JPS6317251Y2 - - Google Patents

Info

Publication number
JPS6317251Y2
JPS6317251Y2 JP1981079283U JP7928381U JPS6317251Y2 JP S6317251 Y2 JPS6317251 Y2 JP S6317251Y2 JP 1981079283 U JP1981079283 U JP 1981079283U JP 7928381 U JP7928381 U JP 7928381U JP S6317251 Y2 JPS6317251 Y2 JP S6317251Y2
Authority
JP
Japan
Prior art keywords
pellet
solder
substrate
thin metal
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981079283U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57191046U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981079283U priority Critical patent/JPS6317251Y2/ja
Publication of JPS57191046U publication Critical patent/JPS57191046U/ja
Application granted granted Critical
Publication of JPS6317251Y2 publication Critical patent/JPS6317251Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1981079283U 1981-05-29 1981-05-29 Expired JPS6317251Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981079283U JPS6317251Y2 (enExample) 1981-05-29 1981-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981079283U JPS6317251Y2 (enExample) 1981-05-29 1981-05-29

Publications (2)

Publication Number Publication Date
JPS57191046U JPS57191046U (enExample) 1982-12-03
JPS6317251Y2 true JPS6317251Y2 (enExample) 1988-05-16

Family

ID=29874883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981079283U Expired JPS6317251Y2 (enExample) 1981-05-29 1981-05-29

Country Status (1)

Country Link
JP (1) JPS6317251Y2 (enExample)

Also Published As

Publication number Publication date
JPS57191046U (enExample) 1982-12-03

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