JPS63150910A - Manufacturing apparatus for chip component strip - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (Field of Industrial Application) The present invention measures electrical characteristics such as capacitance of chip parts such as chip capacitors, attaches a mark to the chip part, and prints the mark. The present invention relates to an apparatus for manufacturing a series of chip parts that automatically sequentially and automatically arranges chip parts on a tape after drying.

(Prior Art) It is common for chip components to be attached to a printed circuit board automatically using a chip component mounting machine.In order to supply chip components to such a chip component mounting machine,
A chip with a configuration in which a chip component is placed on the embossment of a tape with an embossed part and covered with lid tape, or a chip with a configuration in which a hole is punched in paper tape, a chip component is placed in the hole, and the chip component is placed in the hole and covered with lid tape from both sides. - A series of pump parts is increasingly being used.

Conventionally, when manufacturing such a series of chip parts,
Measurement of electrical characteristics such as e-tolerance, resistance value, and inductance of a predetermined number of chip components is carried out using a dedicated measurement machine.
After the measurement, a predetermined number of chip components were stamped using a dedicated stamping machine, and a final chip series was made using a dedicated machine for placing the predetermined number of chip components on a tape after the stamping was completed.

(Problems to be solved by the invention) By the way, when carrying out each process with each of these dedicated machines,
Each time one process of one dedicated machine is completed, it is necessary to manually store the chip parts and transfer them to the supply section of the next dedicated machine, which is inefficient and results in insufficient labor-saving effects. In addition, countermeasures against defects such as chips in chip components are insufficient, and if defective chip components are mixed in,
82 machines were stopped and defective parts were removed by hand.

(Means for Solving the Problems) In view of the above points, the present invention provides a process for measuring electrical characteristics such as capacitance of a chip component such as a chip capacitor, and a step of attaching an indication (stamping) to the chip component. ) Process, indication (seal)
The present invention aims to provide a highly reliable chip component serial manufacturing device that can sequentially and automatically perform the steps of drying the chips and arranging the chip components on a tape, and can also automate the removal of defective components.

The present invention includes a first index table that rotates intermittently, and a chip component mounted on the first index table.
a supply unit that supplies the chip parts individually, a measurement unit that measures the electrical characteristics of the chip parts transferred by the first index table, and a measurement unit that measures the electrical characteristics of the chip parts transferred by the first index table; A marking section for attaching a display;
a second index table that rotates intermittently; a conveying means for conveying normal chip parts sent out from the first index table to the second index table; and a conveying means disposed in the middle of the conveying means. The above-mentioned problems of the prior art are solved by a configuration including display drying means and suction pins that suction the simmering chip components transferred by the second index table and arrange them on the four parts of the tape.

(Function) In the chip component series manufacturing apparatus of the present invention, while the chip components are being transferred by the first index table, the electrical characteristics such as capacitance, resistance value, and inductance of the chip components are measured; and (e) it is possible to print a display to identify the main capacitance value, resistance value, inductance value, etc.

Further, the markings attached to the chip components can be dried while the chip components are being transported from the first index table to the second index table by the transport means, and the chip components after the display has been dried are transferred to the second index table.・Transfer the tape onto the table and use a suction bottle to emboss the tape.
Chip components can be placed in the area. Therefore, it is possible to eliminate the need for manual work when manufacturing a series of chip parts, and it is possible to achieve sufficient labor savings. In addition, by providing a separation structure in the supply section that separates chip components one by one, it is possible to detect defects in the shape of chip components (mixing of chip components of different shapes, cracks, chips, etc.). It is also possible to detect defective electrical characteristics such as capacitance, resistance value, inductance, etc. in the measuring section and to discharge and remove chip components with defective characteristics from a specific position of the first index table. . Therefore, it is possible to prevent the apparatus from stopping due to defective parts, and since manual labor is not required to remove defective parts, monitoring during operation and maintenance work can be simplified.

(Example) Hereinafter, an example of the chip component series manufacturing apparatus according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic plan view showing the overall configuration of the present invention, and FIG. 2 is a perspective view thereof. First, an outline of the overall configuration of these figures will be explained.

In these figures, the first index table 1, which rotates intermittently, is surrounded by a supply section 2 that supplies chip components, and a measurement section '3 that measures the electrical characteristics of the chip components (however, if the chip component is a chip capacitor) (In the case of a chip resistor, measure the capacitance, in the case of a chip resistor, measure the resistance value, and in the case of a chip inductor, measure the inductance)
Also, a marking section 4 is arranged to display (seal) the capacitance value, resistance value, inductance value, etc. of the chip component.

