JPS63172129U - - Google Patents

Info

Publication number
JPS63172129U
JPS63172129U JP6563187U JP6563187U JPS63172129U JP S63172129 U JPS63172129 U JP S63172129U JP 6563187 U JP6563187 U JP 6563187U JP 6563187 U JP6563187 U JP 6563187U JP S63172129 U JPS63172129 U JP S63172129U
Authority
JP
Japan
Prior art keywords
semiconductor device
assembly apparatus
view
mounting
device assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6563187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6563187U priority Critical patent/JPS63172129U/ja
Publication of JPS63172129U publication Critical patent/JPS63172129U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP6563187U 1987-04-28 1987-04-28 Pending JPS63172129U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6563187U JPS63172129U (enrdf_load_stackoverflow) 1987-04-28 1987-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6563187U JPS63172129U (enrdf_load_stackoverflow) 1987-04-28 1987-04-28

Publications (1)

Publication Number Publication Date
JPS63172129U true JPS63172129U (enrdf_load_stackoverflow) 1988-11-09

Family

ID=30902884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6563187U Pending JPS63172129U (enrdf_load_stackoverflow) 1987-04-28 1987-04-28

Country Status (1)

Country Link
JP (1) JPS63172129U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330874A (en) * 1976-09-03 1978-03-23 Toshiba Corp Semiconductor element mounting device
JPS59117199A (ja) * 1982-12-23 1984-07-06 富士電機株式会社 光指示式実装機
JPS5948077B2 (ja) * 1980-07-08 1984-11-24 ジョン・ジンク・カンパニ− 熱交換器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330874A (en) * 1976-09-03 1978-03-23 Toshiba Corp Semiconductor element mounting device
JPS5948077B2 (ja) * 1980-07-08 1984-11-24 ジョン・ジンク・カンパニ− 熱交換器
JPS59117199A (ja) * 1982-12-23 1984-07-06 富士電機株式会社 光指示式実装機

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