JPH08125100A - Mounting structure for semiconductor package - Google Patents
Mounting structure for semiconductor packageInfo
- Publication number
- JPH08125100A JPH08125100A JP6263391A JP26339194A JPH08125100A JP H08125100 A JPH08125100 A JP H08125100A JP 6263391 A JP6263391 A JP 6263391A JP 26339194 A JP26339194 A JP 26339194A JP H08125100 A JPH08125100 A JP H08125100A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- semiconductor package
- strip
- mounting structure
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【発明の詳細な説明】短DETAILED DESCRIPTION OF THE INVENTION Short
【０００１】[0001]
【産業上の利用分野】本発明は、垂下したリード端子１
の先端部をプリント基板３の接続ターミナル４に半田５
付け接続する半導体パッケージの接続構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a drooping lead terminal 1.
Solder the tip of the to the connection terminal 4 of the printed circuit board 3
The present invention relates to a connection structure of a semiconductor package to be additionally connected.
【０００２】[0002]
【従来の技術】図４に従来の半導体パッケージの接続構
造を示す。2. Description of the Related Art FIG. 4 shows a conventional semiconductor package connection structure.
【０００３】従来のものは、半導体パッケージ６から垂
下されるリード端子１が、単に長尺の薄板であり、先端
の台座部分を単に半田５付けによってプリント基板３の
接続ターミナル４に半田５付け接続するものであった。In the conventional case, the lead terminal 1 hanging from the semiconductor package 6 is simply a long thin plate, and the pedestal portion at the tip is simply soldered to the connection terminal 4 of the printed circuit board 3 for soldering 5. It was something to do.
【０００４】[0004]
【発明が解決しようとする課題】上記従来例では、リー
ド端子１の台座部分は、プリント基板３の接続ターミナ
ル４に面接合しているだけであった。In the above-mentioned conventional example, the pedestal portion of the lead terminal 1 is only surface-bonded to the connection terminal 4 of the printed circuit board 3.
【０００５】このため、プリント基板３とリード端子１
２の熱膨張率の差によって、リード端子１と接続ターミ
ナル４を接続する半田５に過度の応力が発生し、そこで
半田クラックが生じるという問題があった。Therefore, the printed circuit board 3 and the lead terminals 1
Due to the difference in the coefficient of thermal expansion of No. 2, excessive stress is generated in the solder 5 that connects the lead terminal 1 and the connection terminal 4, and there is a problem that solder cracks occur there.
【０００６】このような、熱膨張の差は、通電と非通電
時に起こり、通電と非通電が繰り返し行われる半導体パ
ッケージとプリント基板の実装構造にとっては宿命的な
ものである。Such a difference in thermal expansion is fatal to the mounting structure of the semiconductor package and the printed circuit board in which energization and de-energization are repeated and energization and de-energization are repeated.
【０００７】本発明は、上記の点に鑑みてなされたもの
であり、熱膨張に基づく、半導体パッケージ６のリード
端子１とプリント基板３の接続ターミナル４とを接続す
る半田５のクラックを防止することができる半導体パッ
ケージの実装構造を提供せんとするものである。The present invention has been made in view of the above points, and prevents cracks in the solder 5 connecting the lead terminals 1 of the semiconductor package 6 and the connection terminals 4 of the printed circuit board 3 due to thermal expansion. It is intended to provide a mounting structure of a semiconductor package which can be manufactured.
【０００８】[0008]
【課題を解決するための手段】この出願に係る発明は、
垂下したリード端子１の先端部を短冊状端子２に分割
し、短冊状端子２の少なくとも一つをプリント基板３の
接続ターミナル４に半田５付けし、他の短冊状端子２の
少なくとも一つをプリント基板３のスルホール５に挿入
すると共に半田５付けすることを特徴とする半導体パッ
ケージの実装構造である。The invention according to this application is
The leading end of the hanging lead terminal 1 is divided into strip-shaped terminals 2, at least one of the strip-shaped terminals 2 is soldered to the connection terminal 4 of the printed circuit board 3, and at least one of the other strip-shaped terminals 2 is attached. The semiconductor package mounting structure is characterized in that it is inserted into the through hole 5 of the printed circuit board 3 and is soldered to it.
【０００９】なお、垂下したリード端子１の先端部を短
冊状端子２に分割する分割数は、その目的を達成する限
り、特に問わず、プリント基板３の接続ターミナル４に
半田５付けされるものの他にプリント基板３のスルホー
ル５に挿入すると共に半田５付けされるものがあればよ
く、接続ターミナル４に半田５付けする数とスルホール
５に挿入すると共に半田５付けする短冊状端子２の数は
特に問わないものである。It should be noted that the number of divisions into which the leading end portion of the hanging lead terminal 1 is divided into the strip-shaped terminals 2 is not particularly limited as long as the purpose is achieved, but the solder 5 is attached to the connection terminal 4 of the printed circuit board 3. In addition, it suffices that there be one that is inserted into the through hole 5 of the printed circuit board 3 and soldered to it. It does not matter in particular.
【００１０】また、短冊状端子２の台座部は、波板に折
り曲げ形成して接続ターミナル４との半田５付け接合を
より強固としうるものである。Further, the pedestal portion of the strip-shaped terminal 2 can be bent and formed on the corrugated plate to make the solder 5 joining with the connection terminal 4 stronger.
【００１１】[0011]
【作 用】この出願に係る発明の半導体パッケージの実
装構造によれば、リード端子１の先端部を短冊状端子２
に分割しているので、プリント基板３に半田５付けした
場合に短冊状端子２に柔軟性が増し熱応力を緩和する。
また、少なくとも一つの短冊状端子２をスルホール７に
挿通した上で半田５付けしているので、半田５によるプ
リント基板３への固定が十分である。[Operation] According to the semiconductor package mounting structure of the invention according to this application, the tip portion of the lead terminal 1 is provided with the strip-shaped terminal 2.