A vibration feeder 6 as a conveyance means and a timing belt connected thereto are used between the second index table (hereinafter referred to as taping index table) 5 which rotates intermittently and the first index table 1. The belt Figua is placed. At the top of the vibrating feeder 6, there is an indication (
A drying section 8 for drying the stamp) is arranged.

A taping index table 5 (a tape 9 having concave portions at equal intervals for storing chip components so as to be in contact with each other) is intermittently run, and the chips transferred by the taping index table 5 are A taping portion 10 having suction pins is provided to place the component in the recessed portion of the tape 9.

A lid tape (for example, heat-adhesive tape) for closing the four openings is attached to the tape 9 on which the chip components are placed in the recesses.

Next, each part will be explained in detail.

Now, as shown in FIG. 2, the supply section 2 is equipped with a parts bowl 15 containing a large number of chip parts therein and a linear feeder 16. Chip components are fed to the linear feeder 16 at a substantially constant rate.

#IJ As shown in FIGS. 3 and 4, the supply section 2 is provided with a separation mechanism 17 on the tip side of the linear feeder 16 for separating chip components one by one and detecting defective shapes of the chip components. The linear feeder 16 uses vibration to advance the chip components, and finally aligns them in a line and feeds them to the separation mechanism 17. Furthermore, in order to smoothly advance the chip components, an air jet is used to advance the chip components. is used. That is, the air jet nozzle 18 arranged on the ceiling of the linear feeder 16 as shown in FIGS. 3 and 5
Air is blown in the forward direction of the chip components 20 to assist the propulsion force of the linear feeder 16, and even if the continuous state of the chip components 20 is interrupted, the chip components 20 at the leading edge are pushed and sent to the separation mechanism 17. That's what I do.

Details of the separation mechanism 17 are shown in Fig. 3, fIS Fig. 4, and Fig. 6.
As shown in FIG. In these figures, a separation slider 22 in which a separation groove 21 connectable to the groove in which the chip components of the linear feeder 16 are aligned is provided so as to be slidable in a direction perpendicular to the linear feeder 16. An insertion guide 24 in which a guide groove 23 is formed so as to be connectable to the separation groove 21 is fixed to the separation pH structure 7 frame 25.

As shown in FIG. 8, the groove in which the chip components 20 of the linear feeder 16 are aligned in one line, that is, the alignment groove 26, and the separation groove 21 of the separation slider 22 have the same width, and the separation groove 21 is normal. It has a length that substantially matches the longitudinal dimension of the shaped chip component 20 . The separation groove 21 connects to the alignment groove 26 on the linear feeder side before the separation slider 22 slides, and connects to the id groove 23 on the insertion guide 24 side after the slider 22 slides.

On the front side of the separation B [7 frame 25, there is a separation lever 27.
The upper end of the separation lever 27 is connected to the separation slider 22 as shown in FIGS. 6 and 7, and the roller 28 at the lower end comes into contact with a cam 30 fixed to a rotating shaft 29. . Separation mechanism frame 25 and separation lever 27
The extension spring 31 between the roller 28 and the cam 30 urges the roller 28 in a direction that presses the roller 28 against the cam 30.

Further, a pusher lever 35 is pivotally supported on the separation mechanism frame 25 as shown in FIG.
5 is connected to a butcher slig 36 shown in FIG. 7 that slides in a direction parallel to the linear figure 16.
A pusher 37 is attached to the tip of the slider 36. This pusher 37 is for pushing out the properly shaped chip component 20 separated by the separation groove 21 of the separation slider 22 into the id groove 23 of the insertion id 24.

The roller 40 at the lower end of the pusher lever 35 is the fourth
It comes into contact with a cam 41 fixed to the rotating shaft 29 shown in FIGS.

As shown in FIG. 3, a shutter 38 is provided to prevent the chip components in the separation fi 21 from floating up, and a shutter 38 is provided to prevent the chip components from floating up when the pusher 37 pushes the chip components separated by the separation slider 22. A lever 39 is pivotally mounted on the bushing slider 36.

The separation operation principle of the separation slider 22 is shown in Fig. f58 and Fig. 9. If the chip component 20 fed from the linear figure 16 has a normal shape, the chip component 20 will fit perfectly into the separation groove 21 as shown in FIG.
7, the separation slider 22 slides in the direction of arrow P. That is, the separation of each chip component 20 can be performed normally.

