JPS63164394A - Manufacture of printed circuit board - Google Patents
Manufacture of printed circuit boardInfo
- Publication number
- JPS63164394A JPS63164394A JP31029986A JP31029986A JPS63164394A JP S63164394 A JPS63164394 A JP S63164394A JP 31029986 A JP31029986 A JP 31029986A JP 31029986 A JP31029986 A JP 31029986A JP S63164394 A JPS63164394 A JP S63164394A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- printed circuit
- film
- circuit board
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000000034 method Methods 0.000 claims description 12
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- YMHOBZXQZVXHBM-UHFFFAOYSA-N 2,5-dimethoxy-4-bromophenethylamine Chemical compound COC1=CC(CCN)=C(OC)C=C1Br YMHOBZXQZVXHBM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000545067 Venus Species 0.000 description 1
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、三次元形状のプリント回路板の製造法に関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing printed circuit boards of three-dimensional shape.
従来の技術
従来、プリント回路板は、銅張積層板を所定回路の印刷
、エッチング工程Ｃ二供して製造されている。そして、
この回路板は、平向形状のものである。この回路板は剛
性を有するものであり折り曲げて使用することはできな
い。2. Description of the Related Art Conventionally, printed circuit boards have been manufactured by subjecting a copper-clad laminate to a process of printing and etching a predetermined circuit. and,
This circuit board has a flat shape. This circuit board is rigid and cannot be used by bending it.
発明が解決しようとする問題点
しかし、プリント回路板が組込まれる各種電子機器は、
軽薄短小化の傾向Ｃ二あり、複雑な形状Ｃ二なっている
。従来の平向形状のプリント回路板では、複雑な三次元
空間を有効シニ利用した組込み（：十分に対応すること
ができない。また。Problems to be Solved by the Invention However, various electronic devices incorporating printed circuit boards,
There is a trend of becoming lighter, thinner, shorter and smaller, and the shape is becoming more complex. Conventional flat-shaped printed circuit boards are not able to fully accommodate the effective use of complex three-dimensional space.
機器のハウジングとプリント回路板は別々砿二作られる
ので部品数が多くなると共ζ二１回路板をハウジング固
定するための座や段差など設計上制約を受けることがあ
った。The device housing and printed circuit board are made separately, so when the number of parts increases, there are design constraints such as seats and steps for fixing the circuit board to the housing.
本考案は、三次元形状のプリント回路板を簡単な工程で
得ることを目的とし、ハウジング円の空間の有効利用を
図れるようシ；シたものである。The present invention aims to obtain a three-dimensional printed circuit board through a simple process, and is designed to make effective use of the circular space of the housing.
問題点を解決するための手段
上記目的を連成するために１本発明は、′次の工程を経
て三次元形状のプリント回路板を製造するものである。Means for Solving the Problems In order to achieve the above objects, the present invention manufactures a three-dimensional printed circuit board through the following steps.
まず、耐熱性フィルム上Ｉ：、転写中のパターン回路を
印刷または酒肴により形成する。この回路を形成したフ
ィルムを、成形金型の内面Ｃ二回路彫成血が上になるよ
うに密着させて位置決めした後金型を閉じる。そして、
射出成形にＬＩｌ、三次元形状の基板を成形し。First, a pattern circuit to be transferred is formed on a heat-resistant film by printing or baking. The film with the circuit formed thereon is positioned in close contact with the inner surface of the mold so that the two circuits carved on the inner surface of C are facing upward, and then the mold is closed. and,
LIl is used for injection molding to form three-dimensional shaped substrates.
フィルム上の回路を基板Ｃ二転写する工程を経るもので
ある。This involves a step of transferring the circuit on the film to the substrate C2.
