JPH0528768Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Field of Application) The present invention relates to a chip part measuring and marking device in a chip part series manufacturing apparatus, etc., which arranges chip parts on a tape.

(Prior art) It has become common practice to automatically attach chip components to a printed circuit board using a chip component mounting machine. Chip parts are arranged in an embossed piece of tape with a recess and covered with lid tape, or a hole is punched in paper tape, a chip part is placed in the hole, and the chip parts are covered from both sides with lid tape. Ren is increasingly being used.

Conventionally, when manufacturing such a series of chip parts, the electrical characteristics such as capacitance, resistance value, and inductance of a predetermined number of chip parts were measured using a dedicated measuring machine, and after the measurement, the predetermined number of chip parts was measured. The stamping of chip parts was carried out using a dedicated stamping machine. After stamping, a special machine was used to place a predetermined number of chip parts on the tape to form the final series of chip parts.

(Problem that the invention aims to solve) By the way, when carrying out each process with each of these dedicated machines, each time one process of one dedicated machine is completed, the chip parts are stored and transferred to the supply section of the next dedicated machine. The transportation of the materials had to be carried out manually, which was inefficient and resulted in insufficient labor-saving effects.

(Means for Solving the Problems) In view of the above points, the present invention is designed to measure the electrical characteristics of chip components at the measuring section and at the marking section while the chip components are intermittently transferred using a disc-shaped index table. It is an object of the present invention to provide a chip part measuring and marking device which can save labor and improve efficiency during the production of chip parts or a series of chip parts by sequentially marking each chip part.

The present invention includes: a disc-shaped index table that suctions and holds chip parts at equal angular intervals and rotates intermittently; a measuring section that measures the electrical characteristics of the chip parts transferred by the disc-shaped index table; a marking section for marking the chip parts transferred by the disc-shaped index table;
and a conveyance means for receiving the chip parts discharged from the disk-shaped index table at a non-defective part discharge position after passing through the measurement part and the marking part.
The disk-shaped index table has positioning recesses at equal angular intervals on which chip parts are placed, suction holes for sucking the chip parts on the positioning recesses, and a push rod slidable in the radial direction. , the measurement unit includes an arm pivoted to upper and lower members that move up and down in synchronization with the disc-shaped index table and biased downward, and an arm attached to the tip of the arm that measures the end of the chip component in the lowered position. The stamping section has a roller having the marking which rotates with the intermittent rotation of the disc-shaped index table to execute the stamping operation. Furthermore, a fixed cam for causing the push rod to protrude at the defective product ejection position and a movable cam for causing the push rod to protrude at the non-defective product ejection position are provided. If the chip parts have defective characteristics based on the measurement results of the electrical characteristics in the measuring section, the movable cam is not operated and the chip parts are ejected at a defective product ejection position that is not connected to the conveyance means. With this configuration, the problems of the prior art described above are solved.

(Function) In the chip component measuring and marking device of the present invention,
While the chip parts are being intermittently transferred on the disc-shaped index table, the capacitance of the chip parts,
Measurement of electrical characteristics such as resistance value and inductance,
It is possible to print a display to identify the capacitance value, resistance value, inductance value, etc. Then, the regular chip parts are delivered to the conveying means by the push rod of the index table at a specific position. Furthermore, chip parts with poor electrical characteristics are ejected by the push rod at a position not connected to the conveying means.

(Example) Hereinafter, an example of the chip component measuring and marking device according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic plan view showing the overall configuration of the present invention;
FIG. 2 is a schematic perspective view of the same. As shown in these figures, around a disk-shaped index table 1 that rotates intermittently at a constant cycle, there is a supply section 2 that supplies chip components one by one to the index table 1, and a supply section 2 that measures the electrical characteristics of the chip components. Measuring unit 3 (however, if the chip component is a chip capacitor, measure the capacitance, if it is a chip resistor, measure the resistance value, and if it is a chip inductor, measure the inductance), A marking unit 4 for displaying (stamping) the capacitance value, resistance value, inductance value, etc., and a conveyor for transporting chip parts with normal electrical characteristics to the next process (for example, a process for drying the stamps, etc.) 5, and a defective product receiving box 6 for receiving chip parts determined to have defective characteristics.

FIG. 3 shows the disc-shaped index table 1, and FIGS. 4 and 5 show mechanical parts associated with the disc-shaped index table 1. In these figures, the disk-shaped index table 1 has a flat peripheral edge 10, and is divided into 12 positions Q ₁ to Q ₁₂ (at 30 degree intervals) on which the chip parts 20 are to be placed. ) A positioning recess 11 is formed. In addition, suction holes 51 are formed in portions of the flat peripheral portion 10 corresponding to the chip component placement positions Q ₁ to Q ₁₂ . Furthermore, push rods 52 are provided so as to slide radially so as to be able to protrude from each positioning recess 11 (however, some of the push rods 52 are omitted in FIG. 3).