Conversely, if the shape and dimensions of the chip component are abnormal, i.e.
If a different type of chip component is mixed in, or if there is a crack or chip, the chip component 20A with a defective shape may be removed as shown in Figure 9.
Subsequently, the next chip component 20 enters the separation groove 21, and the separation slider 22 cannot move.

In order to detect such movement of the separation slider 22,
As shown in FIGS. 3 and 10, a detection bar 45 that moves together with the slider 22 and a separation detection sensor (proximity sensor, etc.) 46 fixed to the separation mechanism frame 25 are provided.

As is clear from the explanation of the above-mentioned figure tjIJ9, when a chip component with a defective shape arrives, the separation slider 22 stops, and the separation operation cannot be continued.

As shown in Figure 3, the recovery suction bottle 4
7 is attached to the tip of an arm 49 rotated by a motor 48, the suction bottle 47 is lowered onto the separation groove 21 as shown in FIG. 11, and the malformed chip component 20A is separated by the vacuum suction force of the suction bottle 47. It is designed to be removed by suction from the groove 21. Note that the suction bottle 47 is connected to a vacuum pump via a vacuum suction hose 44.

The operation of the above supply section 2 is summarized as follows. The chip parts 20 in the parts bowl 15 are Lini 7 Fig. 1
6, and thereby sent into the separation groove 21 formed in the separation slider 22 of the separation mechanism 17. If the chip component 20 is normal, the separation slider 22 as shown in FIG.
slides in the direction of arrow P, and the separation groove 21 connects to the id groove 23 of the insertion id 24. Then, the separated chip component 20 is pushed into the id groove 23 by the pusher 37 while being held down by the holding lever 39 as shown in FIG. 12(A). Note that the presser lever 39 is the pusher lever 37.
In the standby state where the chip is retracted, the tip is raised as shown in FIG. 12 (B) so as not to interfere with the separation and stacking of the next chip component 20.

When a chip component with a defective shape enters the separation groove 21 as shown in FIG. 9, the separation slider 22 becomes unable to slide, which means that the detection bar 45 in FIG. 10 cannot approach the detection sensor 46. The separation groove 21 is detected as shown in FIG.
As soon as the shutter 38 that covered the
is activated, and the recovery suction bin 47 descends to suction, transfer, and remove the defective chip component 2OA. This allows the next normal chip component 20 to be separated and inserted into the id 24.
Sending to continues.

FIGS. 13 and 14 show the first index table 1 and its associated +P! The structural parts are shown.

In these figures, disk-shaped index table 1
has a flat peripheral portion 50, and four positioning portions 72 are formed (at 30 degree intervals) corresponding to positions Q to Q + 2 which are obtained by dividing the entire circumference on which the chip component 20 is to be placed into twelve. Further, suction holes 51 are formed in portions of the flat peripheral portion 50 corresponding to the chip component mounting positions Ql to QI2. Furthermore, push rods 52 are provided so as to slide radially so as to be able to protrude from each of the four positioning parts 72 (
However, in FIG. 13, illustration of some of the push rods 52 is omitted).

Such an index table 1 is fixed to a rotating shaft 53, and the rotating shaft 53 is supported on the support frame 54 side via a bearing 55, and the rotating shaft 53 rotates the index table 1 at 30 degree intervals. It is connected to a stepping motor 56 for intermittent rotation.

an annular member 58 in which an annular suction groove 57 is formed so as to communicate with each suction hole 51 of the index table 1;
is arranged on the support frame 54, and the annular suction groove 57 is connected to a vacuum pump via a vacuum suction hose 59.

The annular member 58 is in pressure contact with the bottom surface of the index table 1.

A push rod slider 60 to which the push rod 52 is attached is provided with a roller 61, and the roller 61 is urged by a compression spring 63 so as to come into contact with a fixed cam 62 fixed around the rotating shaft 53.

This fixed cam 62 keeps the push rod 52 in a retracted state from positions Ql to Q in FIG. That is, position Q
, the chip component sent out from the insertion id 24 of the supply section 2 is supplied, and the electrical characteristics of the chip component are measured by the measuring section 3 at position Q4 (However, if the chip component is a chip capacitor, The capacitance is measured in the case of a chip resistor, the resistance value in the case of a chip inductor, and the inductance in the case of a chip inductor). etc. are stamped on the chip parts. Then, in order to discharge chip parts with defective electrical characteristics, position Q +
At +, the fixed cam 62 causes the push rod 52 to protrude.

