JPS63162529U - - Google Patents
Info
- Publication number
- JPS63162529U JPS63162529U JP5502687U JP5502687U JPS63162529U JP S63162529 U JPS63162529 U JP S63162529U JP 5502687 U JP5502687 U JP 5502687U JP 5502687 U JP5502687 U JP 5502687U JP S63162529 U JPS63162529 U JP S63162529U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin sealing
- disposed
- mold
- side edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5502687U JPS63162529U (fr) | 1987-04-11 | 1987-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5502687U JPS63162529U (fr) | 1987-04-11 | 1987-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63162529U true JPS63162529U (fr) | 1988-10-24 |
Family
ID=30882558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5502687U Pending JPS63162529U (fr) | 1987-04-11 | 1987-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162529U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258495A (ja) * | 2006-03-24 | 2007-10-04 | Matsushita Electric Ind Co Ltd | 半導体パッケージの製造方法および装置ならびに半導体パッケージ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111432A (ja) * | 1983-11-22 | 1985-06-17 | Toshiba Corp | 半導体装置用樹脂封止金型 |
| JPS6294312A (ja) * | 1985-10-21 | 1987-04-30 | Hitachi Ltd | モ−ルド金型 |
-
1987
- 1987-04-11 JP JP5502687U patent/JPS63162529U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60111432A (ja) * | 1983-11-22 | 1985-06-17 | Toshiba Corp | 半導体装置用樹脂封止金型 |
| JPS6294312A (ja) * | 1985-10-21 | 1987-04-30 | Hitachi Ltd | モ−ルド金型 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258495A (ja) * | 2006-03-24 | 2007-10-04 | Matsushita Electric Ind Co Ltd | 半導体パッケージの製造方法および装置ならびに半導体パッケージ |