JPS63177053U - - Google Patents

Info

Publication number
JPS63177053U
JPS63177053U JP1987066302U JP6630287U JPS63177053U JP S63177053 U JPS63177053 U JP S63177053U JP 1987066302 U JP1987066302 U JP 1987066302U JP 6630287 U JP6630287 U JP 6630287U JP S63177053 U JPS63177053 U JP S63177053U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
functional unit
circuit device
unit block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987066302U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987066302U priority Critical patent/JPS63177053U/ja
Publication of JPS63177053U publication Critical patent/JPS63177053U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP1987066302U 1987-05-01 1987-05-01 Pending JPS63177053U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987066302U JPS63177053U (enExample) 1987-05-01 1987-05-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987066302U JPS63177053U (enExample) 1987-05-01 1987-05-01

Publications (1)

Publication Number Publication Date
JPS63177053U true JPS63177053U (enExample) 1988-11-16

Family

ID=30904183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987066302U Pending JPS63177053U (enExample) 1987-05-01 1987-05-01

Country Status (1)

Country Link
JP (1) JPS63177053U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998038680A1 (en) * 1997-02-28 1998-09-03 T.I.F. Co., Ltd. Memory module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61294833A (ja) * 1985-06-21 1986-12-25 Nec Corp 半導体集積回路

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61294833A (ja) * 1985-06-21 1986-12-25 Nec Corp 半導体集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998038680A1 (en) * 1997-02-28 1998-09-03 T.I.F. Co., Ltd. Memory module

Similar Documents

Publication Publication Date Title
JPS63177053U (enExample)
JPH0221145B2 (enExample)
JPS6393645U (enExample)
JPS6384963U (enExample)
JPH0282647A (ja) 半導体集積回路およびその製造方法
JPS63291452A (ja) システム機能を備えた半導体集積回路装置
JPS601844A (ja) 半導体集積回路装置
JPS63187339U (enExample)
JPS60179042U (ja) ゲ−トアレイ半導体装置
JPH0475665B2 (enExample)
JP2702155B2 (ja) 半導体集積回路
JPH0328736U (enExample)
JPS6054334U (ja) 集積回路装置
JPS6282749U (enExample)
JPS6234434U (enExample)
JPH0485732U (enExample)
JPS6340896U (enExample)
JPS59167036A (ja) 半導体集積回路
JPS59159961U (ja) 半導体回路装置
JPS62134254U (enExample)
JPS6390844U (enExample)
JPH0338639U (enExample)
JPH0480068U (enExample)
JPS63128735U (enExample)
JPS6365239U (enExample)