Furthermore, at position Q, chip parts with normal electrical characteristics must be fed to the next-stage vibrating feeder 6, while chip parts with poor characteristics must be transferred to position Q1° without being fed out. For this reason, as shown in FIG. 15, a movable cam 65 is brought into contact with the roller 61 instead of the fixed cam 62 at position Q9. This movable cam 65 is fixed to a movable slider 66, and the movable slider 66 is arranged horizontally on the support frame 54, and the slide guide shaft 6 is fixed.
7 so as to be slidable. Movable slider 6
6, the roller 68 at the tip of the first index
When the table 1 is stopped, the movable cam 65 can come into contact with a rotating cam 69 that generates an operating force that advances the movable cam 65 in the direction in which the push rod 52 protrudes. Further, an air cylinder 70 is connected between the movable slider 66 and the support frame 54, and when the air cylinder 70 is in a linear motion state, the movable cam 65 is in a retracted state, and the roller 68 is separated from the rotating cam 69. However, feeding of the chip components to the vibratory feeder 6 at position Q is not executed. Said air shilling 70
When the index table 1 is in an extended state, the roller 68 comes into contact with the rotary cam 69, and the movable cam 65 moves forward periodically to project the push rod 52 when the index table 1 is stopped, and the chip parts at the position Q are transferred to the vibrating feeder. Send on 6.

16 and 17 show the mechanical components of the measuring section 3. FIG. In these figures, the first index
A pair of arms 76A and 76B are pivotally attached to a vertical bar 75 that moves up and down in synchronization with the table 1, and each arm 76A,
Contacts 77A and 77B are attached to the tip of 76B. Further, each arm 76A, 76B is biased downward by a compression spring 78A, 78B, respectively.

The upper and lower bars 75 of the measuring section 3 are in the raised position during the rotation period of the index table 1 in FIG. 13, and in the lowered position during the stop period, and are at the position Q.

Press the pair of contacts 77A and 77B against the electrodes at both ends of the chip component 20 that has come to the end, and measure the capacitance if the chip component 20 is a chip capacitor, the resistance value, and the chip inductor if the chip component 20 is a chip capacitor. In this case, the inductance is measured using a measuring device (not shown).

As shown in FIG.
It is moved up and down periodically in synchronization with the movement of , and the chip component that has come to position Q7 in FIG. 13 is marked with, for example, ink that is cured by ultraviolet light. That is, the roller 80 is in the raised position during the rotation period of the index table 1, and is lowered during the stop period to perform the stamping operation. For example, if the chip component is a chip capacitor, the capacitance value, if it is a chip resistor, the resistance value, if it is a chip inductor, the inductance value, etc. are stamped.

Note that the chip component detection sensor 85 is arranged as shown in FIG. 2 in correspondence with the position Q1 in FIG.
1, and after the sensor 85 detects the presence of the chip component, the index table 1 is rotated.

The operation of the first index table 1 described above is summarized as follows. Insertion of the supply unit 2 via the id 24 to the position Q of the first index table 1 in FIG.
When a chip component is fed into the index table 1, the index table 1 attracts and holds the chip component using the vacuum suction force of the suction hole 51, and when the chip component detection sensor 85 shown in FIG. 2 detects the presence of a chip component at the position Q1. , index table 1 rotates by 30 degrees and stops.

As a result, the chip component located at position Q1 is transferred to position Q2. In this way, the chip components are intermittently transferred by 30 degrees, and the measurement unit 3 measures the electrical characteristics of the chip components at position Q, and the marking unit 4 stamps the chip components at position Q7. Ru. And measurement section 3
As a result of the measurement, the chip parts determined to be non-defective are moved to the push rod 5 at position Q by the action of the movable cam 65 shown in FIG.
2 protrudes and is sent to the next stage vibrating feeder 6.

On the other hand, the chip components determined to have poor characteristics by the measuring section 3 are
It passes through position Q and reaches position Q I 1, where the push rod 52 protrudes under the action of the fixed cam 62, so that the defective product tray shown in FIGS. 1 and 2 is discharged into the box 86. Ru.

The vibration feeder 6 has a base 90 as shown in FIG.
In this structure, a vibration table 91 is attached to the vibration table 91 using a leaf spring 92, and vibration is applied to the vibration table 91 using an electromagnet 93 excited by AC.

As a result, as shown in FIG.
The chip components are aligned in one line and advance in the direction of arrow R.

