heat sinks for mounting semiconductor laser elements have been widely used in fields such as optical communications. This heat sink is, for example, JP-A-59-985
A configuration described in Japanese Patent No. 68 is known.
以下、第３図を参照して、従来のヒートシンクについて
説明する。第３図において、１はヒートシンク、２は半
導体レーザ素子、３はこの半導体レーザ素子２の活性領
域、４は負極印加用ワイヤ、５は正極印加用ワイヤであ
る。半導体レーザ素子２を固定する方法には、半導体レ
ーザ素子２の活性領域３が固定部分に近いアップサイド
ダウン方法と、活性領域３が固定部分から遠くなるアン
プサイドアップ方法の三方法がある。通常半導体レーザ
素子２の固定には、パッケージの接地を考慮して、アッ
プサイドアップ方法が採用されていた。Hereinafter, a conventional heat sink will be explained with reference to FIG. In FIG. 3, 1 is a heat sink, 2 is a semiconductor laser element, 3 is an active region of this semiconductor laser element 2, 4 is a negative electrode application wire, and 5 is a positive electrode application wire. There are three methods for fixing the semiconductor laser device 2: an upside-down method in which the active region 3 of the semiconductor laser device 2 is close to the fixed portion, and an amplifier side-up method in which the active region 3 is far from the fixed portion. Normally, an upside-up method has been adopted for fixing the semiconductor laser element 2 in consideration of the grounding of the package.
発明が解決しようとする問題点
しかし、上述のアップサイドアップ方法では、半導体レ
ーザ素子２の活性領域３が、ヒートシンク１の上面の近
傍に位置しているため、半導体レーザ素子２の後方から
出射されるモニタ光は、ヒートシンク１の上面で反射さ
れて、受光素子への良好な結合が得られず、半導体レー
ザ素子２の安定動作ができないという問題が生じていた
。Problems to be Solved by the Invention However, in the upside-up method described above, since the active region 3 of the semiconductor laser device 2 is located near the top surface of the heat sink 1, the light is emitted from the rear of the semiconductor laser device 2. The monitor light is reflected by the upper surface of the heat sink 1, and good coupling to the light receiving element cannot be obtained, resulting in a problem that stable operation of the semiconductor laser element 2 cannot be achieved.
本発明は、上記問題を解決するもので、半導体レーザの
安定な金属固定を可能とするとともに、半導体レーザ素
子のモニタ光を高効率で受光素子に結合させることを可
能とするヒートシンクを提供することを目的とするもの
である。The present invention solves the above problems, and provides a heat sink that enables stable metal fixation of a semiconductor laser and also enables highly efficient coupling of monitor light from a semiconductor laser element to a light receiving element. The purpose is to
問題点を解決するための手段
この問題点を解決するために本発明は、全ての面に金属
層を有し、かつ半導体レーザ素子の固定面に傾斜部を設
けたものである。Means for Solving the Problem In order to solve this problem, the present invention has a metal layer on all surfaces and a sloped portion on the fixed surface of the semiconductor laser element.
作 用
半導体レーザ素子の固定に、前記ヒートシンクを用いる
ことにより、前記半導体レーザ素子の安定な金属固定が
可能であり、同時に、前記半導体レーザ素子のモニタ光
を前記受光素子に高効率で結合させることを可能となる
ものである。By using the heat sink to fix the semiconductor laser element, the semiconductor laser element can be stably fixed to metal, and at the same time, the monitor light of the semiconductor laser element can be coupled with high efficiency to the light receiving element. This makes it possible to
実施例
以下、本発明の一実施例を図面に基づき説明する。第１
図は斜視図であり、第２図は側面図である。図において
、１１はヒートシンク、１２は傾斜部、１３は半導体レ
ーザ素子、１４は半導体レーザ素子の活性領域、１５は
負極用ワイヤ、１６は正極用ワイヤである。ヒートシン
ク１１には、全面にＴｉ、Ｎｉ蒸着後、ノ・ンダメッキ
が施こされておシ、半導体レーザ素子１３とヒートシン
ク１１の固定は、金属（ハンダ）により実施している。EXAMPLE Hereinafter, an example of the present invention will be described based on the drawings. 1st
The figure is a perspective view, and FIG. 2 is a side view. In the figure, 11 is a heat sink, 12 is an inclined portion, 13 is a semiconductor laser element, 14 is an active region of the semiconductor laser element, 15 is a negative electrode wire, and 16 is a positive electrode wire. The entire surface of the heat sink 11 is subjected to Ti and Ni vapor deposition, followed by solder plating, and the semiconductor laser element 13 and the heat sink 11 are fixed with metal (solder).
