JPS6316423U - - Google Patents

Info

Publication number
JPS6316423U
JPS6316423U JP1986109595U JP10959586U JPS6316423U JP S6316423 U JPS6316423 U JP S6316423U JP 1986109595 U JP1986109595 U JP 1986109595U JP 10959586 U JP10959586 U JP 10959586U JP S6316423 U JPS6316423 U JP S6316423U
Authority
JP
Japan
Prior art keywords
conductive material
lead terminal
low thermal
sandwiched
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986109595U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986109595U priority Critical patent/JPS6316423U/ja
Publication of JPS6316423U publication Critical patent/JPS6316423U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Multi-Conductor Connections (AREA)
  • Thermally Actuated Switches (AREA)
JP1986109595U 1986-07-16 1986-07-16 Pending JPS6316423U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986109595U JPS6316423U (OSRAM) 1986-07-16 1986-07-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986109595U JPS6316423U (OSRAM) 1986-07-16 1986-07-16

Publications (1)

Publication Number Publication Date
JPS6316423U true JPS6316423U (OSRAM) 1988-02-03

Family

ID=30987830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986109595U Pending JPS6316423U (OSRAM) 1986-07-16 1986-07-16

Country Status (1)

Country Link
JP (1) JPS6316423U (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161711A (ja) * 1988-12-15 1990-06-21 Hitachi Cable Ltd セラミックコンデンサに半田接合される板状のリード線
JP2018093171A (ja) * 2016-11-29 2018-06-14 富士通株式会社 電子部品接合基板
US10028387B2 (en) 2016-11-29 2018-07-17 Fujitsu Limited Electronic part bonding substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02161711A (ja) * 1988-12-15 1990-06-21 Hitachi Cable Ltd セラミックコンデンサに半田接合される板状のリード線
JP2018093171A (ja) * 2016-11-29 2018-06-14 富士通株式会社 電子部品接合基板
US10028387B2 (en) 2016-11-29 2018-07-17 Fujitsu Limited Electronic part bonding substrate

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