JPS63170982U - - Google Patents
Info
- Publication number
- JPS63170982U JPS63170982U JP6243187U JP6243187U JPS63170982U JP S63170982 U JPS63170982 U JP S63170982U JP 6243187 U JP6243187 U JP 6243187U JP 6243187 U JP6243187 U JP 6243187U JP S63170982 U JPS63170982 U JP S63170982U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- connection part
- foil pattern
- cover coat
- end portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図ａ〜ｄはそれぞれこの考案の一実施例を
示す斜視図、第２図ａ，ｂは従来の構成を示す断
面図および斜視図、第３図ａ，ｂは第２図のもの
を外部の基板に接続したときの断面図および斜視
図である。
１……ベースフイルム、２……銅箔パターン、
３……端子列、４……カバーコート、５……接続
部、６……基板、７……リード線、８……半田付
。
Figures 1 a to d are perspective views showing one embodiment of this invention, Figures 2 a and b are sectional views and perspective views showing the conventional configuration, and Figures 3 a and b are the same as those in Figure 2. FIG. 4 is a cross-sectional view and a perspective view when connected to an external board. 1...Base film, 2...Copper foil pattern,
3... Terminal row, 4... Cover coat, 5... Connection section, 6... Board, 7... Lead wire, 8... Soldering.
Claims (1)
に並設し、該接続部を除く銅箔パターン上にカバ
ーコートを被着したフレキシブル基板において、
該カバーコートの端部を凹凸形状としたことを特
徴とするフレキシブル基板。 A flexible board in which a plurality of terminal rows are arranged in a straight line in a connection part of a copper foil pattern, and a cover coat is applied on the copper foil pattern except for the connection part,
A flexible substrate characterized in that the end portion of the cover coat has an uneven shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6243187U JPS63170982U (en) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6243187U JPS63170982U (en) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170982U true JPS63170982U (en) | 1988-11-07 |
Family
ID=30896701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6243187U Pending JPS63170982U (en) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170982U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311106A (en) * | 2004-04-22 | 2005-11-04 | Nitto Denko Corp | Wiring circuit board |
| JP2006066772A (en) * | 2004-08-30 | 2006-03-09 | Matsushita Electric Ind Co Ltd | Flexible printed-wiring board |
| JP2006190989A (en) * | 2005-01-06 | 2006-07-20 | Samsung Electronics Co Ltd | Carrier film, display device having the same, and its manufacturing method |
| JP2011253979A (en) * | 2010-06-03 | 2011-12-15 | Sumitomo Electric Printed Circuit Inc | Connecting structure of printed wiring board, wiring board connector and electronic device |
| JP2012093646A (en) * | 2010-10-28 | 2012-05-17 | Seiko Epson Corp | Electronic device and manufacturing method thereof |
| JP2014013638A (en) * | 2011-10-03 | 2014-01-23 | Dainippon Printing Co Ltd | Suspension flexure substrate |
-
1987
- 1987-04-24 JP JP6243187U patent/JPS63170982U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311106A (en) * | 2004-04-22 | 2005-11-04 | Nitto Denko Corp | Wiring circuit board |
| JP2006066772A (en) * | 2004-08-30 | 2006-03-09 | Matsushita Electric Ind Co Ltd | Flexible printed-wiring board |
| JP2006190989A (en) * | 2005-01-06 | 2006-07-20 | Samsung Electronics Co Ltd | Carrier film, display device having the same, and its manufacturing method |
| JP2011253979A (en) * | 2010-06-03 | 2011-12-15 | Sumitomo Electric Printed Circuit Inc | Connecting structure of printed wiring board, wiring board connector and electronic device |
| JP2012093646A (en) * | 2010-10-28 | 2012-05-17 | Seiko Epson Corp | Electronic device and manufacturing method thereof |
| JP2014013638A (en) * | 2011-10-03 | 2014-01-23 | Dainippon Printing Co Ltd | Suspension flexure substrate |