JPS63150989A - Attachment structure of leaded chip component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a mounting structure for leaded chip components, and in particular, when mounting leaded chip components on a board, high-density mounting is possible. The present invention relates to a mounting structure for leaded chip components that can be mounted.

(Prior Art) In recent years, with the miniaturization of electronic devices, chip components are increasingly being used on printed circuit boards. The above-mentioned chip component generally has flat plate-like surface electrodes formed at both ends of the component body, but a chip component with leads may be used due to circuit configuration requirements. In order to mount such chip components and chip components with leads on a board, an automatic bag f? An IJ machine is used to place each circuit pattern at a predetermined position via adhesive, temporarily fix it, and then make a solder connection.

FIG. 3 is an explanatory diagram showing an example of such a conventional mounting structure for a leaded chip component.

In FIG. 3, reference numeral 11 denotes a printed circuit board, which is made of, for example, resin with excellent insulation properties.

On the upper surface of this printed board 11, circuit patterns 12.12 are formed at predetermined intervals.
An adhesive 13 is attached between a3, and this adhesive 13
Chip components are attached through the .

The chip component includes flat surface electrodes 14a, 14a, 15a shaped to fit on both ends of the chip component 14.15.
15a is formed, and lead wires 16 and 16 are led out from both ends of the chip component 17. When mounting these chip components 14.15 and leaded chip components 17 on the printed circuit board 11, an automatic mounting machine is used to place the chip components 14.1 on the upper surface of the circuit patterns 12.12, respectively.
5 surface electrodes 14a, 14a, 15a, 15a and lead wires 16.16 of the chip component 17 are arranged, and the adhesive 13
It is temporarily fixed at. The printed circuit board 11 with the components arranged in this manner is immersed in a solder bath and connected with solder 18.

However, in the mounting structure for leaded chip components having the above configuration, in order to perform high-density mounting, it is necessary to mount the leaded chip components 17 on the board in close proximity to the chip components 14 and 15. Since such chip components 14, 15 and chip components 17 with leads are temporarily fixed with adhesive 13 and then connected by soldering, the surface electrode 14a may be attached depending on the variations in the automatic mounting machine.

15a and the lead wires 16.16 come into contact with each other and cause displacement, resulting in a problem that the chip components 14.15 and the leaded chip components 17 cannot be mounted at predetermined positions on the circuit pattern 12.12.

Therefore, in consideration of variations in automatic mounting machines, etc., the distance between the surface electrodes 14a, 15a of the chip component 14.15 placed on the circuit pattern 12.12 and the lead wire 16.16 of the leaded chip component 17 is They were spaced apart by a margin p to prevent contact during installation.

However, in this way, the surface electrode 14 of the chip component 14.15
a, 15a and the lead wire 16 of the leaded deep part 17
, 16, the larger the allowance dimension ρ, the more unnecessary space increases, making it difficult to increase the density of the printed circuit board 11.

Moreover, there is a problem in that it becomes difficult to downsize Ia2S itself.

(Problems to be Solved by the Invention) In the conventional mounting structure for leaded chip components, when leaded chip components are placed close to each other, due to variations in the automatic mounting machine, they come into contact with each other and may cause damage to the predetermined circuit. To prevent it from not being attached to the pattern,
It is necessary to keep a margin ρ apart between the surface electrodes of the chip component and the lead wires of the leaded chip component. For this reason, as the margin 4 method 1 increases, unnecessary space increases on the printed circuit board, making it difficult to increase the density of the circuit board.

The present invention has been made to solve the above problems,
Mounting leaded boot-tub parts that allows for high-density assembly by ensuring that the placement position does not shift even if there is no margin between adjacent chip parts when mounting a lead-equipped one-piece part on a printed circuit board. The purpose is to provide structure.

[Structure of the Invention] (Means for Solving the Problems) A printed circuit board having a circuit pattern formed at a predetermined position, and surface electrodes formed on both ends thereof, and arranged on the circuit pattern in a state where they are separated by a predetermined distance. Lead wires are led out from both ends of the first and second chip components, and the component body side is fixed to the printed circuit board with the lead-out side facing upward, and the lead wires are connected to the first and second chip components. This includes a chip component with leads arranged in close proximity to the surface electrode of the device.

(Function) According to the mounting structure for a leaded chip component having the above configuration, when mounting a leaded chip component on a board, contact with the adjacent first and second chip components is prevented, and unnecessary space is saved. chip components can be assembled in high density by reducing

(Example) Hereinafter, the present invention will be described with reference to illustrated embodiments.

FIG. 1 is an explanatory view showing an embodiment of a mounting structure for a leaded chip component according to the present invention, and members corresponding to those in FIG. 3 are given corresponding symbols.

