JPS63155650U - - Google Patents

Info

Publication number
JPS63155650U
JPS63155650U JP4971287U JP4971287U JPS63155650U JP S63155650 U JPS63155650 U JP S63155650U JP 4971287 U JP4971287 U JP 4971287U JP 4971287 U JP4971287 U JP 4971287U JP S63155650 U JPS63155650 U JP S63155650U
Authority
JP
Japan
Prior art keywords
external lead
unconnected
wide
external
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4971287U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451489Y2 (ar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987049712U priority Critical patent/JPH0451489Y2/ja
Publication of JPS63155650U publication Critical patent/JPS63155650U/ja
Application granted granted Critical
Publication of JPH0451489Y2 publication Critical patent/JPH0451489Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1987049712U 1987-03-31 1987-03-31 Expired JPH0451489Y2 (ar)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987049712U JPH0451489Y2 (ar) 1987-03-31 1987-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987049712U JPH0451489Y2 (ar) 1987-03-31 1987-03-31

Publications (2)

Publication Number Publication Date
JPS63155650U true JPS63155650U (ar) 1988-10-12
JPH0451489Y2 JPH0451489Y2 (ar) 1992-12-03

Family

ID=30872419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987049712U Expired JPH0451489Y2 (ar) 1987-03-31 1987-03-31

Country Status (1)

Country Link
JP (1) JPH0451489Y2 (ar)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0393257A (ja) * 1989-09-05 1991-04-18 Toshiba Corp 樹脂封止型半導体装置
JP2008060597A (ja) * 2001-05-18 2008-03-13 Sanyo Electric Co Ltd 電源回路装置
JP2010016289A (ja) * 2008-07-07 2010-01-21 Mitsubishi Electric Corp 半導体パッケージおよび半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155757A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Semiconductor device
JPS59115653U (ja) * 1983-01-25 1984-08-04 サンケン電気株式会社 絶縁物封止半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0393257A (ja) * 1989-09-05 1991-04-18 Toshiba Corp 樹脂封止型半導体装置
JP2008060597A (ja) * 2001-05-18 2008-03-13 Sanyo Electric Co Ltd 電源回路装置
JP4651652B2 (ja) * 2001-05-18 2011-03-16 三洋電機株式会社 電源回路装置
JP2010016289A (ja) * 2008-07-07 2010-01-21 Mitsubishi Electric Corp 半導体パッケージおよび半導体装置

Also Published As

Publication number Publication date
JPH0451489Y2 (ar) 1992-12-03

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