A drying section 8 is arranged above the vibrating feeder 6.

This drying section 8 uses an ultraviolet generator 96 to irradiate the chip components passing through the vibrating feeder 6 with ultraviolet rays when the marking section 4 employs ink that is cured by ultraviolet rays. The chip components that have been subjected to the drying process while passing through the vibrating feeder 6 are sent to the next stage belt figurine.

FIG. 19 shows details of the belt figurine, the taping index table 5 following it, and the taping section 10.

Belt Figua uses a timing belt 100, and the timing belt 100 is stretched between a belt pulley 101 and another belt pulley (not shown), and the belt pulley 101 transmits the rotational force of a motor 102. belt 10
Receive via 3.

The disk-shaped taping index table 5 is driven to rotate intermittently by a stepping motor 105, and has notched grooves 106 into which chip components 20 are inserted at equal intervals, as shown in FIG. Also, what about the bottom of the taping index table 5? tS2
In the fixed receiver having the shape shown in FIG. 1, a plate 107 is fixedly arranged. This fixed receiver plate 107 is the timing belt 100
A notch 10 is provided at a position S, which receives the chip component 20 from the
If the chip parts are placed in the tape 9, which has four parts spaced at equal intervals to accommodate the chip parts, fi! S
2 has a notch 109. Position S1 to 82
The section on the way to the taping index table 5 serves as the bottom surface of the notch groove 106, and supports the chip component 20 fitted in the notch groove 106.

When transferring the chip component 20 using such a taping index table 5, it is sufficient if the chip component 20 transferred by the timing belt 100 fits deep into the notch groove 106 as shown in FIG. If the taping index table 5 moves while the chip component 20 is only halfway inside the cutout groove 106 as shown in FIG. 23, the chip component 20 will crack and chip. Therefore, as shown in FIGS. 19 and 23, the chip component detection sensor (for example, an optical sensor) 110 is placed at the position S
1, and after detecting that the chip component 20 is fully inserted into the notch groove 106, the taping index table 5 is rotated.

As shown in FIG. 19, the taping portion 10 has a suction pin 115 at position S2. This suction pin 115 is used to suction and hold the chip component with a vacuum suction force, and is connected to a vacuum pump via a vacuum suction hose 116. This suction pin 115 is fixed to the tip of an inverted arm 118 that is pivotally supported on the taping part frame 117.
A compression spring 119 is arranged in a direction that raises the tip of the spring 18. Note that the arm 118 is lowered by a lever/id (not shown). The drum 125 for causing the tape 9 to travel intermittently is rotated intermittently by a stepping motor 126.

As shown in Figure PJ20, the tape 9 is configured to intermittently run under the taping index table 5 at position S2.

Above belt feeder 7, taping, indexing,
The operations of the table 5 and the taping section 10 are summarized as follows.

The belt feeder 7 is running continuously, and the vibration feeder 6
The chip parts 20 that have been dried are received from the taping index table 5 and are continuously transferred to the taping index table 5.

The chip component detection sensor 110 is located in the notch groove 106 at position S1.
After detecting that the chip component 20 is completely fitted as shown in FIG. 22, the stepping motor 105 is activated and the taping index table 5 is rotated by a predetermined angle.

By intermittent rotation of the taping index table 5, the chip components 20 are separated one by one and transferred to the taping section 10.

The suction pin 115 in the taping part 10 is #S24
As shown in the figure, the chip component 20 is taped at position S2.
When it is transferred by the intermittent rotation of the index table 5, it is held by suction and lowered. And ra
In S2, the chip components 20 are arranged on the stopped tape 9 as shown in the four chip component storage parts 1201=FA25 formed at equal intervals. tIIJ24 In the figure, 121 is a tape guide for guiding the tape 9.

Thereafter, the suction pin 115 releases the chip component and returns to the raised position shown in FIG. 26, and the tape 9 advances in the direction of arrow T by the distance between the recesses 120. Then, the next vacant fourth section 120 is placed at position M S 2. Such operations are repeated and the chip components 20 are successively moved into the recesses 120 of the tape 9.
will be placed in

Note that the tape 9 on which the chip component 20 is placed is covered with, for example, a heat adhesive tape, but since this process itself is a well-known technique, the details will be omitted.