作用
本発明では、三次元形成の基板が・・クランプともなる
ものであり、ハウジングの内壁面にプリント回路が形成
されることにエリ、プリント回路はどのような三次元形
状にも対応することができる。そして、従来の銅張積鳩
板の製造工程および銅張ｆｌＩ層板の印刷、エツチング
工程のような長い工程を経ることなく、簡単な工程でプ
リント回路板を製造することができる。Function In the present invention, the three-dimensionally formed substrate also serves as a clamp, and the printed circuit is formed on the inner wall surface of the housing, and the printed circuit can be adapted to any three-dimensional shape. can. Furthermore, the printed circuit board can be manufactured through a simple process without going through long processes such as the conventional manufacturing process of copper-clad laminated pigeonboards and the printing and etching processes of copper-clad flI laminated boards.
実施例 次に１本徒明の実施例について説明する。Example Next, an example of a one-piece construction will be described.
（１） 耐熱性フィルム上に転写用のパターン回路を
形成
この工程は、ポリエチレンテレフタレートやアルミニウ
ム箔のような極薄（２００μ程度）の耐熱性フィルムｌ
上に、厚膜用導電インキ２をシルクスクリーン法で印刷
することによインダと挾牟して調整する。フィラーの含
有量は、１！［量比で９０％以上（体積比で７５％以上
）力τよい。印刷した厚膜用導電インキ２の表面は、後
の工程での接看性付与のため、乾燥後に、接看用エポキ
シ樹脂Ｗｊ１３で被覆するとよい。(1) Forming a pattern circuit for transfer on a heat-resistant film This process involves forming an ultra-thin (approximately 200μ) heat-resistant film such as polyethylene terephthalate or aluminum foil.
The conductive ink 2 for thick film is printed on the top by a silk screen method and adjusted by sandwiching it with the inder. The filler content is 1! [90% or more in quantity ratio (75% or more in volume ratio) force τ is good. The surface of the printed thick-film conductive ink 2 is preferably coated with a viewing epoxy resin Wj13 after drying in order to provide visibility in a later step.
回路を多層化する場合（二は、上記の厚膜導電インキ２
の印刷の後に、＠２図に示すように、スルホール孔４を
有する耐熱性フィルムｌをラミネートして絶縁しくこの
場合はアルミニウム箔は不可）１次のパターン回路を印
刷する。When making the circuit multilayer (Secondly, use the above thick film conductive ink 2)
After printing, as shown in Figure 2, a heat-resistant film l having through holes 4 is laminated for insulation (aluminum foil is not allowed in this case) and a primary pattern circuit is printed.
（２） 耐熱性フィルムの成形金型への位置決め転写
用パターン回路を印刷した耐熱性フィルムは巻き物で供
給され、フィルムの余白部分には縦送り、横送りの位置
合せのためのセンサマークを印刷しておく。第３図Ｃ二
示すように、耐熱性フィルムｌは１分割されている成形
金型６，６′の間に、移動装置５で給供される。金星上
の固定マークとの位置すれを。(2) The heat-resistant film printed with the pattern circuit for positioning and transfer of the heat-resistant film to the molding die is supplied in rolls, and sensor marks are printed on the margins of the film for alignment during vertical and horizontal feeding. I'll keep it. As shown in FIG. 3C-2, the heat-resistant film 1 is fed by a moving device 5 between the molding molds 6 and 6' which are divided into one part. Align with the fixed mark on Venus.
光センナ７で検出し、左右と上下の位置合セを正確（′
ｎｔ度±０．０５ｍ ） Ｃ行なった後、外枠８でクラ
ンプして固定する。The optical sensor 7 detects and accurately aligns the left and right and top and bottom positions ('
nt degree ±0.05m) After performing C, clamp and fix with the outer frame 8.
上記の状態で、耐熱性フィルム１をコア側の成形金型６
に真空吸看させ＠看させて位置決めを終る。このとさ、
補助的にフィルムを加熱してもよい。In the above state, heat-resistant film 1 is placed in mold 6 on the core side.
Finish the positioning by vacuum suction. This place,
The film may be heated supplementarily.
