JPS57165476A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS57165476A
JPS57165476A JP56051597A JP5159781A JPS57165476A JP S57165476 A JPS57165476 A JP S57165476A JP 56051597 A JP56051597 A JP 56051597A JP 5159781 A JP5159781 A JP 5159781A JP S57165476 A JPS57165476 A JP S57165476A
Authority
JP
Japan
Prior art keywords
adhesive
photo
effect
light
adherend
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56051597A
Other languages
Japanese (ja)
Inventor
Yoshitomo Ueno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP56051597A priority Critical patent/JPS57165476A/en
Publication of JPS57165476A publication Critical patent/JPS57165476A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
    • B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To effect the firm bonding of an adherend to a substrate, by interposing an adhesive composed of a photo-setting resin containig a transparent or reflective mixture of microspheres between the adherend and the substrate, and irradiating the assembly externally with light, thereby surely curing the adhesive without heating.
CONSTITUTION: An adhesive is prepared by mixing, e.g. a photo-setting resin (preferably obtained by adding a photo-sensitizer such as benzophenone to an epoxy resin modified with an acrylate) with preferably 0.3W0.8wt% spherical glass beads 3 having the minimum diameter of 7μ, the maximum diameter of 50μ and average diameter of 20W25μ. The adhesive 2 is applied to a printed circuit board 1. An electrical part 4 is brought into contact with said adhesive 2 to effect the temporary fixing, and then firmly fixed to the board by curing the adhesive 2 with UV irradiation.
EFFECT: The incident light is refracted and irregularily reflected by the glass beads 3, and even the part shielded with the electrical part or the adhesive at the inner part are irradiated fully with the UV light to afford sufficiently high adhesive strength.
COPYRIGHT: (C)1982,JPO&Japio
JP56051597A 1981-04-06 1981-04-06 Bonding method Pending JPS57165476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56051597A JPS57165476A (en) 1981-04-06 1981-04-06 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56051597A JPS57165476A (en) 1981-04-06 1981-04-06 Bonding method

Publications (1)

Publication Number Publication Date
JPS57165476A true JPS57165476A (en) 1982-10-12

Family

ID=12891309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56051597A Pending JPS57165476A (en) 1981-04-06 1981-04-06 Bonding method

Country Status (1)

Country Link
JP (1) JPS57165476A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59202277A (en) * 1983-04-30 1984-11-16 Anritsu Corp Accurate fixation of components and adhesive therefor
JPS63146973A (en) * 1986-12-11 1988-06-18 Canon Inc Adhesive
JPS63128489U (en) * 1987-02-13 1988-08-23
JPS63270779A (en) * 1987-11-06 1988-11-08 Anritsu Corp Adhesive for precision parts fixing
US4801528A (en) * 1981-05-04 1989-01-31 Dentsply Research & Development Corporation Dental adhesive system
JPH01161327U (en) * 1988-04-27 1989-11-09
JPH03116637A (en) * 1989-08-24 1991-05-17 Thomson Consumer Electron Inc Cathode ray tube and yoke assembly and method of mounting deflecting yoke to cathode ray tube
US5065505A (en) * 1989-10-17 1991-11-19 Sharp Kabushiki Kaisha Method for connecting circuit boards
USRE35264E (en) * 1981-05-04 1996-06-04 Dentsply Research & Development Corp. Dental adhesive system

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801528A (en) * 1981-05-04 1989-01-31 Dentsply Research & Development Corporation Dental adhesive system
USRE35264E (en) * 1981-05-04 1996-06-04 Dentsply Research & Development Corp. Dental adhesive system
JPS59202277A (en) * 1983-04-30 1984-11-16 Anritsu Corp Accurate fixation of components and adhesive therefor
JPS6365236B2 (en) * 1983-04-30 1988-12-15
JPS63146973A (en) * 1986-12-11 1988-06-18 Canon Inc Adhesive
JPS63128489U (en) * 1987-02-13 1988-08-23
JPS63270779A (en) * 1987-11-06 1988-11-08 Anritsu Corp Adhesive for precision parts fixing
JPH0333755B2 (en) * 1987-11-06 1991-05-20 Anritsu Corp
JPH01161327U (en) * 1988-04-27 1989-11-09
JPH03116637A (en) * 1989-08-24 1991-05-17 Thomson Consumer Electron Inc Cathode ray tube and yoke assembly and method of mounting deflecting yoke to cathode ray tube
US5065505A (en) * 1989-10-17 1991-11-19 Sharp Kabushiki Kaisha Method for connecting circuit boards

Similar Documents

Publication Publication Date Title
ES8301149A1 (en) Article comprising silicone resin coated, methacrylate-primed substrate
JPS57165476A (en) Bonding method
GB2209168B (en) Curable compositions for adhesives
IN171639B (en)
AU589172B2 (en) Acrylate resin based adhesive compositions and their use for anchoring
DE3581063D1 (en) BY RADIATION OF CURABLE CELLULOSE VARNISH.
EP0276716A3 (en) Uv curable epoxy resin compositions with delayed cure
JPS5590445A (en) Laminated glass
KR870005044A (en) Long pot life two-component curing composition
DE3768737D1 (en) EXPOSURE DEVICE THROUGH CHARGED PARTICLES WITH AN OPTICALLY DEFORMABLE BEAM LIMIT.
JPS5524404A (en) Semiconductor light emitting device
EP0307919A3 (en) Resin composition curable with an active energy ray containing epoxy resin and monomer with ethylenically unsaturated bond
DE58908927D1 (en) Hardener combination for cationically polymerizable materials.
JPS5496541A (en) Photosensitive resin composition
EP0307923A3 (en) Resin composition curable with an active energy ray containing half-esterificated epoxy resin and monomer having ethylenically unsaturated bond
JPS57141470A (en) Uv ray-curable adhesive
JPS6475580A (en) Ultraviolet ray curable tacky tape or sheet
EP0127682A4 (en) Method of mounting electronic part.
JPS543135A (en) Adhesive composition
JPS51125200A (en) Curable resin composition
JPS554802A (en) Bulb
JPS5542245A (en) Production of optical fiber
JPS5539945A (en) Electronic equipment with solar battery
JPS5556676A (en) Manufacture of semiconductor light-emitting device
JPS57118792A (en) Preparation of immobilized enzyme used in non-aqueous reaction