JPS63180936U - - Google Patents
Info
- Publication number
- JPS63180936U JPS63180936U JP7211987U JP7211987U JPS63180936U JP S63180936 U JPS63180936 U JP S63180936U JP 7211987 U JP7211987 U JP 7211987U JP 7211987 U JP7211987 U JP 7211987U JP S63180936 U JPS63180936 U JP S63180936U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- substrate
- electronic device
- applying
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000003449 preventive effect Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案一実施例の部分断面側面図、第
２図は同じく組立て時の平面図、第３図は従来例
の部分断面側面図である。 １……基板、２……リード端子、５……リード
レス電解コンデンサ、６……半導体ＩＣ、７……
モールド樹脂剤。
２図は同じく組立て時の平面図、第３図は従来例
の部分断面側面図である。 １……基板、２……リード端子、５……リード
レス電解コンデンサ、６……半導体ＩＣ、７……
モールド樹脂剤。
Claims (1)
- 基板に電子デバイスを搭載して成り、かつ所定
電子デバイスの必要部分および基板の端部を選択
して、モールドされない塗布防止剤を塗布してモ
ールドを行つた混成集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7211987U JPS63180936U (ja) | 1987-05-14 | 1987-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7211987U JPS63180936U (ja) | 1987-05-14 | 1987-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63180936U true JPS63180936U (ja) | 1988-11-22 |
Family
ID=30915291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7211987U Pending JPS63180936U (ja) | 1987-05-14 | 1987-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63180936U (ja) |
-
1987
- 1987-05-14 JP JP7211987U patent/JPS63180936U/ja active Pending
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