JPS61170054A - Clip lead - Google Patents

Clip lead

Info

Publication number
JPS61170054A
JPS61170054A JP60011994A JP1199485A JPS61170054A JP S61170054 A JPS61170054 A JP S61170054A JP 60011994 A JP60011994 A JP 60011994A JP 1199485 A JP1199485 A JP 1199485A JP S61170054 A JPS61170054 A JP S61170054A
Authority
JP
Japan
Prior art keywords
lead
clip
stress
circuit board
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60011994A
Other languages
Japanese (ja)
Inventor
Akira Kameda
亀田　暁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60011994A priority Critical patent/JPS61170054A/en
Publication of JPS61170054A publication Critical patent/JPS61170054A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

PURPOSE:To cushion stress applied from every direction by thermal stress and various stress in a bent section by forming the bent section to a lead section for a clip lead. CONSTITUTION:A bent section 13a functions as a stress cushioning section shaped to a lead section 12. A hybrid integrated circuit substrate 6 is mounted by using the clip leads 11, thus cushioning stress by thermal stress brought by heat applied to sections having different expansion coefficients and other various stress by the bent sections 13a in the clip leads 11. Accordingly, clips sections 12 for the clip leads 11 and the hybrid integrated circuit substrate 6 are not peeled, and a printed substrate 5 is not damaged by the upward pulling of the clip leads 11.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、たとえば混成集積回路基板をプリント基板
に実装する場合に用いるクリップリードに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a clip lead used when, for example, a hybrid integrated circuit board is mounted on a printed circuit board.

〔従来の技術〕[Conventional technology]

第３図は従来のクリップリード１の形状を示す概略図で
、２は集積回路を挾み込んで固定するクリップ部、３は
リード部である。FIG. 3 is a schematic diagram showing the shape of a conventional clip lead 1, in which 2 is a clip portion for inserting and fixing an integrated circuit, and 3 is a lead portion.

第４図は、第３図に示した従来のクリップリード１を用
いて混成集積回路基板をプリント基板に実装したときの
概略図で、４はヒートシンク、５はプリント基板、６は
セラミック等からなる混成集積回路基板、Ｔは府記クリ
ップリード１のリード部３が半田付けされているプリン
ト基板５の裏面の接続点であり、ヒートシンク４は接着
部８においてプリント基板５に固定されると共に、接着
面９において混成集積回路基板６に密着固定されている
。また、クリップリード１は混成集積回路基板６をクリ
ップ部２で挾み込んで固定し、リード部３はプリント基
板５の裏面の接続点Ｔで半田付けＫよって固定されてい
る。Figure 4 is a schematic diagram of a hybrid integrated circuit board mounted on a printed circuit board using the conventional clip lead 1 shown in Figure 3, where 4 is a heat sink, 5 is a printed circuit board, and 6 is a ceramic, etc. In the hybrid integrated circuit board, T is a connection point on the back side of the printed circuit board 5 to which the lead part 3 of the clip lead 1 is soldered, and the heat sink 4 is fixed to the printed circuit board 5 at the adhesive part 8, and It is closely fixed to the hybrid integrated circuit board 6 at the surface 9 . Further, the clip lead 1 is fixed by sandwiching the hybrid integrated circuit board 6 with the clip part 2, and the lead part 3 is fixed by soldering K at the connection point T on the back surface of the printed circuit board 5.

前記した混成集積回路基板６は、放熱性の問題から第４
図のようにプリント基板５から一定以上の距離をおいて
実装し、かつヒートシンク４と接着面９において密着固
定させて熱による悪影響を避けている。The above-mentioned hybrid integrated circuit board 6 is the fourth
As shown in the figure, it is mounted at a certain distance or more from the printed circuit board 5, and is closely fixed to the heat sink 4 and the adhesive surface 9 to avoid the adverse effects of heat.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前述したような従来のクリップリード１を用いて混成集
積回路基板６を実装した場合に、ある程度まではシート
シンク４によって熱による悪影響を除去できるが、一定
量以上の熱量が加わると各部品の膨張率の違いによって
生じる熱ストメス。When the hybrid integrated circuit board 6 is mounted using the conventional clip leads 1 as described above, the sheet sink 4 can remove the adverse effects of heat to a certain extent, but when a certain amount of heat is applied, each component expands. Thermal stomes caused by the difference in rate.

