JPS631750B2 - - Google Patents
Info
- Publication number
- JPS631750B2 JPS631750B2 JP54171732A JP17173279A JPS631750B2 JP S631750 B2 JPS631750 B2 JP S631750B2 JP 54171732 A JP54171732 A JP 54171732A JP 17173279 A JP17173279 A JP 17173279A JP S631750 B2 JPS631750 B2 JP S631750B2
- Authority
- JP
- Japan
- Prior art keywords
- ppm
- weight
- bonding
- gold
- element group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17173279A JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17173279A JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5696844A JPS5696844A (en) | 1981-08-05 |
| JPS631750B2 true JPS631750B2 (cg-RX-API-DMAC7.html) | 1988-01-13 |
Family
ID=15928645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17173279A Granted JPS5696844A (en) | 1979-12-29 | 1979-12-29 | Semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5696844A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2231336B (en) * | 1989-04-28 | 1993-09-22 | Tanaka Electronics Ind | Gold wire for the bonding of a semiconductor device |
| US5384089A (en) * | 1994-05-02 | 1995-01-24 | Diamond; Lawrence H. | Yellow karat gold casting alloys |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5251867A (en) * | 1975-10-23 | 1977-04-26 | Nec Corp | Bonding wire for semiconductor device |
| JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
-
1979
- 1979-12-29 JP JP17173279A patent/JPS5696844A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5696844A (en) | 1981-08-05 |