JPS63149865U - - Google Patents
Info
- Publication number
- JPS63149865U JPS63149865U JP4369687U JP4369687U JPS63149865U JP S63149865 U JPS63149865 U JP S63149865U JP 4369687 U JP4369687 U JP 4369687U JP 4369687 U JP4369687 U JP 4369687U JP S63149865 U JPS63149865 U JP S63149865U
- Authority
- JP
- Japan
- Prior art keywords
- series
- surface mount
- adhesive
- mount components
- depressions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案に係る表面実装部品連の一例を
示す側断面図、第２図ａ〜ｃは同部品連の製造工
程を示す説明図、第３及び４図は同部品連で保持
可能な表面実装部品の別例を示す底面図、第５図
は本考案に係る表面実装部品連の変形例を示す側
断面図、第６図ａ〜ｄは第１図で示す部品連の電
子部品摘出工程を示す説明図である。
１，１：電子部品、２，２１，２２：キヤリア
テープ、２ａ，２ａ：窪み部、３，３：粘着剤。
Figure 1 is a side sectional view showing an example of a series of surface mount components according to the present invention, Figures 2 a to c are explanatory diagrams showing the manufacturing process of the series of parts, and Figures 3 and 4 are the series of parts that can be held together. 5 is a side sectional view showing a modified example of the surface mount component series according to the present invention, and FIGS. 6 a to 6 d are electronic components of the component series shown in FIG. 1. It is an explanatory view showing an extraction process. 1, 1: Electronic component, 2, 21, 22: Carrier tape, 2a, 2a: Hollow portion, 3, 3: Adhesive.
Claims (1)
さ窪み部を所定間隔毎に設け、その窪み部に基板
仮止め用の粘着剤を収容すると共に、この粘着剤
に付着させて電子部品をキヤリアテープに保持し
てなることを特徴とする表面実装部品連。 (2) 上記窪み部が、軟質樹脂で形成したキヤリ
アテープを半球形状に窪ませて付形されていると
ころの実用新案登録請求の範囲第１項記載の表面
実装部品連。 (3) 上記窪み部が、電子部品に付着する粘着剤
の数に応じて一個または複数個設けられていると
ころの実用新案登録請求の範囲第１項記載の表面
実装部品連。 (4) 上記粘着剤が、加熱で粘着力を発生するシ
リコン、アクリル系等の高分子材料でなるところ
の実用新案登録請求の範囲第１項記載の表面実装
部品連。[Scope of Claim for Utility Model Registration] (1) Relatively small depressions are provided at predetermined intervals on the tape surface of the carrier tape, and an adhesive for temporarily fixing a board is accommodated in the depressions, and the adhesive is A series of surface mount components characterized by attaching and holding electronic components to carrier tape. (2) The series of surface mount components according to claim 1, wherein the recessed portion is formed by recessing a carrier tape made of soft resin into a hemispherical shape. (3) The series of surface mount components according to claim 1, wherein one or more depressions are provided depending on the number of adhesives to be attached to the electronic components. (4) The series of surface mount components according to claim 1, wherein the adhesive is made of a polymeric material such as silicone or acrylic that generates adhesive force when heated.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369687U JPH037317Y2 (en) | 1987-03-25 | 1987-03-25 | |
| GB8803125A GB2203676B (en) | 1987-02-25 | 1988-02-11 | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| CA000558726A CA1322271C (en) | 1987-02-25 | 1988-02-11 | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| DE3805572A DE3805572C2 (en) | 1987-02-25 | 1988-02-23 | Carrier tape for electronic components and method for producing a sequence of electronic components |
| FR8802304A FR2611189A1 (en) | 1987-02-25 | 1988-02-25 | SUPPORT STRIP FOR ELECTRONIC CIRCUIT ELEMENTS AND METHOD FOR MANUFACTURING A SERIES OF ELECTRONIC CIRCUIT ELEMENTS |
| US07/481,756 US5089314A (en) | 1987-02-25 | 1990-02-15 | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4369687U JPH037317Y2 (en) | 1987-03-25 | 1987-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63149865U true JPS63149865U (en) | 1988-10-03 |
| JPH037317Y2 JPH037317Y2 (en) | 1991-02-22 |
Family
ID=30860798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4369687U Expired JPH037317Y2 (en) | 1987-02-25 | 1987-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH037317Y2 (en) |
-
1987
- 1987-03-25 JP JP4369687U patent/JPH037317Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH037317Y2 (en) | 1991-02-22 |
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