JPS63161637A - 半導体ウエ−ハの位置認識装置 - Google Patents

半導体ウエ−ハの位置認識装置

Info

Publication number
JPS63161637A
JPS63161637A JP61307736A JP30773686A JPS63161637A JP S63161637 A JPS63161637 A JP S63161637A JP 61307736 A JP61307736 A JP 61307736A JP 30773686 A JP30773686 A JP 30773686A JP S63161637 A JPS63161637 A JP S63161637A
Authority
JP
Japan
Prior art keywords
section
semiconductor wafer
information storage
stage
scattering plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61307736A
Other languages
English (en)
Japanese (ja)
Other versions
JPH047104B2 (https=
Inventor
Hideaki Hayashi
英明 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP61307736A priority Critical patent/JPS63161637A/ja
Publication of JPS63161637A publication Critical patent/JPS63161637A/ja
Publication of JPH047104B2 publication Critical patent/JPH047104B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Position Or Direction (AREA)
JP61307736A 1986-12-25 1986-12-25 半導体ウエ−ハの位置認識装置 Granted JPS63161637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61307736A JPS63161637A (ja) 1986-12-25 1986-12-25 半導体ウエ−ハの位置認識装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61307736A JPS63161637A (ja) 1986-12-25 1986-12-25 半導体ウエ−ハの位置認識装置

Publications (2)

Publication Number Publication Date
JPS63161637A true JPS63161637A (ja) 1988-07-05
JPH047104B2 JPH047104B2 (https=) 1992-02-07

Family

ID=17972641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61307736A Granted JPS63161637A (ja) 1986-12-25 1986-12-25 半導体ウエ−ハの位置認識装置

Country Status (1)

Country Link
JP (1) JPS63161637A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252203A (ja) * 1988-08-16 1990-02-21 Toshiba Corp 非接触ウェハー中心位置検出装置
JP2010092619A (ja) * 2008-10-03 2010-04-22 Nissin Ion Equipment Co Ltd イオン注入装置
CN103579064A (zh) * 2012-08-02 2014-02-12 株式会社迪思科 板状工件中心检测方法
CN109945779A (zh) * 2017-12-21 2019-06-28 汉辰科技股份有限公司 具有至少一摄像机的校正系统与相应方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0252203A (ja) * 1988-08-16 1990-02-21 Toshiba Corp 非接触ウェハー中心位置検出装置
JP2010092619A (ja) * 2008-10-03 2010-04-22 Nissin Ion Equipment Co Ltd イオン注入装置
CN103579064A (zh) * 2012-08-02 2014-02-12 株式会社迪思科 板状工件中心检测方法
JP2014033049A (ja) * 2012-08-02 2014-02-20 Disco Abrasive Syst Ltd 板状ワーク中心検出方法
TWI596316B (zh) * 2012-08-02 2017-08-21 迪思科股份有限公司 Plate work center test method
CN109945779A (zh) * 2017-12-21 2019-06-28 汉辰科技股份有限公司 具有至少一摄像机的校正系统与相应方法
CN109945779B (zh) * 2017-12-21 2023-09-05 汉辰科技股份有限公司 具有至少一摄像机的校正系统与相应方法

Also Published As

Publication number Publication date
JPH047104B2 (https=) 1992-02-07

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Legal Events

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LAPS Cancellation because of no payment of annual fees