JPS63169055A - Single inline module device - Google Patents

Single inline module device

Info

Publication number
JPS63169055A
JPS63169055A JP128987A JP128987A JPS63169055A JP S63169055 A JPS63169055 A JP S63169055A JP 128987 A JP128987 A JP 128987A JP 128987 A JP128987 A JP 128987A JP S63169055 A JPS63169055 A JP S63169055A
Authority
JP
Japan
Prior art keywords
substrate
sim
leads
board
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP128987A
Other languages
Japanese (ja)
Inventor
Hitoshi Yokoyama
横山　均
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP128987A priority Critical patent/JPS63169055A/en
Publication of JPS63169055A publication Critical patent/JPS63169055A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Abstract

PURPOSE:To improve mechanical strength so that this device is not affected by impact and vibration applied vertically to a substrate surface, by disposing leads which are formed for the support of substrate on end parts of the substrate in the same direction as external leads. CONSTITUTION:External leads 2 are disposed in a one-way direction on a single inline module (SIM) substrate 1 provided with wirings, and ICs 3 are mounted on the substrate. Leads 4 for the support of SIM substrate are disposed on spare spaces of both ends of this SIM substrate 1. Tips of these leads 4 for the support of SIM substrate are formed to be bent in L characters so as to facilitate the support of the SIM device mounted on a mother board. Hence, even if impact and vibration are applied vertically to a surface of the SIM substrate 1 after the SIM substrate 1 is mounted on the mother board, the impact and vibration are absorbed into the leads 4 for support, so that mechanical strength can be improved.

Description

【発明の詳細な説明】 １産業上の利用分野１ 本発明はシングルインラインモジュール装置に関し、特
にｍ基板に実装するシングルインラインモジュール装置
に関する。DETAILED DESCRIPTION OF THE INVENTION 1. Field of Industrial Application 1. The present invention relates to a single in-line module device, and particularly to a single in-line module device mounted on an m-board.

ｌ従来の技術Ｊ ＵＣ来、この種のシングルインラインモジュール装置（
以下ＳＩＭ装置と称す）は配線を施した８１Ｍ基板にＩ
Ｃを実装し、それを親基板に外部リードを介して接続し
ていた。l Conventional technology Since JUC, this type of single in-line module device (
(hereinafter referred to as SIM device) is an 81M board with wiring.
C was mounted and connected to the mother board via external leads.

第３図はかかる従来の一例を説明するための８１Ｍ装置
の斜視図である。FIG. 3 is a perspective view of an 81M device for explaining an example of such a conventional device.

第３図に示すように、ＳｆＭ装置は配線を施したＳ　Ｉ
　Ｍ　Ｊ、Ｃ板ｌに外部リード２を一方向に設け、１１
−ノｌ（ビ３を実装することにより形成する。As shown in Figure 3, the SfM device is a wired S
External lead 2 is provided in one direction on M J, C plate l,
-No.1 (formed by implementing Bi3).

第４図は第３図に示すＳｔＭ装置を親基板に搭載した実
装斜視図である。FIG. 4 is a mounting perspective view of the StM device shown in FIG. 3 mounted on a parent board.

第７１図に示すように、ＳＩＭ基板基板段けた外部リー
ド２を介して８１Ｍ装置を親基板５に接続することによ
′り実装している。As shown in FIG. 71, the 81M device is mounted by connecting it to the parent board 5 via the external lead 2 provided on the SIM board.

１発明が解決しようとする問題点〕 １、述した従来の８１Ｍ装置は外部リードがＳＩＭＩＳ
板の面方向に一列に並んで形成されるため、８１Ｍ装置
を親基板に実装した後は、外部リードのみで支持される
ことになる。かかる外部リードのみで支持される８１Ｍ
装置は８１Ｍ基板の而にＶ・行な方向の衝撃および振動
に対しては強いが、Ｓ　Ｉ　Ｍ　居板面に垂直な方向へ
の衝撃、’ｌＡ動に対しては弱い。すなわち、垂直方向
への力が加わると、外部リードの親基板に実装した部分
を支点にして３１Ｍ装置に力が加わるため、＃Ｒ械的強
度が落ちるという欠点がある。1. Problems to be solved by the invention] 1. The conventional 81M device described above has SIMIS external leads.
Since they are formed in a line in the plane direction of the board, after the 81M device is mounted on the mother board, it is supported only by the external leads. 81M supported only by such external leads
The device is strong against shock and vibration in the direction of the 81M board, but weak against shock and vibration in the direction perpendicular to the SIM board surface. That is, when a force is applied in the vertical direction, the force is applied to the 31M device using the portion of the external lead mounted on the parent board as a fulcrum, which has the disadvantage that #R mechanical strength is reduced.