および他の各種ストレスによる応力によって、クリップ
リード１が上方に引っ張られてクリップ部２と混成集積
回路基板６とが剥離したり、プリント基板５が割れる等
の問題点がある。There are other problems such as the clip lead 1 being pulled upward by stress caused by various other stresses, causing the clip portion 2 and the hybrid integrated circuit board 6 to separate, or the printed circuit board 5 to crack.

また、このような問題点を解消するために、丸型リード
線を混成集積回路基板６とプリント基板５に半田付けし
て接続する方法もあるが、この方法では作業性、および
保守性が悪く、実装する集積回路等のピン数の増加に伴
ってこの傾向は顕著となる。In addition, in order to solve this problem, there is a method of connecting the round lead wires to the hybrid integrated circuit board 6 and the printed circuit board 5 by soldering, but this method has poor workability and maintainability. This tendency becomes more pronounced as the number of pins of integrated circuits and the like to be mounted increases.

この発明は、かかる問題点を解決するためになされたも
ので、実装する集積回路等の保Ｗ’Ｙ図り、安価で、実
装作業、および保守を容易にするクリップリードを提供
することを目的とするものである。The present invention was made in order to solve these problems, and aims to provide a clip lead that can protect the integrated circuits to be mounted, etc., is inexpensive, and facilitates mounting work and maintenance. It is something to do.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るクリップリードは、クリップリードのリ
ード部に湾曲部を設けたものである。The clip lead according to the present invention has a lead portion provided with a curved portion.

〔作用〕[Effect]

この発明においては、湾曲部において熱ス）ｌ／ス、お
よび各種ストメスによって各方向から加わる応力を緩衝
する。In this invention, the stress applied from various directions by the heat source and various types of stress is buffered at the curved portion.

〔実施例〕〔Example〕

第１図はこの発明のクリップリードの一実施例を示す概
要図で、１１はクリップリード全体を示し、１２はクリ
ップ部、１３はリード部であり、１３ａは前記リード部
１３に設けられた応力緩衝部となる湾曲部である。′ 第２図は、第１図に示すこの発明のクリップリード１１
Ｙ用いて混成集積回路基板をプリント基板に実装したと
きの概要図で、符号４〜９は第４図に示すものと同じで
ある。FIG. 1 is a schematic diagram showing an embodiment of the clip lead of the present invention, in which 11 shows the whole clip lead, 12 is a clip part, 13 is a lead part, and 13a is a stress provided in the lead part 13. This is a curved part that becomes a buffer part. ' Figure 2 shows the clip lead 11 of the present invention shown in Figure 1.
This is a schematic diagram of a hybrid integrated circuit board mounted on a printed circuit board using Y, and numerals 4 to 9 are the same as those shown in FIG. 4.

このようにして、この発明のクリップリード１１を用い
て混成集積回路基板６′１に実装することにより、膨張
率の違う部位に加わる熱によってもたらされる熱ストレ
ス、および他の各種ストメスによる応力をクリップリー
ド１１の湾曲部１３ａによって緩衝することができる。In this way, by mounting the clip lead 11 of the present invention on the hybrid integrated circuit board 6'1, the clip lead 11 can eliminate thermal stress caused by heat applied to parts with different expansion coefficients and stress caused by various other types of stress. It can be buffered by the curved portion 13a of the lead 11.

したがって、クリップリード１１のクリップ部１２と混
成集積回路基板６とが剥離したり、クリップリード１１
が上方に引っ張られてプリント基板５を破損したりする
ことがなくなる。Therefore, the clip portion 12 of the clip lead 11 and the hybrid integrated circuit board 6 may separate, or the clip lead 11
This prevents the printed circuit board 5 from being pulled upward and damaging the printed circuit board 5.

なお、この実施例ではクリップリード１１のリード部１
３に半円形の湾曲部１３ａＹ設けているが、この発明は
これに限定されるものでなく、他の形状、たとえば三角
形状等にしても同様な効果を奏するものである。Note that in this embodiment, the lead portion 1 of the clip lead 11
3 is provided with a semicircular curved portion 13aY, but the present invention is not limited to this, and the same effect can be achieved even if other shapes, such as a triangular shape, are used.

また、このクリップリード１１によって実装するものは
混成集積回路基板６に限定されるものでなく、他の電子
部品であってもよい。Furthermore, what is mounted using the clip leads 11 is not limited to the hybrid integrated circuit board 6, but may be other electronic components.