さらに、ヒートシンク１１の半導体レーザ素子１３の固
定面には、傾斜部１２があり、半導体レーザ素子１３の
後方モニタ光が、ヒートシンク１１に反射されることな
く後方に取り出せる構成になっている。ヒートシンク１
１の傾斜部１２の傾斜角は、半導体レーザ素子１３の遠
視野像測定により決定されるが、実験によシ傾斜角θは
、１５度以上であれば、モニタ光と受光素子との良好な
結合が得られている。本実施例では、ヒートシンク１１
は、低抵抗のシリコンを使用したが、他に熱伝導率の高
い材質であればよい。また、ヒートシンク１１は全ての
面にハンダメッキが施こされているが、上面、下面及び
側面の３面以上であれば問題ない。Further, the surface of the heat sink 11 on which the semiconductor laser element 13 is fixed has an inclined part 12, so that the rear monitor light of the semiconductor laser element 13 can be taken out to the rear without being reflected by the heat sink 11. heat sink 1
The inclination angle of the inclination part 12 of No. 1 is determined by far-field image measurement of the semiconductor laser element 13, but according to experiments, if the inclination angle θ is 15 degrees or more, good communication between the monitor light and the light receiving element is achieved. A bond is obtained. In this embodiment, the heat sink 11
Although low-resistance silicon was used, any other material with high thermal conductivity may be used. Further, although all surfaces of the heat sink 11 are solder plated, there is no problem as long as the three or more surfaces of the top surface, bottom surface, and side surfaces are used.
発明の効果
以上のよ、うに、本発明によれば、半導体レーザ素子の
安定な金属固定ができるだけでなく、半導体レーザ素子
の後方モニタ光を受光素子に高効率で結合できるヒート
シンクを提供することが可能となり、実用面での効果は
大である。Effects of the Invention As described above, according to the present invention, it is possible to provide a heat sink that can not only stably fix a semiconductor laser element to metal, but also can couple the rear monitor light of the semiconductor laser element to a light receiving element with high efficiency. This has become possible and has great practical effects.
第１図及び第２図はそれぞれ本発明の一実施例によるヒ
ートシンクを示す斜視図及び側面図、第３図は従来のヒ
ートシンクを示す斜視図である。
１１・・・・・・ヒートシンク、１２・・・・・・ｌｔ
ｌ＋部、１３・・・・半導体レーザ素子、１４・・・・
・・活性領域。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名ＴＩ
−ヒートシンク
Ｉ２−傾斜部
１３−半導体レーザ素子
Ｉ４−５古 性４Ｉｌｒｌｉ
第１図
第２図 １３1 and 2 are a perspective view and a side view, respectively, of a heat sink according to an embodiment of the present invention, and FIG. 3 is a perspective view of a conventional heat sink. 11...Heat sink, 12...lt
l+ part, 13... semiconductor laser element, 14...
...Active region. Name of agent: Patent attorney Toshio Nakao and one other TI
- Heat sink I2 - Inclined part 13 - Semiconductor laser element I4-5 Oldness 4Ilrli Fig. 1 Fig. 2 13
Claims (1)
らに半導体レーザ素子の固定面に傾斜部を設けたことを
特徴とするヒートシンク。A heat sink having high thermal conductivity, having a metal layer formed on all surfaces, and further having an inclined portion on the surface on which a semiconductor laser element is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466487A JPS63181491A (en) | 1987-01-23 | 1987-01-23 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1466487A JPS63181491A (en) | 1987-01-23 | 1987-01-23 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63181491A true JPS63181491A (en) | 1988-07-26 |
Family
ID=11867480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1466487A Pending JPS63181491A (en) | 1987-01-23 | 1987-01-23 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63181491A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0766355A1 (en) * | 1995-09-29 | 1997-04-02 | Siemens Aktiengesellschaft | Method of mounting a semiconductor laser device |
-
1987
- 1987-01-23 JP JP1466487A patent/JPS63181491A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0766355A1 (en) * | 1995-09-29 | 1997-04-02 | Siemens Aktiengesellschaft | Method of mounting a semiconductor laser device |
| US5943553A (en) * | 1995-09-29 | 1999-08-24 | Siemens Aktiengesellschaft | Applying semiconductor laser mirror layers after securing support plate to laser body |
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