JPS62188143U - - Google Patents
Info
- Publication number
- JPS62188143U JPS62188143U JP7778186U JP7778186U JPS62188143U JP S62188143 U JPS62188143 U JP S62188143U JP 7778186 U JP7778186 U JP 7778186U JP 7778186 U JP7778186 U JP 7778186U JP S62188143 U JPS62188143 U JP S62188143U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- gates
- communicate
- parting line
- disposed opposite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7778186U JPS62188143U (fr) | 1986-05-22 | 1986-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7778186U JPS62188143U (fr) | 1986-05-22 | 1986-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62188143U true JPS62188143U (fr) | 1987-11-30 |
Family
ID=30926110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7778186U Pending JPS62188143U (fr) | 1986-05-22 | 1986-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62188143U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244739A (ja) * | 1988-08-05 | 1990-02-14 | Hitachi Ltd | 樹脂封止パッケージの成形方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6124241A (ja) * | 1984-07-13 | 1986-02-01 | Nec Corp | 半導体装置の樹脂封止金型 |
-
1986
- 1986-05-22 JP JP7778186U patent/JPS62188143U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6124241A (ja) * | 1984-07-13 | 1986-02-01 | Nec Corp | 半導体装置の樹脂封止金型 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0244739A (ja) * | 1988-08-05 | 1990-02-14 | Hitachi Ltd | 樹脂封止パッケージの成形方法 |