JPH0629417A - Sensor board - Google Patents

Sensor board

Info

Publication number
JPH0629417A
JPH0629417A JP4182244A JP18224492A JPH0629417A JP H0629417 A JPH0629417 A JP H0629417A JP 4182244 A JP4182244 A JP 4182244A JP 18224492 A JP18224492 A JP 18224492A JP H0629417 A JPH0629417 A JP H0629417A
Authority
JP
Japan
Prior art keywords
sensor
image sensor
board
sensor board
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4182244A
Other languages
Japanese (ja)
Other versions
JP2641366B2 (en
Inventor
Kenji Morimoto
賢二 森本
Takayuki Ishizaki
多嘉之 石崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP4182244A priority Critical patent/JP2641366B2/en
Publication of JPH0629417A publication Critical patent/JPH0629417A/en
Application granted granted Critical
Publication of JP2641366B2 publication Critical patent/JP2641366B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

PURPOSE:To reduce a high stress applied on an image sensor, a coupling part between the image sensor and a sensor board, and the sensor board by cantilevering the sensor board to which a sensor holder including the image sensor held thereon is fixed. CONSTITUTION:An image sensor 2 and a sensor board 4 are soldered to each other with the use of a jig, and the image sensor 2 is fixed to a sensor holder 1 using a leaf spring 3, and further the sensor holder 1 and the sensor board are fixed to each other through a screw 5. Thereupon, once the image sensor 2 and the sensor holder 1 are completely fixed to each other. There is applied force W which pulls down the sensor board 4, through the soldered portion. A portion of the sensor board 4 where the sensor board 4 is fixed to the sensor holder 1 through the screw 5 is cantilevered, whereby a load to the image sensor 2 due to a load to the image sensor 2 due to deflection of the sensor board 4 is sharply reduced without depending on the pitch L2 of the screw 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、イメージセンサーを連
結したセンサーボードにおいて、イメージセンサーが固
定手段により保持されているセンサーホルダーが固定さ
れたセンサーボードに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor board in which image sensors are connected, and a sensor holder to which an image sensor is held by a fixing means is fixed.

【0002】[0002]

【発明が解決しようとする課題】従来、イメージセンサ
ーがセンサーボードに連結されているそのセンサーボー
ドにおいて、イメージセンサーが固定手段により保持さ
れているセンサーホルダーが固定されたセンサーボード
にあっては、イメージセンサーからセンサーボードまで
の距離が決まっている。さらに、センサーホルダーとセ
ンサーボードが固定手段により固定されているのでセン
サーホルダーとセンサーボードの距離も決まってしま
う。
Conventionally, in the sensor board in which the image sensor is connected to the sensor board, the sensor board in which the image sensor is held by the fixing means is fixed in the sensor board. The distance from the sensor to the sensor board is fixed. Further, since the sensor holder and the sensor board are fixed by the fixing means, the distance between the sensor holder and the sensor board is also decided.

【0003】従って、センサーホルダーの加工時寸法公
差及び、センサーを半田づけする際の組立公差により上
記2距離が一致せず、イメージセンサー及びイメージセ
ンサーとセンサーボードの連結部及びセンサーボードに
高負荷がかかってしまい、イメージセンサー及びイメー
ジセンサーと該センサーボードの連結部及び該センサー
ボードが破壊してしまう場合がある。この点で改良が望
まれる。
Therefore, the above two distances do not match due to the dimensional tolerance of the sensor holder during processing and the assembly tolerance when the sensor is soldered, and a high load is applied to the image sensor and the connecting portion between the image sensor and the sensor board and the sensor board. This may damage the image sensor, the connection between the image sensor and the sensor board, and the sensor board. Improvement in this respect is desired.

【0004】[0004]

【課題を解決するための手段】本発明は、上記課題を解
決するために、イメージセンサーを連結したセンサーボ
ードにおいて、イメージセンサーが固定手段により保持
されているセンサーホルダーが固定されたセンサーボー
ドの部分が片持ち梁状になっている構造のものを提供す
るものである。
SUMMARY OF THE INVENTION In order to solve the above problems, the present invention is directed to a sensor board in which image sensors are connected, and a portion of the sensor board to which a sensor holder in which the image sensor is held by a fixing means is fixed. Provides a cantilevered structure.

