JPS63180964U - - Google Patents

Info

Publication number
JPS63180964U
JPS63180964U JP7248587U JP7248587U JPS63180964U JP S63180964 U JPS63180964 U JP S63180964U JP 7248587 U JP7248587 U JP 7248587U JP 7248587 U JP7248587 U JP 7248587U JP S63180964 U JPS63180964 U JP S63180964U
Authority
JP
Japan
Prior art keywords
branch
pattern
wiring pattern
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7248587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7248587U priority Critical patent/JPS63180964U/ja
Publication of JPS63180964U publication Critical patent/JPS63180964U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に係る高密度プリン
ト基板の要部を示す平面図である。また、第2図
は従来の高密度プリント基板の要部を示す平面図
である。 1:配線パターン、2:分岐パターン、3:接
続ランド部、4:分岐点、5:垂直部、6:水平
部、7:接続点。
FIG. 1 is a plan view showing the main parts of a high-density printed circuit board according to an embodiment of the present invention. Further, FIG. 2 is a plan view showing the main parts of a conventional high-density printed circuit board. 1: Wiring pattern, 2: Branch pattern, 3: Connection land portion, 4: Branch point, 5: Vertical portion, 6: Horizontal portion, 7: Connection point.

Claims (1)

【実用新案登録請求の範囲】 配線パターンと、該配線パターンから分岐した
分岐パターンと、該分岐パターンと接続する接続
ランド部とを備えた高密度プリント基板において
、 上記分岐パターンを、上記配線パターンの分岐
点と上記接続ランド部の接続点の間で屈曲させ略
L字形状に形成したことを特徴とする高密度プリ
ント基板。
[Claims for Utility Model Registration] A high-density printed circuit board comprising a wiring pattern, a branch pattern branched from the wiring pattern, and a connection land portion connected to the branch pattern, wherein the branch pattern is connected to the wiring pattern. A high-density printed circuit board, characterized in that it is bent into a substantially L-shape between a branch point and a connection point of the connection land portion.
JP7248587U 1987-05-15 1987-05-15 Pending JPS63180964U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7248587U JPS63180964U (en) 1987-05-15 1987-05-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7248587U JPS63180964U (en) 1987-05-15 1987-05-15

Publications (1)

Publication Number Publication Date
JPS63180964U true JPS63180964U (en) 1988-11-22

Family

ID=30915973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7248587U Pending JPS63180964U (en) 1987-05-15 1987-05-15

Country Status (1)

Country Link
JP (1) JPS63180964U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652164U (en) * 1992-12-17 1994-07-15 矢崎総業株式会社 Wiring sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652164U (en) * 1992-12-17 1994-07-15 矢崎総業株式会社 Wiring sheet

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