In FIG. 1, reference numeral 1 denotes a printed circuit board, and on the upper surface of this printed circuit board 1 there are circuit patterns 2 separated by a predetermined distance.
．． 2 is formed, and an adhesive 3 is adhered between the circuit patterns 2 and 2. Printed board 1 with adhesive 3 attached
On the top, there are surface electrodes 4a, 4a and 5a, 5a at both ends, respectively.
The chip component 4.5 on which the chip component 4.5 is formed;
A lead wire 6 led out from both ends so as to bridge between 5 and 5.
A lead-equipped chip component 7 is mounted with its angle 6 substantially parallel to the surface of the printed circuit board, and is connected and fixed with solder 8, respectively. The chip components 4.5 are mounted with the surface electrodes 4a, 4a and 5a, 5a temporarily fixed at predetermined positions on the circuit pattern 2.degree. 2 via the adhesive 3, separated by a space S. This space S is for mounting the leaded chip component 7, and is slightly wider than the width when the lead wires 6, 6 are led out substantially parallel to the printed circuit board surface. As a result, the chip parts 4.5 and each lead wire 6
．． 6 is defined as the margin j method 11.

On the other hand, the leaded chip component 7 is placed on the top surface of the circuit pattern 2.2 with the lead wire 6. 6 is raised above the upper surface of the adjacent chip component 4.5, for example, the surface 1f8 of the chip component 4.5.
i4a, 5a height from d1 circuit pattern 2 to lead F
If the height up to ii6 is D, the height D up to the lead wire 6 is 61 minutes higher than the height d of the surface electrodes 4a and 5a)
2 and lead to the surface electrodes 4a and 5a! 96.6 are arranged so that they do not touch each other.

In this way, according to the mounting structure of the leaded chip component of this embodiment, the upper surfaces J, S, of the chip components 4, 5 adjacent to which the lead wires 6, 6 of the leaded chip component 7 are also floated by a height of 61 minutes. Since the leaded chip component 7 is installed, the conventional allowance dimension j)Fllll! Even if there is no space between the chip components 4.5 and the lead wires 6 that are temporarily fixed,
．． There will be no contact with 6. Therefore, the unnecessary space between each chip component 7 with a 4.5° lead on the board can be reduced, chip components can be mounted at high density, and the device itself can be made smaller.

In addition, there is a height of 6 between the chip component 4.5 and the lead wire 6.6.
If a margin of 1 minute is provided, the amount may be changed depending on the amount of adhesive 3 applied.

Further, the mounting number of the leaded chip component configured as described above is performed, for example, as follows.

First, a printed circuit board 1 is prepared, circuit patterns 2, 2 are formed on the printed circuit board 1 while being separated by a predetermined distance, and an adhesive 3 is applied between each circuit pattern 2.2. After that, the surface electrodes 4a, 4a and 5a, 5a of the chip components 4, 50, respectively.
are placed at predetermined positions on the circuit pattern 2.degree. 2, and the respective chip components 4.5 are temporarily fixed. Roughly speaking, the leaded chip component 7 has the lead wire 6.6 facing upward, and the lead wire 6.6 is approximately parallel to the printed circuit board surface, so that the lead wire 6.6 is placed approximately between the chip components 4.5. Place it in the center and temporarily fix it with adhesive 3. The printed circuit board 1 with the components arranged in this manner is immersed in a solder bath (not shown), and connected and fixed using solder 8 as shown in FIG.

The leaded chip component 7 attached in this way is
This prevents any displacement of the temporarily fixed chip component 4.5, and also prevents the leaded chip component 7 itself from shifting.

Next, another embodiment of the present invention will be described.

FIG. 2 shows a mounting structure for a chip component with leads, in which the space S between the chip components 4 and 5 is made shorter than that in FIG. 1, and the allowance dimension j1 is eliminated.

By arranging the leaded deep part 7 in this way,
The 13m connection between the surface electrodes 4a, 5a and the lead a6.6 using the solder 8 becomes more reliable, and each chip component 4.5. Unnecessary space between the lead and one-deep components 7 can be reduced, and electronic components can be mounted more densely than in the previous embodiment.

[Effects of the Invention] As explained above, according to the present invention, when chip components with leads are mounted on a circuit board, an allowance is provided between adjacent chip components so that they do not come into contact with each other. This has the effect of not only preventing this, but also reducing unnecessary space and allowing chip components to be mounted at high density.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing one embodiment of a mounting structure for a leaded chip component according to the present invention, FIG. 2 is an explanatory diagram showing another embodiment of the present invention, and FIG. It is an explanatory view showing a mounting structure. 1...Printed board 2...Circuit pattern 3.
...Adhesive 4.5...Chip parts 4a,
Figure 2

Claims (1)

[Scope of Claims] A printed circuit board on which a circuit pattern is formed at a predetermined position, and first and second chip components having surface electrodes formed on both ends thereof and disposed on the circuit pattern while being separated by a predetermined distance. Lead wires are led out from both ends, and the component body side is fixed to the printed circuit board with the lead-out side facing upward, and the lead wires are brought into close proximity to connect to the surface electrodes of the first and second chip components. 1. A mounting structure for a leaded chip component, characterized by comprising a leaded chip component arranged in the leaded chip component.