Such an index table 1 is fixed to a rotating shaft 53, which is supported by a support frame 54 via a bearing 55, and further rotates the index table 1 intermittently at 30 degree intervals. It is connected to an index 56 for rotation.

An annular member 58 in which an annular suction groove 57 is formed so as to communicate with each suction hole 51 of the disc-shaped index table 1 is disposed on the support frame 54, and the annular suction groove 57 is connected to a vacuum suction hose 59.
Connected to the vacuum pump via. The annular member 58 is in pressure contact with the bottom surface of the index table 1.

Push rod slider 6 with push rod 52 attached
0 is provided with a roller 61, and the roller 61
is urged by a compression spring 63 so as to come into contact with a fixed cam 62 fixed around the rotating shaft 53.
This fixed cam 62 keeps the push rod 52 in a retracted state from positions Q ₁ to Q ₈ in FIG. That is, the chip component sent out from the supply section ₂ is supplied at position Q1, and the electrical characteristics of the chip component are measured by the measuring section 3 at position _Q4 (However, if the chip component is a chip capacitor, (measure the capacitance in the case of a chip resistor, the resistance value in the case of a chip resistor, and the inductance in the case of a chip inductor), and the capacitance value, resistance value, and inductance value by the marking part ₄ at position Q etc. are stamped on the chip parts. In order to eject chip parts with defective electrical characteristics, the push rod 52 is moved by the fixed cam 62 at position Q ₁₁ (defective product ejection position).
becomes a prominent state.

In addition, at position Q ₉ (good product discharge position), chip parts with normal electrical characteristics are sent to the next stage transport section 5, and chip parts with poor characteristics are not sent out and are transferred to position Q _10.
must be transferred to For this purpose, as shown in _FIG .
Instead, the movable cam 65 comes into contact with the roller 61. The movable cam 65 is fixed to a movable slider 66, and the movable slider 66 is arranged horizontally on the support frame 54 and is slidably provided on a fixed slide guide shaft 67. The roller 68 at the tip of the movable slider 66 is
When the index table 1 is stopped, the movable cam 65 can come into contact with a rotating cam 69 that generates an operating force to advance the movable cam 65 in the direction in which the push rod 52 protrudes. Further, an air cylinder 70 is connected between the movable slider 66 and the support frame 54, and when the air cylinder 70 is in the retracted state (defective product detection state), the movable cam 65 is in the retracted state, and the roller 68 is in the retracted state. Separated from the rotating cam 69,
The chip component is not delivered to the transport section 5 at position _Q9 . When the air cylinder 70 is in an extended state, the roller 68 comes into contact with the rotating cam 69,
The movable cam 65 moves forward periodically to move the index.
When the table 1 is stopped, the push rod 52 is made to protrude, and the chip part at the position _Q9 is sent to the conveying section 5.

6, 7 and 8 show the mechanical components of the measuring section 3. FIG. In these figures, a vertical bar 75 is fixed to a vertical slider 30 supported by a vertical slide shaft. On the other hand, a measuring section cam 32 is fixed to the rotating shaft 31, and this measuring section cam 3
A roller 34 at the end of a lever 33 serving as a cam follower comes into contact with the roller 2 . The other end of the lever 33 is connected to the vertical slider 30.
connected to. Therefore, the vertical slider 30 and the vertical bar 75 move up and down in synchronization with the disk-shaped index table 1.

A pair of arms 76A, 76B are pivotally attached to the upper and lower bars 75, as shown in FIGS. 7 and 8, and a contact 77 is attached to the tip of each arm 76A, 76B.
A, 77B are attached. Further, each arm 76A, 76B has a compression spring 78A, 78B, respectively.
It is urged downward by 8B.

The upper and lower bars 75 of the measuring section 3 are in the raised position during the rotation period of the index table ₁ shown in FIG. When the chip component 20 is a chip capacitor, the capacitance is determined by pressing the pair of contacts 77A and 77B against the partial electrode.
In the case of a chip resistor, the resistance value is measured, and in the case of a chip inductor, the inductance is measured by a measuring device (not shown).

As shown in FIGS. 2 and 6, the stamping section 4 is
The roller 80, which has been given various markings, is linked to the movement of the index table 1, and the chip parts that have come to position _Q7 in FIG. 3 are marked with, for example, ink that is cured by ultraviolet light. That is, the roller 80 rotates intermittently in accordance with the intermittent rotation of the index table 1 at a constant period to execute the stamping operation. For example, if the chip component is a chip capacitor, the capacitance value, if it is a chip resistor, the resistance value, if it is a chip inductor, the inductance value, etc. are stamped.

