JPS63162427U - - Google Patents
Info
- Publication number
- JPS63162427U JPS63162427U JP5482587U JP5482587U JPS63162427U JP S63162427 U JPS63162427 U JP S63162427U JP 5482587 U JP5482587 U JP 5482587U JP 5482587 U JP5482587 U JP 5482587U JP S63162427 U JPS63162427 U JP S63162427U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- switch
- holder
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004831 Hot glue Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Arrangement And Mounting Of Devices That Control Transmission Of Motive Force (AREA)
Description
第１図ないし第４図は本考案の一実施例に係り
、第１図はカバーの一部を破断して示すスイツチ
の平面図、第２図は仮止め構造の要部断面図、第
３図は仮止め工程を示す断面図、第４図は仮止め
工程の説明図、第５図は本考案の他の実施例に係
る仮止め構造の要部断面図、第６図は従来例に係
るスイツチの平面図、第７図は第６図のＡ―Ａ線
に沿う断面図である。
１…基板、２，２ａ，２ｂ…配線パターン、３
…カバー、４…保持体、４ａ…操作孔、５…摺動
子（接点）、７…盲孔（第２の孔）、８…貫通孔
（第１の孔）、９…開口、１０…ホツトメルト接
着剤、１１…キヤツプ。
1 to 4 relate to one embodiment of the present invention, in which FIG. 1 is a plan view of a switch with a part of the cover cut away, FIG. 2 is a cross-sectional view of the main part of the temporary fixing structure, and FIG. The figure is a sectional view showing the temporary fixing process, FIG. 4 is an explanatory diagram of the temporary fixing process, FIG. 5 is a sectional view of the main part of the temporary fixing structure according to another embodiment of the present invention, and FIG. A plan view of such a switch, FIG. 7, is a sectional view taken along line AA in FIG. 6. 1... Board, 2, 2a, 2b... Wiring pattern, 3
... Cover, 4... Holder, 4a... Operation hole, 5... Slider (contact), 7... Blind hole (second hole), 8... Through hole (first hole), 9... Opening, 10... Hot melt adhesive, 11...cap.
Claims (1)
該基板に被着されたカバーと、接点を有し前記基
板とカバー間に回動可能に支持された保持体とを
備え、前記保持体を回動操作することにより、前
記接点が前記配線パターン上を摺動してオン・オ
フの切換えが行われるスイツチにおいて、前記基
板と保持体のいずれか一方に両者の対向面側が小
径の開口端となつている第１の孔を、いずれか他
方に前記対向面側が大径の開口端となつている第
２の孔をそれぞれ設け、これら第１および第２の
孔内に充填した接着剤により前記基板と前記保持
体とが連結されるように構成したことを特徴とす
るスイツチ。 (2) 実用新案登録請求の範囲第(1)項において、
前記第１の孔が前記対向面側に向つて先窄まりに
形成されていることを特徴とするスイツチ。 (3) 実用新案登録請求の範囲第(1)項の記載にお
いて、前記接着剤がホツトメルト接着剤であるこ
とを特徴とするスイツチ。[Scope of claims for utility model registration] (1) A board provided with a desired wiring pattern,
It includes a cover attached to the substrate, and a holder having contacts and rotatably supported between the substrate and the cover, and by rotating the holder, the contacts are connected to the wiring pattern. In a switch that is turned on and off by sliding on the top of the switch, a first hole having a small-diameter open end on the opposing surface side of either the substrate or the holder is provided in one of the substrate and the holder. Second holes each having a large-diameter open end on the opposing surface side are provided, and the substrate and the holding body are connected to each other by an adhesive filled in the first and second holes. A switch that is characterized by the fact that (2) In paragraph (1) of claims for utility model registration,
A switch characterized in that the first hole is formed to be tapered toward the opposing surface. (3) The switch according to claim (1) of the utility model registration, characterized in that the adhesive is a hot melt adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5482587U JPS63162427U (en) | 1987-04-13 | 1987-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5482587U JPS63162427U (en) | 1987-04-13 | 1987-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63162427U true JPS63162427U (en) | 1988-10-24 |
Family
ID=30882175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5482587U Pending JPS63162427U (en) | 1987-04-13 | 1987-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63162427U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01170924U (en) * | 1988-05-23 | 1989-12-04 |
-
1987
- 1987-04-13 JP JP5482587U patent/JPS63162427U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01170924U (en) * | 1988-05-23 | 1989-12-04 |