【0005】[0005]

【作用】従って、本発明は以上のような手段を講じたこ
とにより、イメージセンサーを連結したセンサーボード
において、イメージセンサーか固定手段により保持され
ているセンサーホルダーが固定されたセンサーボードの
部分が片持ち梁状になっており、イメージセンサー及び
イメージセンサーとセンサーボードの連結部及びセンサ
ーボードにかかる高負荷を緩和することができる。
Therefore, according to the present invention, by taking the above means, in the sensor board to which the image sensor is connected, the part of the sensor board to which the sensor holder held by the image sensor or the fixing means is fixed is It has a cantilever shape, and can alleviate a high load on the image sensor and the connecting portion between the image sensor and the sensor board and the sensor board.

【0006】[0006]

【実施例】以下、本発明の一実施例について図1〜8を
参照して説明する。イメージセンサー2とセンサーホル
ダー1は図1のような構造とする。まず、イメージセン
サー2とセンサーボード4とは治具を用いてはんだづけ
を行う。この場合、イメージセンサー2底面とセンサー
ボード4底面との距離Aの寸法公差は、治具を用いたこ
とにより経験的に±0.3mmが確保できる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The image sensor 2 and the sensor holder 1 have the structure shown in FIG. First, the image sensor 2 and the sensor board 4 are soldered using a jig. In this case, the dimensional tolerance of the distance A between the bottom surface of the image sensor 2 and the bottom surface of the sensor board 4 can be empirically ensured to be ± 0.3 mm by using the jig.

【0007】次に、イメージセンサー2を板バネ3にて
センサーホルダー1に固定し、センサーホルダー1と該
センサーボード4とをネジ5で固定する。センサーホル
ダー1のセンサーボード4との突き当て面からセンサー
ボード4の突き当て面までの距離Bの寸法公差は、加工
精度より、±0.2mmに入る。A,Bより、この取付公
差は、±0.5mm程度となる。
Next, the image sensor 2 is fixed to the sensor holder 1 with the leaf spring 3, and the sensor holder 1 and the sensor board 4 are fixed with screws 5. The dimensional tolerance of the distance B from the abutting surface of the sensor holder 1 with the sensor board 4 to the abutting surface of the sensor board 4 is within ± 0.2 mm due to the processing accuracy. From A and B, this mounting tolerance is about ± 0.5 mm.

【0008】すなわち、イメージセンサー2とセンサー
ホルダー1との固定を完全なものとすると、はんだづけ
部分を経てセンサーボード4を下向きに引張る力Wが働
く。この力Wとネジ5のピッチL1 との関係は図2のよ
うになる。センサーボード4をネジ5で固定する場合
は、不静定梁と考えられる。またL1 は、スペース的に
50mm程度が限度である。
That is, when the image sensor 2 and the sensor holder 1 are completely fixed, a force W pulling the sensor board 4 downward through the soldering portion works. The relationship between this force W and the pitch L 1 of the screw 5 is as shown in FIG. When the sensor board 4 is fixed with the screws 5, it is considered as a statically indeterminate beam. In addition, L 1 is limited to about 50 mm in terms of space.

【0009】従って、グラフよりセンサーボード4を引
張る力Wは100kgを越えてしまう。尚、センサーボー
ドのヤング率Eは、計測の結果、E=1470.5kg/
mm2であった。実際にはイメージセンサー2がこの力で
引張られて、板バネ3では固定しきれず、また、できた
としてもはんだづけ部に破損が生ずる問題が発生する。
ちなみに、イメージセンサー2の両端を板バネ3で固定
できた場合の荷重とたわみの関係を、図3に記す。尚使
用されているセラミックのヤング率Eは、計測の結果、
E=28543.01kg/mm2 であった。
Therefore, from the graph, the force W for pulling the sensor board 4 exceeds 100 kg. The Young's modulus E of the sensor board was E = 1470.5 kg / as a result of the measurement.
It was mm 2 . Actually, the image sensor 2 is pulled by this force and cannot be fixed by the leaf spring 3, and even if it is possible, the soldered portion may be damaged.
Incidentally, the relationship between the load and the deflection when the both ends of the image sensor 2 can be fixed by the leaf springs 3 is shown in FIG. The Young's modulus E of the ceramic used is
E = 28543.01 kg / mm 2 .

