JPS63162533U - - Google Patents
Info
- Publication number
- JPS63162533U JPS63162533U JP5434987U JP5434987U JPS63162533U JP S63162533 U JPS63162533 U JP S63162533U JP 5434987 U JP5434987 U JP 5434987U JP 5434987 U JP5434987 U JP 5434987U JP S63162533 U JPS63162533 U JP S63162533U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- bonding pads
- sides
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5434987U JPS63162533U (it) | 1987-04-09 | 1987-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5434987U JPS63162533U (it) | 1987-04-09 | 1987-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63162533U true JPS63162533U (it) | 1988-10-24 |
Family
ID=30881260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5434987U Pending JPS63162533U (it) | 1987-04-09 | 1987-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162533U (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001274187A (ja) * | 2000-03-23 | 2001-10-05 | Fujitsu Ltd | 半導体装置 |
-
1987
- 1987-04-09 JP JP5434987U patent/JPS63162533U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001274187A (ja) * | 2000-03-23 | 2001-10-05 | Fujitsu Ltd | 半導体装置 |
| JP4493795B2 (ja) * | 2000-03-23 | 2010-06-30 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置 |