JPS6316423U - - Google Patents
Info
- Publication number
- JPS6316423U JPS6316423U JP1986109595U JP10959586U JPS6316423U JP S6316423 U JPS6316423 U JP S6316423U JP 1986109595 U JP1986109595 U JP 1986109595U JP 10959586 U JP10959586 U JP 10959586U JP S6316423 U JPS6316423 U JP S6316423U
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- lead terminal
- low thermal
- sandwiched
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Thermally Actuated Switches (AREA)
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986109595U JPS6316423U (en:Method) | 1986-07-16 | 1986-07-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986109595U JPS6316423U (en:Method) | 1986-07-16 | 1986-07-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316423U true JPS6316423U (en:Method) | 1988-02-03 |
Family
ID=30987830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986109595U Pending JPS6316423U (en:Method) | 1986-07-16 | 1986-07-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316423U (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02161711A (ja) * | 1988-12-15 | 1990-06-21 | Hitachi Cable Ltd | セラミックコンデンサに半田接合される板状のリード線 |
| JP2018093171A (ja) * | 2016-11-29 | 2018-06-14 | 富士通株式会社 | 電子部品接合基板 |
| US10028387B2 (en) | 2016-11-29 | 2018-07-17 | Fujitsu Limited | Electronic part bonding substrate |
-
1986
- 1986-07-16 JP JP1986109595U patent/JPS6316423U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02161711A (ja) * | 1988-12-15 | 1990-06-21 | Hitachi Cable Ltd | セラミックコンデンサに半田接合される板状のリード線 |
| JP2018093171A (ja) * | 2016-11-29 | 2018-06-14 | 富士通株式会社 | 電子部品接合基板 |
| US10028387B2 (en) | 2016-11-29 | 2018-07-17 | Fujitsu Limited | Electronic part bonding substrate |