JPH01161327U - - Google Patents

Info

Publication number
JPH01161327U
JPH01161327U JP5752688U JP5752688U JPH01161327U JP H01161327 U JPH01161327 U JP H01161327U JP 5752688 U JP5752688 U JP 5752688U JP 5752688 U JP5752688 U JP 5752688U JP H01161327 U JPH01161327 U JP H01161327U
Authority
JP
Japan
Prior art keywords
semiconductor chip
supports
glass
support member
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5752688U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5752688U priority Critical patent/JPH01161327U/ja
Publication of JPH01161327U publication Critical patent/JPH01161327U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP5752688U 1988-04-27 1988-04-27 Pending JPH01161327U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5752688U JPH01161327U (enrdf_load_stackoverflow) 1988-04-27 1988-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5752688U JPH01161327U (enrdf_load_stackoverflow) 1988-04-27 1988-04-27

Publications (1)

Publication Number Publication Date
JPH01161327U true JPH01161327U (enrdf_load_stackoverflow) 1989-11-09

Family

ID=31283377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5752688U Pending JPH01161327U (enrdf_load_stackoverflow) 1988-04-27 1988-04-27

Country Status (1)

Country Link
JP (1) JPH01161327U (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134942A (en) * 1979-04-09 1980-10-21 Fujitsu Ltd Manufacturing of semiconductor device
JPS57165476A (en) * 1981-04-06 1982-10-12 Sony Corp Bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55134942A (en) * 1979-04-09 1980-10-21 Fujitsu Ltd Manufacturing of semiconductor device
JPS57165476A (en) * 1981-04-06 1982-10-12 Sony Corp Bonding method

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