Since it is divided into two parts, the flexibility is increased in the strip-shaped terminal 2 when the solder 5 is attached to the printed board 3, and the thermal stress is relieved.
Further, since at least one strip-shaped terminal 2 is inserted into the through hole 7 and then the solder 5 is attached, the fixing to the printed circuit board 3 by the solder 5 is sufficient.
【００１２】この際、短冊状端子２の台座部分が波板に
形成されていると、接続ターミナル４との半田５付け接
合はより強固となる。At this time, if the pedestal portion of the strip-shaped terminal 2 is formed as a corrugated plate, the solder 5 joining with the connection terminal 4 becomes stronger.
【００１３】[0013]
【実施例】以下、本発明を実施例に基づき説明する。EXAMPLES The present invention will be described below based on examples.
【００１４】図１および図２に本発明の一実施例を示
す。長方体形状の樹脂封止部７より垂下したリード端子
１の先端部は、短冊状端子２に二分割され、短冊状端子
２の一つがプリント基板３の接続ターミナル４に平行に
折曲して半田５付され、短冊状端子２の他方をプリント
基板３のスルホール７に挿入すると共に半田５付けされ
ている。1 and 2 show an embodiment of the present invention. The tip of the lead terminal 1 hanging from the rectangular resin-molded portion 7 is divided into two strip-shaped terminals 2, and one of the strip-shaped terminals 2 is bent in parallel with the connection terminal 4 of the printed circuit board 3. The strip-shaped terminal 2 is inserted into the through hole 7 of the printed circuit board 3 and soldered.
【００１５】なお、プリント基板３の接続ターミナル４
に平行に折曲して半田５付けする短冊状端子２の台座部
は、図４に示すように、波板に形成されていると、接続
ターミナル４との半田５付け接合はより強固となる。The connection terminal 4 of the printed circuit board 3
When the pedestal portion of the strip-shaped terminal 2 which is bent in parallel with and to be soldered 5 is formed in a corrugated plate as shown in FIG. 4, the connection of the solder 5 to the connection terminal 4 becomes stronger. .
【００１６】[0016]
【発明の効果】以上のように、本願の発明によれば、熱
膨張に基づく、半導体パッケージ６のリード端子１とプ
リント基板３の接続ターミナル４とを接続する半田５の
クラックを防止することができる半導体パッケージの実
装構造が提供できた。As described above, according to the present invention, it is possible to prevent cracks in the solder 5 connecting the lead terminals 1 of the semiconductor package 6 and the connection terminals 4 of the printed board 3 due to thermal expansion. It is possible to provide a mounting structure of a semiconductor package that can be manufactured.
【００１７】なお、プリント基板３の接続ターミナル４
に平行に折曲して半田５付けする短冊状端子２の台座部
は、図４に示すように、波板に形成されていると、接続
ターミナル４との半田５付け接合はより強固となる。The connection terminal 4 of the printed circuit board 3
When the pedestal portion of the strip-shaped terminal 2 which is bent in parallel with and to be soldered 5 is formed in a corrugated plate as shown in FIG. 4, the connection of the solder 5 to the connection terminal 4 becomes stronger. .
【図 １】本発明の一実施例を示す要部の斜視図。FIG. 1 is a perspective view of a main part showing an embodiment of the present invention.
【図 ２】同上の断面図。FIG. 2 is a sectional view of the above.
【図 ３】本発明の異なる実施例を示す要部の斜視図。FIG. 3 is a perspective view of a main part showing a different embodiment of the present invention.
【図 ４】従来例を示す斜視図。FIG. 4 is a perspective view showing a conventional example.
１ リード端子 ２ 短冊状端子 ３ プリント基板 ４ 接続ターミナル ５ 半田 ６ 半導体パッケージ ７ スルホール 1 Lead Terminal 2 Strip Terminal 3 Printed Circuit Board 4 Connection Terminal 5 Solder 6 Semiconductor Package 7 Through Hole
Claims (2)
端子２に分割し、短冊状端子２の少なくとも一つをプリ
ント基板３の接続ターミナル４に半田５付けし、他の短
冊状端子２の少なくとも一つをプリント基板３のスルホ
ール５に挿入すると共に半田５付けすることを特徴とす
る半導体パッケージの実装構造。1. A leading end of a suspended lead terminal 1 is divided into strip-shaped terminals 2, at least one of the strip-shaped terminals 2 is soldered to a connection terminal 4 of a printed circuit board 3, and another strip-shaped terminal 2 is provided. At least one of the above is inserted into the through hole 5 of the printed circuit board 3 and soldered 5 to the semiconductor package mounting structure.
げ形成して成ることを特徴とする請求項１記載の半導体
パッケージの実装構造。2. The semiconductor package mounting structure according to claim 1, wherein the pedestal portion of the strip-shaped terminal 2 is formed by bending a corrugated plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6263391A JPH08125100A (en) | 1994-10-27 | 1994-10-27 | Mounting structure for semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6263391A JPH08125100A (en) | 1994-10-27 | 1994-10-27 | Mounting structure for semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08125100A true JPH08125100A (en) | 1996-05-17 |
Family
ID=17388847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6263391A Withdrawn JPH08125100A (en) | 1994-10-27 | 1994-10-27 | Mounting structure for semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08125100A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191598A (en) * | 2012-03-12 | 2013-09-26 | Denso Corp | Electronic component |
-
1994
- 1994-10-27 JP JP6263391A patent/JPH08125100A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013191598A (en) * | 2012-03-12 | 2013-09-26 | Denso Corp | Electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020115 |