（３） 射出成形
位置決めの後、金型６，６′を閉じ、射出成形により三
次元形状の基板を成形する。パターン回路は基板側Ｃ二
転写さｎ、型開き後９回路のなくなったフィルムを巻き
とって移動させる。射出成形の樹脂は１例えばＡＢ８樹
脂でセルである。基板には、転写されたノターン回路が
強固に接看している。(3) After injection molding positioning, the molds 6 and 6' are closed, and a three-dimensional shaped substrate is molded by injection molding. The pattern circuit is transferred to the substrate side C2, and after opening the mold, the film with no 9 circuits is wound up and moved. The resin used for injection molding is, for example, AB8 resin. The transferred notarn circuit is firmly attached to the board.
同、端子部の形成は、リン宵銅を使用した端子をインサ
ート成形するか、セリサルホンやゼリエーテルサルホン
、ポリイミドなどはんだ耐熱性を有する熱可塑性樹脂を
用いて予め部分成形した後、Ｐｈ定の基板の成形を行な
う２度成形により、端子部の耐熱性を確保してもよい。The terminals are formed by insert molding the terminals using phosphorus copper, or by pre-molding the terminals using a thermoplastic resin with soldering heat resistance such as serisulfone, jellyethersulfone, or polyimide, and then using a Ph constant. The heat resistance of the terminal portion may be ensured by forming the substrate twice.
また１本発明により基板シー形成したパターン回路は、
さらＣ：無電解メッキや電解メッキを施して補強すると
よい。Further, a pattern circuit formed on a substrate sheet according to the present invention is
Further C: It is recommended to perform electroless plating or electrolytic plating for reinforcement.
発明の効果
上述のようＣ二１本発明によれば、三次元形状の基板に
、ｆ！１隼な工程でプリント回路を形成することがでさ
、どのような三次元形状にも対厄できるので、空間の有
効利用を因れる点、その工業的価値は極めて大なるもの
である。Effects of the Invention As described above, according to the present invention, f! Since printed circuits can be formed in one simple process and can be made into any three-dimensional shape, their industrial value is extremely great in that they allow for effective use of space.
【図面の簡単な説明】
第１因および第２肉は本発明で使用するパターン回路を
印刷した耐熱性フィルムの断ｒｋＩＰＡ。
第３図は１本発明で射出成形工程に耐熱性フィルムを送
る工程を示す説明図である。
１は耐熱性フィルム、２は厚膜導電インキ。
６．６ は成形金型[Brief Description of the Drawings] The first and second factors are rkIPA, a heat-resistant film printed with a pattern circuit used in the present invention. FIG. 3 is an explanatory view showing the process of sending a heat-resistant film to an injection molding process in the present invention. 1 is a heat-resistant film, 2 is a thick film conductive ink. 6.6 is the molding die
Claims (1)
蒸着する工程、前記回路を形成したフィルムを成形金型
の内面に回路形成面が上になるように密着させて位置決
めする工程、その後金型を閉じて射出成形し三次元形状
の基板を成形し、フィルム上の回路を基板に転写する工
程を経ることを特徴とするプリント回路板の製造法。A process of printing or vapor-depositing a patterned circuit for transfer onto a heat-resistant film, a process of positioning the film with the circuit formed thereon in close contact with the inner surface of a molding die so that the circuit-forming side faces upward, and then removing the mold. A method of manufacturing a printed circuit board, which is characterized by the steps of closing and injection molding to form a three-dimensional board, and then transferring the circuit on the film to the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31029986A JPS63164394A (en) | 1986-12-26 | 1986-12-26 | Manufacture of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31029986A JPS63164394A (en) | 1986-12-26 | 1986-12-26 | Manufacture of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63164394A true JPS63164394A (en) | 1988-07-07 |
Family
ID=18003550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31029986A Pending JPS63164394A (en) | 1986-12-26 | 1986-12-26 | Manufacture of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164394A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03502025A (en) * | 1988-10-05 | 1991-05-09 | ロジヤース コーポレイシヨン | Curved plastic body with precision circuit pattern |
| JP5911144B2 (en) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | Micro mechanical system |
-
1986
- 1986-12-26 JP JP31029986A patent/JPS63164394A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03502025A (en) * | 1988-10-05 | 1991-05-09 | ロジヤース コーポレイシヨン | Curved plastic body with precision circuit pattern |
| JP5911144B2 (en) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | Micro mechanical system |
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