【0010】以上の問題解決策として、図4の構造を考
案した。この方法であれば、各固定部片持梁になるた
め、センサーボード4のたわみによるイメージセンサー
2への荷重は、ネジ5のピッチL1 に依存せず、大幅に
軽減できる。
As a solution to the above problems, the structure of FIG. 4 was devised. According to this method, since each fixed part is a cantilever, the load on the image sensor 2 due to the deflection of the sensor board 4 does not depend on the pitch L 1 of the screw 5 and can be greatly reduced.

【0011】取付公差δ=0.5mm、センサーボード4
板厚h=1.6mm、センサーボード4ヤング率E=14
70.5kg/mm2 より、センサーボード4にかかる負荷
Wと切り欠きの長さlとの関係は図5のようになる。こ
のグラフによると、切り欠き幅Bが、B=10mm程度で
あっても、梁の長さlが、l=20mm取れればイメージ
センサー2に加わる荷重を、集中荷重と考えて、1kg以
下に抑えられる。この程度の荷重であればイメージセン
サー2は板バネ3でも十分固定できる。
Mounting tolerance δ = 0.5 mm, sensor board 4
Thickness h = 1.6 mm, sensor board 4 Young's modulus E = 14
From 70.5 kg / mm 2 , the relationship between the load W applied to the sensor board 4 and the notch length 1 is as shown in FIG. According to this graph, even if the cutout width B is about B = 10 mm, if the beam length 1 can be 1 = 20 mm, the load applied to the image sensor 2 is considered to be a concentrated load and is suppressed to 1 kg or less. To be With such a load, the image sensor 2 can be sufficiently fixed by the leaf spring 3.

【0012】以上の固定方法を行った場合、センサーボ
ード4及びイメージセンサー2の長手方向のたわみも考
慮する必要がある。
When the above fixing method is performed, it is necessary to take into consideration the longitudinal deflection of the sensor board 4 and the image sensor 2.

【0013】センサーボード4固定を4カ所で行い、奥
行方向のピッチL1 をL1 =50mmとすると、図6にお
ける長手方向のネジピッチL2 と、イメージセンサー2
を引張る力Wとの関係は、取付公差δ=0.5mmのとき
には、図7のようになる。これまでの通常のイメージセ
ンサー2幅(L2 方向に310mm)より、L2 は、20
0〜250mmになるが、不静定梁で考えても中央部でW
=0.3kg以下の荷重ですむ。
If the sensor board 4 is fixed at four places and the pitch L 1 in the depth direction is L 1 = 50 mm, the screw pitch L 2 in the longitudinal direction in FIG.
The relationship with the pulling force W is as shown in FIG. 7 when the mounting tolerance δ = 0.5 mm. From the conventional width of the normal image sensor 2 (310 mm in the L 2 direction), L 2 is 20
Although it is 0 to 250 mm, even if it is considered as a static beam, it is W at the center
= A load of 0.3 kg or less is required.

【0014】このときのイメージセンサー2の中央部の
たわみδと荷重Wとの関係を表したのが、図8である。
これによると、前述の奥行き方向の固定により生じる荷
重W=1kgを加えても、イメージセンサー2のたわみδ
は、中央部で1mm近くなるが、実際には、L2 の距離で
固定する部分は、前述のように切欠き状になるので、W
−L2 の関係は、静定梁にちかくなり、またイメージセ
ンサー2を固定する板バネ3も3所設けたので上記の値
も表記よりも小さくなる。
FIG. 8 shows the relationship between the deflection W of the central portion of the image sensor 2 and the load W at this time.
According to this, even if the load W = 1 kg generated by the fixing in the depth direction is applied, the deflection δ of the image sensor 2
Is about 1 mm in the central part, but in reality, the part to be fixed at the distance of L 2 is notched as described above, so W
The relationship of −L 2 is different from that of the statically-determined beam, and since the plate springs 3 for fixing the image sensor 2 are also provided at three places, the above value is smaller than the notation.

