JPS63150995A - Manufacture of metal base printed wiring board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field 1] The present invention relates to a method of manufacturing a metal-based printed wiring board in which specific parts of a conductor pattern, for example, terminals for connection with other functions, contact parts, etc., are electroplated.

[Background technology] Conventionally, metal-based laminates based on metal plates such as silicon steel sheets have excellent heat resistance, flame retardancy, shielding effect,
It has excellent mechanical strength and heat dissipation properties, and can be bent and processed, so it can be used as part of the box of electrical equipment by forming a conductive pattern, making it effective for downsizing the entire device6. By the way, specific parts of the conductor pattern, such as connection terminals and contact parts, are electroplated with metal foil to ensure good contact with other electronic components. In this case, if a conductor pattern is formed by connecting the part to be electroplated and the electroplating electrode wire that will be used as an electrode when electroplating is performed by immersing it in an electrolytic bath using a bonding wire, electroplating can be performed easily. Advantageously, the parts are electroplated at the same time.

However, when the metal-based printed wiring board A' is formed in this way, the insulating layer 2 is crushed and formed into the conductor pattern 7 during external processing, for example, when punching, as shown in FIG. There was a problem in that the metal plate 1 was short-circuited.

For this reason, as shown in Figure tlrJ3, after applying an etching resist 8 and performing etching, a conductive pattern 7 is formed on the other surface of the metal base laminate 4, and a first resist 9 is applied at predetermined locations. Process (same figure (aHb) (c
), and a second step of sealing 11 the bonded MIO of the conductor pattern 7 and applying electroplating 5 to the other portion 7a ((d) in the same figure).
) and the combination #il Of! Peel off the S seal 11,
A third step ((e) and (f) in the figure) of performing etching treatment with the electroplating 5 sealed 11, and the electroplating! 15
A method for manufacturing a metal-based printed wiring board has been proposed, which includes a fourth step ((g) and (h) in the same figure) of peeling off the seal 11 of the printed wiring board A'' and separating the printed wiring board A'' by punching. No. 58-225697), although it is true that a short circuit between the conductive pattern 7 and the metal plate 1 can be prevented in the punching process, the process is complicated and the productivity is extremely low.

[Object of the Invention] The present invention has been made in view of the above circumstances, and its purpose is to enable electroplating to be applied to a specific portion of a conductor pattern, and to form a conductor pattern during external processing such as punching. To provide a method for manufacturing a metal-based printed wiring board that does not cause short-circuiting to a metal plate, requires fewer steps than conventional methods, and has significantly high productivity.

[Disclosure of the Invention] The method for manufacturing a metal base printed wiring board of the present invention includes bonding a metal foil 3 to a metal plate 1 with an insulating layer 2 interposed therebetween to form a metal base 8j layered plate 4, and then forming a metal base 8j layered plate 4. Electroplating 5 is applied, then an etching resist 8 is applied to the necessary parts as the conductor pattern 7, and after etching, the etching resist 8 is peeled off to form a conductor butterfly nymph, after which a solder resist 9 is printed, and then the external shape is processed. That's v
This configuration achieves the above object.

Hereinafter, the present invention will be described based on embodiments shown in the accompanying drawings. The metal base 82-layer plate 4 used in the present invention is made of iron,
For example, a metal M3 such as copper foil or aluminum foil is placed on one side of a metal plate 1 made of aluminum, copper, nickel, or an alloy thereof through an insulating N2 such as prepreg, and is integrated by heating and pressure forming. and formed. First, a plating resist 6 is applied to the metal foil 3 of the metal base laminate 4 except for the portion 3a where the electroplating 5 is applied (P
J1 figure (a)). Next, it is immersed in an electroplating bath and electroplated 5 with a noble metal such as nickel or gold. The electroplating 5 does not adhere to the plating resist 6, but only to a desired portion 3a of the metal foil 3 (FIG. 1(b)).

Next, the light resist 6 is peeled off using chemicals (
Figure 1 (C)). After this, an etching resist 8 is applied to the necessary portions of the conductor pattern 7 (Fig. 1(d)).
). After etching, the etching resist 8 is peeled off to form a conductor pattern 7 (FIGS. 1(e) and 1(f)).

Next, the solder resist 9 is printed, and after that, the external shape is processed to manufacture the metal base printed wiring board A (see Fig. 1 (g)
)(h)).

[Effects of the Invention] In the present invention, a plating resist is applied to the metal foil of the metal base laminate except for the parts to be electroplated, and then electroplating is applied, and then an etching resist is applied to the parts required as a conductor pattern. After coating and etching, the etching resist is peeled off to form a conductor pattern, followed by solder resist printing, and then the external shape processing.
Electroplating can be applied to specific parts of the conductor pattern, and the conductor pattern does not short-circuit to the metal plate during external processing such as punching.Furthermore, the number of steps is fewer than conventional methods, and the raw material is less sticky. It is expensive.

[Brief explanation of the drawings] Figure 1 (a) (b) (c) (d) (e) (f) (g) (
h) is a schematic sectional view showing each step of an embodiment of the present invention, FIG. 2 is a sectional view showing problems in the conventional example, and FIG. 3 (aHb)
(cHd) (e) (f>(g)Cb) is a schematic cross-sectional view showing each process of another conventional example, where m board is a metal plate, 2 is an insulating layer, and 3 is an insulating layer. metal foil, 4
is a metal base laminate, 5 is electroplating, 6 is plating resist, 7 is a conductor pattern, 8 is etching resist, 9
is a Tsurugu resist. Agent Patent Attorney Ishi 1) Long 78 Etching resist 9...Solder resist 2 diagram

Claims (1)

[Claims] (1) A metal base laminate is formed by pasting metal foil on a metal plate through an insulating layer, and then a plating resist is applied to the metal foil of the metal base laminate except for the portion to be electroplated. After that, electroplating is applied, then an etching resist is applied to the necessary parts as a conductor pattern, and after etching, the etching resist is peeled off to form a conductor pattern, and then a solder resist is printed, and then the external shape is processed. A method for manufacturing a metal-based printed wiring board.