Note that the chip component detection sensor 85 is arranged as shown in FIG. 2 in correspondence with the position _Q1 in FIG.
When the sensor 85 detects the presence of the chip component on the index table 1 of Q ₁ , the measurement operation of the measuring unit 3 is turned on at the timing when the chip component reaches position Q ₄ , that is, the upper and lower bars 75 are turned on. I am trying to perform a descending motion.

The operation of the above embodiment is summarized as follows. From the supply section 2, the disk-shaped index shown in FIG.
When a chip component is fed into position Q1 of table 1, index table ₁ suctions and holds the chip component using the vacuum suction force of the suction hole 51, and index table 1 rotates intermittently at a constant cycle of 30 degrees to pick up the chip. We will transport the parts. When the chip component detection sensor 85 shown in FIG. 2 detects the presence of a chip component at position _Q1 , it turns on the measurement operation of the measuring section 3 when the chip component at position _Q1 reaches position _Q4 . As a result, the measuring section 3 measures the electrical characteristics of the chip component at position _Q4 , and the stamping section 4 stamps at position _Q7 .
As a result of the measurement by the measurement unit 3, the chip parts determined to be non-defective are placed on the movable cam 65 in FIG.
Due to this action, the push rod 52 protrudes at position Q ₉ and is sent to the next stage conveyance section 5 .

On the other hand, the chip component determined to have poor characteristics by the measuring section 3 passes through the position _Q9 and reaches the position _Q11 , where the push rod 52 is protruded by the action of the fixed cam 62, as shown in FIG. The defective product receiving box 6 shown in FIG. 2 is discharged.

Note that steps such as drying may be carried out in the next-stage transport section 5.

(Effects of the Invention) As explained above, according to the chip component measuring and marking device of the present invention, the electrical characteristics of the chip components can be measured and The marking of the display in the marking section can be performed sequentially for each chip component, and it is possible to save labor and improve efficiency in manufacturing chip components or serially manufacturing chip components.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view showing the overall configuration of an embodiment of the chip component measuring and marking device according to the present invention, FIG. 2 is a schematic perspective view of the same, and FIG. 3 is a plan view showing an index table in the embodiment. Figure 4 is a front cross-sectional view showing the index table and the mechanical parts associated therewith, Figure 5 is a plan cross-sectional view showing the mechanical part that drives the push rod of the index table, and Figure 6 is a front cross-sectional view showing the mechanical part that drives the push rod of the index table.
The figure is a partially sectional plan view showing the arrangement of the measuring part and the marking part with respect to the index table.
FIG. 7 is a front view showing the mechanical part of the measuring section, and FIG. 8 is a plan view thereof. DESCRIPTION OF SYMBOLS 1... Index table, 2... Supply section, 3... Measuring section, 4... Stamping section, 5... Conveying section, 6... Defective product receiving box, 10... Flat peripheral part,
20... Chip parts, 51... Suction hole, 52...
Push rod, 56... Index, 62... Fixed cam, 65... Movable cam, 75... Upper and lower bar, 76
A, 76B...arm, 77A, 77B...contact.

Claims (1)

[Scope of Claim for Utility Model Registration] A disc-shaped index table 1 that suctions and holds chip parts 20 at equal angular intervals and rotates intermittently;
A measuring section 3 that measures the electrical characteristics of the chip components transferred by the disc-shaped index table.
and a marking section 4 for marking the chip parts transferred by the disc-shaped index table;
and a conveyance means for receiving chip parts discharged from the disc-shaped index table at a non-defective discharge position after passing through the measuring section and the stamping part, and the disc-shaped index table 1 is provided with chip parts placed thereon, etc. Positioning recesses 1 at angular intervals
1, a suction hole 51 that suctions the chip component on the positioning recess, and a push rod 52 that is slidable in the radial direction.
The measurement unit 3 has an arm pivoted to an upper and lower member that moves up and down in synchronization with the disk-shaped index table and is biased downward, and an arm attached to the tip of the arm and in a lowered position. and a contactor capable of contacting the end electrode of the chip component, and the marking section 4 has a roller 80 with the mark on it that rotates with the intermittent rotation of the disc-shaped index table to execute the marking operation. further provided with a fixed cam for protruding the push rod 52 at the defective product discharge position and a movable cam for protruding the push rod 52 at the non-defective product discharge position; Based on the measurement results of the characteristics,
A chip component measuring and marking device characterized in that, in the case of a chip component with poor characteristics, the movable cam is not operated and the chip component is discharged at a defective component discharge position that is not connected to the conveying means.