本発明の目的は、かかるＳＩＭ基板面に垂直な方向への
衝撃および振動に対しても影響を受けないように機械的
強度を向上させた３１Ｍ装置を提供することにある。An object of the present invention is to provide a 31M device with improved mechanical strength so as to be unaffected by shocks and vibrations in a direction perpendicular to the SIM substrate surface.

１問題点を解決するための手段〕 本発明は外部リードを基板外に有する３１Ｍ装置におい
て、前記基板の端部に前記外部リードと同じ方向に形成
された基板支持用リードを有するように構成される。Means for Solving Problem 1] The present invention provides a 31M device having external leads outside the substrate, which is configured to have substrate supporting leads formed at the ends of the substrate in the same direction as the external leads. Ru.

「実施例ｊ 次に、本発明の実施例について図面を参照して説明する
。Embodiment j Next, an embodiment of the present invention will be described with reference to the drawings.

第１図は本発明の第一の実施例を説明するための３１Ｍ
装置の斜視図である。FIG. 1 is a 31M diagram for explaining the first embodiment of the present invention.
FIG. 2 is a perspective view of the device.

第１図に示すように、配線を施した３１Ｍ基板１に外部
リード２を一方向に設け、且つＩＣ３を実装することま
では従来と同様である。この実施例においては、Ｓ　Ｉ
　Ｍ　Ｉ置板１の両端の空スペースに８１Ｍ基板支持用
リード４を設ける。この３１Ｍ基板支持用リード４の先
端は３１Ｍ装置を親基板（例えば、第４図に示したよう
な親基板５）に実装したとき支持し易い様にＬ字形に曲
げて形成される。すなわち、親基板に実装後に３１Ｍ基
板１の面に垂直な方向の衝撃および振動が加わっても促
持用リード４がそれを吸収できるように機械的強度を向
上させる働きをする。As shown in FIG. 1, it is the same as the conventional method up to the point where external leads 2 are provided in one direction on a 31M board 1 provided with wiring, and an IC 3 is mounted. In this example, S I
81M board supporting leads 4 are provided in empty spaces at both ends of the MI placement plate 1. The tips of the 31M board supporting leads 4 are bent into an L-shape so that they can be easily supported when the 31M device is mounted on a parent board (for example, a parent board 5 as shown in FIG. 4). That is, even if shock and vibration are applied in a direction perpendicular to the surface of the 31M board 1 after being mounted on the parent board, the supporting leads 4 serve to improve the mechanical strength so that they can absorb it.

第２図は本発明の第二の実施例を説明するための斜視図
である。FIG. 2 is a perspective view for explaining a second embodiment of the present invention.

第２図に示すように、３１Ｍ基板１に外部り一ド２およ
びＩ　Ｃ３を設けることは従来と同じであり、異なる点
は３１Ｍ基板１の両端片側から外部リード２と平行に８
１Ｍ基板支持用リード１１を設けることにある。この８
１Ｍ基板支持用リード４を外部リード２と同様に親基板
に実装時に固定することによって、３１Ｍ基板１に垂直
な方向の衝撃や振動が加わっても支持用リード４がそれ
を吸収でき、３１Ｍ装置として機械的強度が向上する。As shown in FIG. 2, the provision of the external lead 2 and IC3 on the 31M board 1 is the same as the conventional one, but the difference is that the 31M board 1 is provided with 8 external leads 2 and
The purpose is to provide 1M substrate supporting leads 11. This 8
By fixing the 1M board support lead 4 to the parent board during mounting in the same way as the external lead 2, even if a shock or vibration is applied in a direction perpendicular to the 31M board 1, the support lead 4 can absorb it, and the 31M device As a result, mechanical strength is improved.

