JPH0383956U - - Google Patents

Info

Publication number
JPH0383956U
JPH0383956U JP14407189U JP14407189U JPH0383956U JP H0383956 U JPH0383956 U JP H0383956U JP 14407189 U JP14407189 U JP 14407189U JP 14407189 U JP14407189 U JP 14407189U JP H0383956 U JPH0383956 U JP H0383956U
Authority
JP
Japan
Prior art keywords
pad
lead
semiconductor element
printed boards
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14407189U
Other languages
English (en)
Other versions
JP2521530Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989144071U priority Critical patent/JP2521530Y2/ja
Publication of JPH0383956U publication Critical patent/JPH0383956U/ja
Application granted granted Critical
Publication of JP2521530Y2 publication Critical patent/JP2521530Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す断面図、第２図
は本考案の実施例を示す斜視図、第３図は基板本
体を示す断面図、第４図は本考案の他の実施例を
示す斜視図、第５図は半導体素子の位置決めを示
す説明図、第６図は本考案のさらに他の実施例を
示す斜視図である。 図において、１……基板本体、１１……配線パ
ターン、１２……プリント板１３……パツド、２
……半導体素子、２１……リードである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 配線パターン１１を有するプリント板１２を平
    行に対向してなる基板本体１の前記プリント板１
    ２に、半導体素子２のリード２１を接続するパツ
    ド１３を設けるとともに、前記半導体素子２のリ
    ード２１を前記パツド１３に圧接状に接続するよ
    うに、対向するプリント板１２，１２間に圧入し
    てなることを特徴とする半導体モジユール。
JP1989144071U 1989-12-15 1989-12-15 半導体モジュール Expired - Fee Related JP2521530Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989144071U JP2521530Y2 (ja) 1989-12-15 1989-12-15 半導体モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989144071U JP2521530Y2 (ja) 1989-12-15 1989-12-15 半導体モジュール

Publications (2)

Publication Number Publication Date
JPH0383956U true JPH0383956U (ja) 1991-08-26
JP2521530Y2 JP2521530Y2 (ja) 1996-12-25

Family

ID=31690808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989144071U Expired - Fee Related JP2521530Y2 (ja) 1989-12-15 1989-12-15 半導体モジュール

Country Status (1)

Country Link
JP (1) JP2521530Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007204A (ja) * 2005-06-30 2007-01-18 Asics Corp 靴の中敷、及び靴、及び靴下

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624144U (ja) * 1985-06-24 1987-01-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624144U (ja) * 1985-06-24 1987-01-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007007204A (ja) * 2005-06-30 2007-01-18 Asics Corp 靴の中敷、及び靴、及び靴下

Also Published As

Publication number Publication date
JP2521530Y2 (ja) 1996-12-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees