JPS63149561U - - Google Patents
Info
- Publication number
- JPS63149561U JPS63149561U JP4335887U JP4335887U JPS63149561U JP S63149561 U JPS63149561 U JP S63149561U JP 4335887 U JP4335887 U JP 4335887U JP 4335887 U JP4335887 U JP 4335887U JP S63149561 U JPS63149561 U JP S63149561U
- Authority
- JP
- Japan
- Prior art keywords
- bent part
- wiring board
- copper foil
- plating layer
- flexible composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043358U JPH0412702Y2 (no) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043358U JPH0412702Y2 (no) | 1987-03-23 | 1987-03-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63149561U true JPS63149561U (no) | 1988-10-03 |
| JPH0412702Y2 JPH0412702Y2 (no) | 1992-03-26 |
Family
ID=30860138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987043358U Expired JPH0412702Y2 (no) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412702Y2 (no) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130468U (ja) * | 1991-05-23 | 1992-11-30 | 藤一 竹林 | 無配線回路基板 |
| JP2008085099A (ja) * | 2006-09-28 | 2008-04-10 | Sumitomo Bakelite Co Ltd | リジッドフレックス回路板 |
| WO2014132778A1 (ja) * | 2013-02-28 | 2014-09-04 | 株式会社村田製作所 | フレキシブル多層基板 |
| JP2016054313A (ja) * | 2011-04-26 | 2016-04-14 | 株式会社村田製作所 | リジッドフレキシブル基板およびその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4745014B2 (ja) * | 2005-10-11 | 2011-08-10 | 日本メクトロン株式会社 | ケーブル部を有するプリント基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388157A (en) * | 1977-01-13 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5654607U (no) * | 1979-10-01 | 1981-05-13 |
-
1987
- 1987-03-23 JP JP1987043358U patent/JPH0412702Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388157A (en) * | 1977-01-13 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5654607U (no) * | 1979-10-01 | 1981-05-13 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04130468U (ja) * | 1991-05-23 | 1992-11-30 | 藤一 竹林 | 無配線回路基板 |
| JP2008085099A (ja) * | 2006-09-28 | 2008-04-10 | Sumitomo Bakelite Co Ltd | リジッドフレックス回路板 |
| JP2016054313A (ja) * | 2011-04-26 | 2016-04-14 | 株式会社村田製作所 | リジッドフレキシブル基板およびその製造方法 |
| US9402307B2 (en) | 2011-04-26 | 2016-07-26 | Murata Manufacturing Co., Ltd. | Rigid-flexible substrate and method for manufacturing the same |
| WO2014132778A1 (ja) * | 2013-02-28 | 2014-09-04 | 株式会社村田製作所 | フレキシブル多層基板 |
| JP5999249B2 (ja) * | 2013-02-28 | 2016-09-28 | 株式会社村田製作所 | フレキシブル多層基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412702Y2 (no) | 1992-03-26 |