この実施例では、片側にのみ８１Ｍ基板支持用リード１
１を設けるため、支持用リード４の取り付は位置がＳＩ
Ｍ基板両端の空スペースに限らなくても良いという利点
がある。In this example, 81M board support lead 1 is used only on one side.
1, the support lead 4 is attached at position SI.
It has the advantage that it does not have to be limited to empty spaces at both ends of the M substrate.

１発明の効県〕 以上説明したように、本発明は３１Ｍ基板に外部リード
と同じ方向にＳ　Ｉ　Ｍ基板支持用リードを設けること
により、親基板に実装後もリード部を支点とした力が加
わらないようにすること、すなわちＳ　Ｉ　Ｍ　店板面
に垂直な方向の機械的強度を向−１ニさせることができ
るという効用がある。1. Effects of the Invention] As explained above, the present invention provides the SIM board support leads on the 31M board in the same direction as the external leads, so that even after mounting on the parent board, the force using the lead part as a fulcrum can be maintained. There is an effect that the mechanical strength in the direction perpendicular to the surface of the SIM store board can be made to be -1 diagonal.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の第一の実施例を説明するためのモジュ
ール装置の斜視図、第２図は本発明の第一、−の実施例
を説明するためのモジュール装置の斜視図、第３図は従
来の一例を説明するためのモジュール装置の斜視図、第
４図は第３図に示すモジュール装置を親基板に実装した
実装斜視図である。 １・・・３１Ｍ基板、２・・・外部リード、３・・・Ｉ
Ｃ１，１・・・８１Ｍ基板支持用リード、５・・・親基
板。 代理人　弁理士　内　原　　（Ｉ＋。 口 茅　７１！１ 茅　２　閃 第　３　図 箒　４ｒｇＩFIG. 1 is a perspective view of a module device for explaining the first embodiment of the present invention, FIG. 2 is a perspective view of the module device for explaining the first to third embodiments of the present invention, and FIG. The figure is a perspective view of a module device for explaining a conventional example, and FIG. 4 is a mounting perspective view of the module device shown in FIG. 3 mounted on a parent board. 1...31M board, 2...external lead, 3...I
C1, 1... 81M board support lead, 5... Mother board. Agent Patent Attorney Uchihara (I+. Kuchi Kaya 71!1 Kaya 2 Sendai 3 Zuhoki 4rgI

Claims (1)

【特許請求の範囲】[Claims] 外部リードを基板外に有するシングルインラインモジュ
ール装置において、前記基板の端部に前記外部リードと
同じ方向に形成された基板支持用リードを有することを
特徴とするシングルインラインモジュール装置。What is claimed is: 1. A single in-line module device having an external lead outside the substrate, the single in-line module device having a substrate supporting lead formed at an end of the substrate in the same direction as the external lead.
JP128987A 1987-01-06 1987-01-06 Single inline module device Pending JPS63169055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP128987A JPS63169055A (en) 1987-01-06 1987-01-06 Single inline module device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP128987A JPS63169055A (en) 1987-01-06 1987-01-06 Single inline module device

Publications (1)

Publication Number Publication Date
JPS63169055A true JPS63169055A (en) 1988-07-13

Family

ID=11497295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP128987A Pending JPS63169055A (en) 1987-01-06 1987-01-06 Single inline module device

Country Status (1)

Country Link
JP (1) JPS63169055A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315523A (en) * 1991-05-17 1993-11-26 Fujitsu Ltd Semiconductor device
EP0587294A1 (en) * 1992-09-08 1994-03-16 Samsung Electronics Co., Ltd. Semiconductor package
US5574310A (en) * 1991-05-17 1996-11-12 Fujitsu Limited Semiconductor package for surface mounting with reinforcing members on support legs
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05315523A (en) * 1991-05-17 1993-11-26 Fujitsu Ltd Semiconductor device
US5574310A (en) * 1991-05-17 1996-11-12 Fujitsu Limited Semiconductor package for surface mounting with reinforcing members on support legs
US5831332A (en) * 1991-05-17 1998-11-03 Fujitsu Limited Semiconductor package for surface mounting
US5861669A (en) * 1991-05-17 1999-01-19 Fujitsu Limited Semiconductor package for surface mounting
EP0587294A1 (en) * 1992-09-08 1994-03-16 Samsung Electronics Co., Ltd. Semiconductor package

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