JPS6315083U - - Google Patents
Info
- Publication number
- JPS6315083U JPS6315083U JP10899786U JP10899786U JPS6315083U JP S6315083 U JPS6315083 U JP S6315083U JP 10899786 U JP10899786 U JP 10899786U JP 10899786 U JP10899786 U JP 10899786U JP S6315083 U JPS6315083 U JP S6315083U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- patterning
- bonding
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 description 1
Description
第１図は本考案の断面図、第２図は従来のプリ
ント配線基板の上面図、第３図は本考案によるプ
リント配線基板の上面図である。 １，１′，１″，１…パツド、２…スルーホ
ール、３…配線部、４…（伝導性）接合剤、５，
５′…基板。
ント配線基板の上面図、第３図は本考案によるプ
リント配線基板の上面図である。 １，１′，１″，１…パツド、２…スルーホ
ール、３…配線部、４…（伝導性）接合剤、５，
５′…基板。
Claims (1)
- ２枚の基板を接合し、パターンのうち配線部分
をその接合面にパターニングすることを特徴とす
るプリント配線基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10899786U JPS6315083U (ja) | 1986-07-15 | 1986-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10899786U JPS6315083U (ja) | 1986-07-15 | 1986-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315083U true JPS6315083U (ja) | 1988-02-01 |
Family
ID=30986700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10899786U Pending JPS6315083U (ja) | 1986-07-15 | 1986-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315083U (ja) |
-
1986
- 1986-07-15 JP JP10899786U patent/JPS6315083U/ja active Pending