JPS6316457U - - Google Patents

Info

Publication number
JPS6316457U
JPS6316457U JP1986110404U JP11040486U JPS6316457U JP S6316457 U JPS6316457 U JP S6316457U JP 1986110404 U JP1986110404 U JP 1986110404U JP 11040486 U JP11040486 U JP 11040486U JP S6316457 U JPS6316457 U JP S6316457U
Authority
JP
Japan
Prior art keywords
heat sink
surface area
semiconductor device
inclined groove
fixed side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986110404U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986110404U priority Critical patent/JPS6316457U/ja
Publication of JPS6316457U publication Critical patent/JPS6316457U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
JP1986110404U 1986-07-18 1986-07-18 Pending JPS6316457U (un)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986110404U JPS6316457U (un) 1986-07-18 1986-07-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986110404U JPS6316457U (un) 1986-07-18 1986-07-18

Publications (1)

Publication Number Publication Date
JPS6316457U true JPS6316457U (un) 1988-02-03

Family

ID=30989374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986110404U Pending JPS6316457U (un) 1986-07-18 1986-07-18

Country Status (1)

Country Link
JP (1) JPS6316457U (un)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02211655A (ja) * 1989-02-10 1990-08-22 Mitsubishi Electric Corp 自動車用混成集積回路装置
JP2015050366A (ja) * 2013-09-03 2015-03-16 ウシオ電機株式会社 半導体レーザ装置
JP2015056608A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体パッケージおよび半導体装置
JP2016100152A (ja) * 2014-11-20 2016-05-30 本田技研工業株式会社 燃料電池用樹脂枠付き電解質膜・電極構造体

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02211655A (ja) * 1989-02-10 1990-08-22 Mitsubishi Electric Corp 自動車用混成集積回路装置
JP2015050366A (ja) * 2013-09-03 2015-03-16 ウシオ電機株式会社 半導体レーザ装置
JP2015056608A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体パッケージおよび半導体装置
JP2016100152A (ja) * 2014-11-20 2016-05-30 本田技研工業株式会社 燃料電池用樹脂枠付き電解質膜・電極構造体

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