〔発明の効果〕〔Effect of the invention〕

この発明は以上説明したとおり、リード部に湾曲部を設
けてクリップリードを構成したので、集積回路基板等を
プリント基板に実装した場合に、熱ストレス、および他
の各種ストメスを湾曲部で吸収できるので、実装した部
品を各種ストメスから保護することができ、しかも安価
で、かつ実装作業、および保守が容易であるという効果
がある。As explained above, in this invention, a clip lead is constructed by providing a curved part in the lead part, so that when an integrated circuit board or the like is mounted on a printed circuit board, thermal stress and various other stress can be absorbed by the curved part. Therefore, the mounted components can be protected from various types of damage, and the mounting work and maintenance are easy, as well as being inexpensive.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明のクリップリードの一実施例〉示す概
要図、第２図は第１図に示すこの発明のクリップリード
を用いて混成集積回路基板をプリント基板に実装したと
きの概略図、第３図は従来のクリップリードの形状を示
す概略図１Ｍ４図は第３図に示す従来のクリップリード
を用いて混成集積回路基板を実装したときの概略図であ
る。 図中、１１はクリップリード、１２はクリップ部、１３
はリード部、１３ａは湾曲部である。 なお、各図中同一符号は同一部分または相当部分を示す
。 代理人　大岩　増　雄　（外２名） 第１図 第２図 ’／　　　　　　　　　　　　’／　　　　’）第３図 第４図FIG. 1 is a schematic diagram showing one embodiment of the clip lead of the present invention, and FIG. 2 is a schematic diagram of a hybrid integrated circuit board mounted on a printed circuit board using the clip lead of the present invention shown in FIG. FIG. 3 is a schematic diagram showing the shape of a conventional clip lead. FIG. 1M4 is a schematic diagram showing a hybrid integrated circuit board mounted using the conventional clip lead shown in FIG. In the figure, 11 is a clip lead, 12 is a clip part, and 13 is a clip lead.
13a is a lead portion, and 13a is a curved portion. Note that the same reference numerals in each figure indicate the same or equivalent parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2 '/'/') Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 　クリツプ部と、リード部とからなるクリツプリードに
おいて、前記リード部に湾曲部を設けたことを特徴とす
るクリツプリード。A clip lead comprising a clip part and a lead part, characterized in that the lead part is provided with a curved part.
JP60011994A 1985-01-23 1985-01-23 Clip lead Pending JPS61170054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60011994A JPS61170054A (en) 1985-01-23 1985-01-23 Clip lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60011994A JPS61170054A (en) 1985-01-23 1985-01-23 Clip lead

Publications (1)

Publication Number Publication Date
JPS61170054A true JPS61170054A (en) 1986-07-31

Family

ID=11793133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60011994A Pending JPS61170054A (en) 1985-01-23 1985-01-23 Clip lead

Country Status (1)

Country Link
JP (1) JPS61170054A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152662A (en) * 1990-10-17 1992-05-26 Nec Corp Integrated circuit package
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc Electrical contact structures from flexible wire
EP0729652A4 (en) * 1993-11-16 1998-06-24 Formfactor Inc Contact structure for interconnections, interposer, semiconductor assembly and method
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6534856B1 (en) 1997-06-30 2003-03-18 Formfactor, Inc. Sockets for “springed” semiconductor devices
KR20030055096A (en) * 2001-12-26 2003-07-02 미쓰비시덴키 가부시키가이샤 Clip-type lead frame for electrically connecting two substrates or devices
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
JP2008008695A (en) * 2006-06-28 2008-01-17 Yokohama Rubber Co Ltd:The Method for setting of tire test condition

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04152662A (en) * 1990-10-17 1992-05-26 Nec Corp Integrated circuit package
EP0729652A4 (en) * 1993-11-16 1998-06-24 Formfactor Inc Contact structure for interconnections, interposer, semiconductor assembly and method
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc Electrical contact structures from flexible wire
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6534856B1 (en) 1997-06-30 2003-03-18 Formfactor, Inc. Sockets for “springed” semiconductor devices
US6642625B2 (en) 1997-06-30 2003-11-04 Formfactor, Inc. Sockets for “springed” semiconductor devices
US7059047B2 (en) 1997-06-30 2006-06-13 Formfactor, Inc. Sockets for “springed” semiconductor devices
KR20030055096A (en) * 2001-12-26 2003-07-02 미쓰비시덴키 가부시키가이샤 Clip-type lead frame for electrically connecting two substrates or devices
JP2008008695A (en) * 2006-06-28 2008-01-17 Yokohama Rubber Co Ltd:The Method for setting of tire test condition

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