(Effects of the Invention) As explained above, according to the chip component serial manufacturing apparatus of the present invention, the first index table that rotates intermittently and the chip components are supplied one by one to the first index table. a supply unit, a measurement unit that measures the electrical characteristics of the chip components transferred using the first index table, and a marking that displays the chip components transferred using the index table of tjIJ1. a second index table that rotates intermittently;
a conveyance means for conveying normal chip parts sent out from the first index table to the second index table; a display drying means disposed in the middle of the conveyance means; The structure is equipped with suction pins that suction the chip parts transferred on the table and place them on the four parts of the tape, so it is possible to measure the electrical characteristics such as the capacitance of chip parts such as chip capacitors. The process of attaching a mark (stamping) to the
The process of drying the display (stamping) and the process of arranging the chip parts on the tape are automatically executed sequentially, and the removal of defective parts is also automated, improving reliability and saving labor on monitoring and maintenance work. can be achieved.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view showing the overall configuration of an embodiment of the chip component serial manufacturing apparatus according to the present invention, tIS 2 is a perspective view showing the overall configuration of the embodiment, and FIG. 3 is a configuration of the supply section in the embodiment. 4 is a right side view of the supply section with a portion omitted, FIG. 5 is a side sectional view showing the linear feeder portion of the supply section, rIf, and FIG. 6 is a front view of the supply section with a portion omitted. figure,
Figure g7 is a left side view of the supply section with some parts omitted, Figures 8 and 19 are explanatory diagrams showing the operation of the separation mechanism portion of the supply unit, and Figure 10 is a perspective view showing the separation detection sensor provided in the separation mechanism. Figure 11 is a perspective view illustrating the process of removing malformed chip components in the separation mechanism, Figure 12 is a diagram illustrating the operation of the pusher in the separation mechanism, and Figure 13 is a plan view showing the first index table. , Fig. 14 is a side cross-sectional view showing the index table and the accompanying mechanical part, Fig. 15 is a plan view showing the mechanical part that drives the push rod of the index table, and Fig. 516 is a mechanical part of the measuring section. The front view shown in FIG. 17 is the same plan view, and the FIG. 18
The figure is a side view showing the vibration feeder and the drying section, FIG. 19 is a side sectional view showing the belt feeder, the second index table (taping index table), and the taping section, and FIG. 20 is the index table of tIS2. FIG. 21 is a schematic plan view of the table portion, and FIG. 21 is a schematic plan view of the fixed plate placed under the second index table. FIGS. 22 and 23 are diagrams showing the operation of the second index table. The explanatory diagrams to be described, FIGS. 24 to 26, are explanatory diagrams showing the operation of the taping section. DESCRIPTION OF SYMBOLS 1... First index table, 2... Supply section, 3... Measuring section, 4... Marking section, 5...
Second index table, 6... Vibration feeder, 7... Belt feeder, 8... Drying section, 9...
Tape, 10... Taping part, 15... Parts bowl, 16... Linear feeder, 17... Separation mechanism, 20... Chip component, 22... Separation slider, 2
4...Insertion ID, 37...Butsusha-147,1
15... Adsorption pin, 50... Flat peripheral portion, 51...
・Suction hole, 52... Push rod, 62... Fixed cam, 6
5...Movable cam, 75...Upper and lower bar, 77A, 77
B... Contactor, 85, 110... Chip component detection sensor, 100... Timing belt, 106... Notch groove, 120... Four parts.

Claims (4)

[Claims] (1) A first index table that rotates intermittently;
a supply unit that supplies the chip components one by one to the first index table; a measurement unit that measures the electrical characteristics of the chip components transferred by the first index table; a marking section for marking the chip components transferred by the index table; a second index table that rotates intermittently; and a marking section for marking the chip components transferred from the first index table. A conveying means for conveying to the index table, a display drying means disposed in the middle of the conveying means, and a suction device for suctioning the chip components transferred by the second index table and placing them in the recesses of the tape. A chip component series manufacturing device characterized by being equipped with a pin. (2) The supply unit includes a separation mechanism for separating chip components one by one and detecting defective chip components, and means for removing defective chip components. The chip component series manufacturing device according to item 1. (3) The first index table has a means for discharging chip components with defective characteristics at a position not connected to the conveyance means based on the measurement result of the electrical characteristics in the measurement section. A chip component series manufacturing device according to scope 1. (4) The second index table has grooves corresponding to the shape of the chip components at equal intervals, and the chip components completely enter the grooves corresponding to the grooves that receive the chip components from the conveying means. The chip component series manufacturing apparatus according to claim 1, wherein a sensor for detecting is disposed.