JPS63179554A - Resin seal type semiconductor device - Google Patents
Resin seal type semiconductor deviceInfo
- Publication number
- JPS63179554A JPS63179554A JP1271487A JP1271487A JPS63179554A JP S63179554 A JPS63179554 A JP S63179554A JP 1271487 A JP1271487 A JP 1271487A JP 1271487 A JP1271487 A JP 1271487A JP S63179554 A JPS63179554 A JP S63179554A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- package
- moisture
- semiconductor device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 34
- 229920005989 resin Polymers 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 229920001721 polyimide Polymers 0.000 claims abstract description 7
- 239000009719 polyimide resin Substances 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 17
- 230000006866 deterioration Effects 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は表面実装用樹脂封止型半導体装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a resin-sealed semiconductor device for surface mounting.
〈従来の技術〉
近年、電子機器の小型、薄型、軽量、高密度化に伴って
、ICパッケージに対しても、小型化、薄型化、多ピン
化、高密度実装の要求が高まり、従来の基板挿入型のD
IP (デ、エアルΦインライ、ンーパッケージ)に比
べて、表面実装型のFP(フラット・パッケージ)、5
OP(スモール・アウトライン・パッケージ)、PLC
C(プラスチック・リーデツド・チップ・キャリア)に
対する要求が高まっている。表面実装型パッケージの問
題点は、上記の要求から、薄型・小型になっているにも
かかわらず、基板実装方法として、ハンダ付けされるリ
ード部だけでなく、パッケージ全体も急激に加熱される
赤外線リフロー、ペーパーフェイズ・ソルダリング、つ
°エープ拳ソルダリングが多く採用されることであり、
品質・信頼性上の問題Ω発生する。ことがある。<Conventional technology> In recent years, as electronic devices have become smaller, thinner, lighter, and more densely packed, there has been an increasing demand for smaller, thinner, more pin-counted, and higher-density packaging for IC packages. Board insertion type D
Surface-mounted FP (flat package),5
OP (Small Outline Package), PLC
Demand for plastic leaded chip carriers (C) is increasing. The problem with surface mount packages is that although they have become thinner and smaller due to the above requirements, the board mounting method uses infrared rays, which rapidly heats up not only the soldered leads but also the entire package. Reflow, paper phase soldering, and double fist soldering are often used.
Quality/reliability problems occur. Sometimes.
具体的には、i) 実装時に生じるパッケージ・フクレ
(第2図(a) ) 、パッケージ・クラック(第2図
(b))、i() 耐湿特性の劣化である。K2図(
a) 、 (b)に於いて、1は半導体チップ、2はリ
ードフレーム、3はポンディングワブヤ、4はモールド
封止樹脂、5はパッケージ・フクレ、6はパッケージ−
クラックである。Specifically, these include i) package blistering (Fig. 2(a)), package cracking (Fig. 2(b)), and i() deterioration of moisture resistance characteristics that occur during mounting. K2 diagram (
In a) and (b), 1 is a semiconductor chip, 2 is a lead frame, 3 is a bonding wire, 4 is a mold sealing resin, 5 is a package bulge, and 6 is a package.
It's crack.
これらの現象は、パッケージ厚が薄くなる程、また、チ
ップサイズが大きくなる程、顕著であるが、それ以外に
パッケージの吸湿状態に大きく左右される。パッケージ
厚1.5(m)でも、乾燥後ではパッケージ・クラック
の発生や大きな耐湿性劣化は見られないが、ICメーカ
の生産後からユーザでの実装までの保管状態、保管期間
によっては、パッケージの吸湿量が大きくなり、クラッ
クやフクレの発生、及び耐湿性の大きな劣化が起こる。These phenomena become more pronounced as the package thickness becomes thinner and as the chip size becomes larger, but they are also greatly influenced by the moisture absorption state of the package. Even with a package thickness of 1.5 m, no package cracks or major deterioration in moisture resistance are observed after drying. The amount of moisture absorbed increases, causing cracks and blisters to occur, as well as a significant deterioration in moisture resistance.