【0015】[0015]

【発明の効果】本発明のセンサーボードによれば、加工
・組立精度から生じる高負荷を緩和することができるの
で、イメージセンサー及びイメージセンサーとセンサー
ボードとの連結部及びセンサーボードが破壊するのを防
ぐことができる。
According to the sensor board of the present invention, it is possible to reduce a high load caused by processing and assembling precision, so that the image sensor and the connecting portion between the image sensor and the sensor board and the sensor board are prevented from being destroyed. Can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】イメージセンサーとセンサーホルダーの取付部
の断面図。
FIG. 1 is a sectional view of a mounting portion of an image sensor and a sensor holder.

【図2】センサーボードを下向きに引っ張る力Wとネジ
のピッチL1 との関係図。
FIG. 2 is a diagram showing a relationship between a force W for pulling the sensor board downward and a screw pitch L 1 .

【図3】イメージセンサーの両端を板バネで固定できた
場合の荷重とたわみの関係図。
FIG. 3 is a relationship diagram of a load and a deflection when both ends of the image sensor can be fixed by leaf springs.

【図4】本発明の実施例を示す斜視図。FIG. 4 is a perspective view showing an embodiment of the present invention.

【図5】本発明のセンサーボードにおけるセンサーボー
ドにかかる負荷Wと切り欠き長さlとの関係。
FIG. 5 shows the relationship between the load W applied to the sensor board and the cutout length l in the sensor board of the present invention.

【図6】イメージセンサー長手方向の位置関係。FIG. 6 is a positional relationship in the longitudinal direction of the image sensor.

【図7】イメージセンサー長手方向のネジピッチL2
イメージセンサーを引っ張る力Wとの関係の例示。(取
付公差δ=0.5mm)
FIG. 7 shows an example of the relationship between the screw pitch L 2 in the longitudinal direction of the image sensor and the force W pulling the image sensor. (Installation tolerance δ = 0.5mm)

【図8】イメージセンサーの中央部のたわみδと荷重W
との関係の例示。
FIG. 8: Deflection δ and load W at the center of the image sensor
An example of the relationship with.

【符号の説明】[Explanation of symbols]

1……センサーホルダー 2……イメージセンサー 3……板バネ 4……センサーボード 5……ネジ 1 ... Sensor holder 2 ... Image sensor 3 ... Leaf spring 4 ... Sensor board 5 ... Screw

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 イメージセンサーを連結したセンサーボ
ードにおいて、該イメージセンサーが固定手段により保
持されているセンサーホルダーが固定された該センサー
ボードの部分が片持ち梁状になっていることを特徴とし
たセンサーボード。
1. A sensor board to which an image sensor is connected, characterized in that a portion of the sensor board to which a sensor holder holding the image sensor by a fixing means is fixed has a cantilever shape. Sensor board.
JP4182244A 1992-07-09 1992-07-09 Sensor board Expired - Lifetime JP2641366B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4182244A JP2641366B2 (en) 1992-07-09 1992-07-09 Sensor board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4182244A JP2641366B2 (en) 1992-07-09 1992-07-09 Sensor board

Publications (2)

Publication Number Publication Date
JPH0629417A true JPH0629417A (en) 1994-02-04
JP2641366B2 JP2641366B2 (en) 1997-08-13

Family

ID=16114870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4182244A Expired - Lifetime JP2641366B2 (en) 1992-07-09 1992-07-09 Sensor board

Country Status (1)

Country Link
JP (1) JP2641366B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117362A (en) * 1997-11-07 2000-09-12 University Of Georgia Research Foundation, Inc. Long-persistence blue phosphors
US6953536B2 (en) 2003-02-25 2005-10-11 University Of Georgia Research Foundation, Inc. Long persistent phosphors and persistent energy transfer technique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117362A (en) * 1997-11-07 2000-09-12 University Of Georgia Research Foundation, Inc. Long-persistence blue phosphors
US6953536B2 (en) 2003-02-25 2005-10-11 University Of Georgia Research Foundation, Inc. Long persistent phosphors and persistent energy transfer technique

Also Published As

Publication number Publication date
JP2641366B2 (en) 1997-08-13

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