JPH0173946U - - Google Patents
Info
- Publication number
- JPH0173946U JPH0173946U JP16949387U JP16949387U JPH0173946U JP H0173946 U JPH0173946 U JP H0173946U JP 16949387 U JP16949387 U JP 16949387U JP 16949387 U JP16949387 U JP 16949387U JP H0173946 U JPH0173946 U JP H0173946U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- injection side
- thicker
- resin injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims 2
- 239000007924 injection Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000001746 injection moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16949387U JPH0173946U (fr) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16949387U JPH0173946U (fr) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173946U true JPH0173946U (fr) | 1989-05-18 |
Family
ID=31459603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16949387U Pending JPH0173946U (fr) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173946U (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829847B2 (ja) * | 1978-01-26 | 1983-06-25 | 松下電器産業株式会社 | 抵抗値↓−電圧変換回路 |
| JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
| JPS6442825A (en) * | 1987-08-10 | 1989-02-15 | Sanken Electric Co Ltd | Manufacture of resin sealed semiconductor device |
-
1987
- 1987-11-05 JP JP16949387U patent/JPH0173946U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829847B2 (ja) * | 1978-01-26 | 1983-06-25 | 松下電器産業株式会社 | 抵抗値↓−電圧変換回路 |
| JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
| JPS6442825A (en) * | 1987-08-10 | 1989-02-15 | Sanken Electric Co Ltd | Manufacture of resin sealed semiconductor device |