すなわち、パッケージに吸収された水分が、接着性の劣
っている界面、特に、封止樹脂/リードフレームのアイ
ランド部界面に凝集し、実装時の高温により水蒸気化し
て、その圧力が、パッケージ・フクレ、パッケージ・ク
ラックの発生、及びチップ表面/封止樹脂界面の剥離に
よる耐湿性劣化を11き起こす。In other words, moisture absorbed by the package condenses at interfaces with poor adhesion, especially at the interface between the sealing resin and the island portion of the lead frame, and is converted to water vapor by the high temperature during mounting, causing the pressure to bulge on the package. This causes package cracks and deterioration of moisture resistance due to peeling of the chip surface/sealing resin interface.
そのため、工Cメーカでは、パッケージ厚の増大化、パ
ッケージの乾燥後の防湿梱包出荷等、また、ユーザでは
、実装前の乾燥、リフロ一温度の低温化等の対策を実施
している。For this reason, manufacturers are taking measures such as increasing the thickness of the package and shipping the package in moisture-proof packaging after drying, while users are taking measures such as drying the package before mounting and lowering the reflow temperature.
〈発明が解決しようとする問題点〉
しかしながら、上記従来の方法では、コストアップ、実
装マージンの低下及び製品管理上のトラブル発生の懸念
等の問題がある。<Problems to be Solved by the Invention> However, the above-mentioned conventional method has problems such as increased costs, reduced mounting margins, and concerns about the occurrence of troubles in product management.
本発明は、これらの問題点を根本的に解決するために、
パッケージに吸収された水分が凝集する界面を存在させ
ないことにより、表面実装型パッケージのハンダ耐熱性
を大きく向上させたものである。The present invention fundamentally solves these problems by:
By eliminating the presence of interfaces where moisture absorbed by the package condenses, the solder heat resistance of surface mount packages is greatly improved.
〈問題点を解決するだめの手段〉
封止樹脂中及び封止樹脂/リード界面を通して吸収され
た水分は、接着性の劣っている封止樹脂/アイランド部
界面に凝集し、実装時のハンダ付は温度により、凝集し
た水分が水蒸気化して、パッケージ・クラック、耐湿性
劣化等を引き起こすことから、解決のポイントは封止樹
脂/アイランド部界面の接着性改善にある。<Means to solve the problem> Moisture absorbed in the encapsulating resin and through the encapsulating resin/lead interface condenses at the encapsulating resin/island interface, which has poor adhesion, and causes soldering during mounting. The key to solving this problem is to improve the adhesion of the sealing resin/island interface because the condensed water vaporizes due to temperature, causing package cracks and deterioration of moisture resistance.
しかし、樹脂封止方法としては、はとんどトランスフ1
−モールド成形が用いられていることから、封止樹脂中
には内部離型剤が含まれており、基本的にリードフレー
ム材料(4270イ等)との接着性が悪くなる。これに
対して、種々の封止樹脂の改良や、アイランド部裏面の
ディンプル加工等のり−−ドフレームに対する工夫が行
なわれてきたが、充分な効果は得られていない。However, the most popular resin sealing method is Transfer 1.
- Since molding is used, the sealing resin contains an internal mold release agent, which basically deteriorates the adhesion to the lead frame material (4270 etc.). In response to this, various improvements have been made to the glued frame, such as improving the sealing resin and forming dimples on the back surface of the island portion, but no sufficient effects have been obtained.
本発明は、封止樹脂及びリードフレームの両方と良好な
接着性を有する樹脂材料を封止樹脂/アイランド部間に
界在させることによってパッケージに吸収された水分の
凝集する界面を存在させない目的を達成するものである
。The present invention has the object of preventing the presence of an interface where moisture absorbed into the package would aggregate by interposing a resin material that has good adhesion to both the sealing resin and the lead frame between the sealing resin and the island portion. It is something to be achieved.
