JPS63153551U - - Google Patents
Info
- Publication number
- JPS63153551U JPS63153551U JP4558987U JP4558987U JPS63153551U JP S63153551 U JPS63153551 U JP S63153551U JP 4558987 U JP4558987 U JP 4558987U JP 4558987 U JP4558987 U JP 4558987U JP S63153551 U JPS63153551 U JP S63153551U
- Authority
- JP
- Japan
- Prior art keywords
- periphery
- lead terminals
- flat package
- reinforced
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4558987U JPS63153551U (es) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4558987U JPS63153551U (es) | 1987-03-30 | 1987-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63153551U true JPS63153551U (es) | 1988-10-07 |
Family
ID=30864461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4558987U Pending JPS63153551U (es) | 1987-03-30 | 1987-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63153551U (es) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003045509A (ja) * | 2001-08-01 | 2003-02-14 | Tokai Rika Co Ltd | コネクタのプリント回路基板への取付方法及びコネクタ |
-
1987
- 1987-03-30 JP JP4558987U patent/JPS63153551U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003045509A (ja) * | 2001-08-01 | 2003-02-14 | Tokai Rika Co Ltd | コネクタのプリント回路基板への取付方法及びコネクタ |