JPS6263979U - - Google Patents
Info
- Publication number
- JPS6263979U JPS6263979U JP1985155632U JP15563285U JPS6263979U JP S6263979 U JPS6263979 U JP S6263979U JP 1985155632 U JP1985155632 U JP 1985155632U JP 15563285 U JP15563285 U JP 15563285U JP S6263979 U JPS6263979 U JP S6263979U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- holding plate
- flexible substrate
- connection mechanism
- wire connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
Description
第１図〜第４図は本考案の実施例を示すもので
あり、第１図はモータの基板の一部におけるリー
ド線の接続機構を示す平面図、第２図はリード線
が固定された状態を示す平面図、第３図は第２図
の端面図、第４図は他の実施例を示す平面図、第
５図は従来のリード線の接続機構を示す平面図で
ある。
１１……基材、１２……フレキシブル基板、１
２ａ……押え板、１２ｂ……フツク、１３……導
体パターン、１３ａ……ランド部、１５……リー
ド線、Ａ，Ｂ……押え板の係止穴。
Figures 1 to 4 show examples of the present invention, with Figure 1 being a plan view showing a lead wire connection mechanism on a part of the motor board, and Figure 2 showing a structure in which the lead wires are fixed. 3 is an end view of FIG. 2, FIG. 4 is a plan view of another embodiment, and FIG. 5 is a plan view of a conventional lead wire connection mechanism. 11...Base material, 12...Flexible substrate, 1
2a... Holding plate, 12b... Hook, 13... Conductor pattern, 13a... Land portion, 15... Lead wire, A, B... Locking hole of holding plate.
Claims (1)
り、このフレキシブル基板上に形成された導体パ
ターンにリード線が半田付けされているリード線
の接続機構において、前記フレキシブル基板に押
え板が一体に延ばされており、この押え板が折曲
げられて、その先端が基板に固定され、前記リー
ド線がこの押え板によつて押えられていることを
特徴とするリード線の接続機構。 In a lead wire connection mechanism in which a flexible substrate is attached to the surface of a base material and a lead wire is soldered to a conductor pattern formed on the flexible substrate, a holding plate is integrally extended to the flexible substrate. A lead wire connection mechanism characterized in that the holding plate is bent and its tip is fixed to a substrate, and the lead wire is held down by the holding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155632U JPS6263979U (en) | 1985-10-11 | 1985-10-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985155632U JPS6263979U (en) | 1985-10-11 | 1985-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6263979U true JPS6263979U (en) | 1987-04-21 |
Family
ID=31076505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985155632U Pending JPS6263979U (en) | 1985-10-11 | 1985-10-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6263979U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013005272A1 (en) * | 2011-07-01 | 2013-01-10 | 田中貴金属工業株式会社 | Structure for mounting thermocouple |
| WO2013145894A1 (en) * | 2012-03-27 | 2013-10-03 | オリンパス株式会社 | Cable connecting structure, ultrasound probe, and ultrasound endoscope system |
-
1985
- 1985-10-11 JP JP1985155632U patent/JPS6263979U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013005272A1 (en) * | 2011-07-01 | 2013-01-10 | 田中貴金属工業株式会社 | Structure for mounting thermocouple |
| WO2013145894A1 (en) * | 2012-03-27 | 2013-10-03 | オリンパス株式会社 | Cable connecting structure, ultrasound probe, and ultrasound endoscope system |
| US10158188B2 (en) | 2012-03-27 | 2018-12-18 | Olympus Corporation | Cable connection structure, ultrasonic probe, and ultrasonic endoscope system |