すなわち、本発明の樹脂封止型半導体装置は、半導体チ
ップがリードフレームにマウントされ、樹脂封止された
半導体装置に於いて、上記半導体チップのマウントされ
た上記リードフレームのアイランド部のマウント面と反
対面に、封止樹脂及び上記リードフレームの両方と良好
な接着性を有するコーティング樹脂被膜を形成したこと
を特徴とするものである。さらに、上記コーティング樹
脂材料としてポリイミド系樹脂を用いたことを特徴とす
るものである。That is, in the resin-sealed semiconductor device of the present invention, a semiconductor chip is mounted on a lead frame, and in a resin-sealed semiconductor device, the mounting surface of the island portion of the lead frame on which the semiconductor chip is mounted is A coating resin film having good adhesion to both the sealing resin and the lead frame is formed on the opposite surface. Furthermore, the present invention is characterized in that a polyimide resin is used as the coating resin material.
〈実施例〉 以y1本発明を実施例により説明する。<Example> The present invention will now be described with reference to Examples.
第3図は本発明の詳細な説明するための従来の樹脂封止
型半導体装置の断面図である。この装置では、封止樹脂
4とアイランド部21の界面7に、吸収された水分が凝
集し、ハンダ耐熱性が大きく低下する。FIG. 3 is a sectional view of a conventional resin-sealed semiconductor device for explaining the present invention in detail. In this device, absorbed moisture aggregates at the interface 7 between the sealing resin 4 and the island portion 21, and the solder heat resistance is greatly reduced.
次に、本発明の実施例を第1図に示す。Next, an embodiment of the present invention is shown in FIG.
封止樹脂4とアイランド部21の間に、封止樹脂材料と
は異なる樹脂材料のコーティング被膜8が形成されてい
る。このコーティング樹脂被膜8は、封止樹脂4及びア
イランド部21と良好な接着性を有するものであり、ポ
リイミド系樹脂が適している。ポリイミド系樹脂膜の形
成方法としては、例えば、半導体チップがマウントされ
、ワイヤボンドされたリードフレームのアイランド部裏
面に、低粘度のポリイミド系樹脂をドロッピングでコー
ティングし、硬化する方法があり、10〜50(μm)
の樹脂被膜を形成することができる。これによって、パ
ッケージが吸湿しても、Zイランド部裏面に水分が凝集
しないので、ハンダ付は時のケージ・クラック等の発生
や、耐湿性劣化のない高信頼性パッケージを提供できる
。A coating film 8 made of a resin material different from the sealing resin material is formed between the sealing resin 4 and the island portion 21 . This coating resin film 8 has good adhesion to the sealing resin 4 and the island portion 21, and is suitably made of polyimide resin. As a method for forming a polyimide resin film, for example, there is a method in which a low viscosity polyimide resin is coated by dropping on the back surface of an island part of a lead frame on which a semiconductor chip is mounted and wire bonded, and then cured. 50 (μm)
It is possible to form a resin film of. As a result, even if the package absorbs moisture, the moisture does not condense on the back surface of the Z-land portion, so it is possible to provide a highly reliable package that does not cause cage cracks or the like during soldering or deterioration of moisture resistance.
本発明による実施例の具体的効果を以下の表に示す。The specific effects of the examples according to the present invention are shown in the table below.
(注)■ パッケージ:48ピンQFP(10X10X
1.45m)
■ チップ :耐湿性評価用TEG
(3,42X3.98■)
■ 吸湿条件 :85℃/85%RH・72時間■ ハ
ンダディップ条件:260℃1110秒 全体浸漬
■ PCT条件=121℃/100%RH〈発明の効果
〉
以上詳細に説明したように、本発明によれば、高品質・
高信頼性の樹脂封止型半導体装置を提供することができ
るものである。(Note) ■ Package: 48-pin QFP (10X10X
1.45m) ■ Chip: TEG for moisture resistance evaluation (3,42X3.98■) ■ Moisture absorption conditions: 85℃/85%RH, 72 hours ■ Solder dipping conditions: 260℃ 1110 seconds Whole immersion ■ PCT conditions = 121℃ /100%RH〈Effect of the invention〉 As explained in detail above, according to the present invention, high quality and
A highly reliable resin-sealed semiconductor device can be provided.
