JPS63177053U - - Google Patents
Info
- Publication number
- JPS63177053U JPS63177053U JP1987066302U JP6630287U JPS63177053U JP S63177053 U JPS63177053 U JP S63177053U JP 1987066302 U JP1987066302 U JP 1987066302U JP 6630287 U JP6630287 U JP 6630287U JP S63177053 U JPS63177053 U JP S63177053U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- functional unit
- circuit device
- unit block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987066302U JPS63177053U (enExample) | 1987-05-01 | 1987-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987066302U JPS63177053U (enExample) | 1987-05-01 | 1987-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63177053U true JPS63177053U (enExample) | 1988-11-16 |
Family
ID=30904183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987066302U Pending JPS63177053U (enExample) | 1987-05-01 | 1987-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177053U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998038680A1 (en) * | 1997-02-28 | 1998-09-03 | T.I.F. Co., Ltd. | Memory module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61294833A (ja) * | 1985-06-21 | 1986-12-25 | Nec Corp | 半導体集積回路 |
-
1987
- 1987-05-01 JP JP1987066302U patent/JPS63177053U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61294833A (ja) * | 1985-06-21 | 1986-12-25 | Nec Corp | 半導体集積回路 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998038680A1 (en) * | 1997-02-28 | 1998-09-03 | T.I.F. Co., Ltd. | Memory module |
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