第1図は本発明の実施例を示す樹脂封止型半導体装置の
断面図、第2図(a)、(b)は従来の樹脂封止型半導
体装置におけるハンダ実装時に発生するパッケージ・フ
クレ、パッケージ・クラックを示す断面図、第3図は従
来の樹脂封止型半導体装置の断面図である。
図中、1は半導体チップ、2はリードフレーム、21は
リードフレームのアイランド部、3はポンディングワイ
ヤ、4はモールド封止樹脂、5はハンダ実装時に発生し
たパッケージ・フクレ、6はハンダ実装時に発生したパ
ッケージ・クラック、7は封止樹脂/リードフレーム・
アイランド部の界面、8はアイランド部裏面にコーティ
ングされたポリイミド系樹脂被膜である。FIG. 1 is a sectional view of a resin-sealed semiconductor device showing an embodiment of the present invention, and FIGS. 2(a) and 2(b) show package blisters that occur during solder mounting in a conventional resin-sealed semiconductor device. FIG. 3 is a cross-sectional view showing a package crack, and FIG. 3 is a cross-sectional view of a conventional resin-sealed semiconductor device. In the figure, 1 is the semiconductor chip, 2 is the lead frame, 21 is the island part of the lead frame, 3 is the bonding wire, 4 is the mold sealing resin, 5 is the package blistering that occurs during solder mounting, and 6 is the case during solder mounting. The package crack that occurred, 7 is the sealing resin/lead frame.
The interface of the island portion, 8, is a polyimide resin film coated on the back surface of the island portion.
Claims (2)
樹脂封止された半導体装置に於いて、上記半導体チップ
のマウントされた上記リードフレームのアイランド部の
マウント面と反対面に、封止樹脂及び上記リードフレー
ムの両方と良好な接着性を有するコーティング樹脂被膜
を形成したことを特徴とする樹脂封止型半導体装置。(1) A semiconductor chip is mounted on a lead frame,
In a resin-sealed semiconductor device, a coating resin having good adhesion to both the sealing resin and the lead frame is applied to a surface opposite to the mounting surface of the island portion of the lead frame on which the semiconductor chip is mounted. A resin-sealed semiconductor device characterized by forming a film.
脂を用いたことを特徴とする、特許請求の範囲第(1)
項記載の樹脂封止型半導体装置。(2) Claim No. (1) characterized in that a polyimide resin is used as the coating resin material.
The resin-sealed semiconductor device described in 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1271487A JPS63179554A (en) | 1987-01-21 | 1987-01-21 | Resin seal type semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1271487A JPS63179554A (en) | 1987-01-21 | 1987-01-21 | Resin seal type semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63179554A true JPS63179554A (en) | 1988-07-23 |
Family
ID=11813096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1271487A Pending JPS63179554A (en) | 1987-01-21 | 1987-01-21 | Resin seal type semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63179554A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322465A (en) * | 1989-06-20 | 1991-01-30 | Sumitomo Bakelite Co Ltd | Resin-sealed semiconductor device |
US5434106A (en) * | 1989-12-22 | 1995-07-18 | Texas Instruments Incorporated | Integrated circuit device and method to prevent cracking during surface mount |
US7247576B2 (en) | 1998-03-20 | 2007-07-24 | Renesas Technology Corp. | Method of manufacturing a semiconductor device |
-
1987
- 1987-01-21 JP JP1271487A patent/JPS63179554A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322465A (en) * | 1989-06-20 | 1991-01-30 | Sumitomo Bakelite Co Ltd | Resin-sealed semiconductor device |
US5434106A (en) * | 1989-12-22 | 1995-07-18 | Texas Instruments Incorporated | Integrated circuit device and method to prevent cracking during surface mount |
US7247576B2 (en) | 1998-03-20 | 2007-07-24 | Renesas Technology Corp. | Method of manufacturing a semiconductor device |
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