JPS63145005A - Manufacture of multilayer laminated board - Google Patents

Abstract

PURPOSE:To prevent laminated material even with large size from shifting positionally by a method wherein the positions of caulking pins are provided in the specified place inside from the peripheral sides of a laminating material and at the same time the number of the caulking pins are specified in response to the size of the laminating material. CONSTITUTION:In response to the size or longitudinal and lateral dimensions of a laminating material 6 or the number of caulking by caulking pins 5 is set. When the size of each laminating material 6 is below 500X500mm, the number of the positioning holes 4 is set below 10. When the size of each laminating material 6 is larger than 500X500mm, the number of the positioning holes 4 is set 10 or more. In addition, the position of the caulking pin is provided inside the peripheral domain having a width of 7-10mm of each laminating material 6. If the number of the positioning holes 4 is less than the number of those to be set under the above- mentioned size of each laminating material 6, a large positional shifting among the laminating materials 6, 6... develops. If the location of the caulking pin is within the domain having the width of 7mm from the peripheral sides of the laminating material, the location of the pin tends to easily shift. On the other hand, if its location is inside the domain having the width of at least 30mm from the peripheral sides of the laminating material, the workability becomes lower.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a multilayer laminate used for manufacturing a multilayer printed wiring board or a multilayer shield board.

[Background technology]

A multilayer laminate such as a multilayer printed wiring board with six or more layers has an inner layer core material 1, an outer layer material 3, and a prepreg 2 for bonding.
It is manufactured by combining these, aligning the circuit patterns, and then laminating them by heating and pressing. To explain the row in relation to the production of the six-layer multilayer laminate shown in Fig. 5, the thickness is 0.1
A two-layer inner layer core material 1 is formed by forming a circuit 8 on both sides of a laminate 7 made of glass epoxy, glass polyimide, etc. by machining metal foil such as copper foil. (1 to 1 between each core material of this inner layer like al)
Approximately four sheets of prepreg 2 are interposed, and a metal foil 3a such as copper or stone is layered as an outer layer material 3 on the outer surface of each inner layer core material 1 via approximately 1 to 4 sheets of prepreg 2, and this is placed between the plates. Heat between heat plates and heat to 165-175℃.
, 30-50W9/d.

By carrying out lamination molding by heating and pressurizing for about 2 hours, the prepreg 2, 2) is made into a laminated body of the inner layer core material 1 and the outer layer material 3 as the C-p edge stuck layer 9, as shown in FIG. 5(b). ) to obtain a multilayer laminate A. A six-layer printed wiring board having a six-layer circuit configuration can be obtained by processing the metal foil 3a as the outer layer material 3 of the multilayer laminate A to form a circuit.

Here, when performing lamination molding as described above, the lamination is performed with the inner layer core materials 1.1 aligned so that the circuits 8.8 are not mutually misaligned between the inner layer core materials 1.1. It is necessary to do it. In order to perform molding while performing this positioning, divine methods have been used in the past, but for example, the pin lamination method uses inner layer core material 1.1.
Positioning holes f- are provided at the ends of the outer layer material 3 and the prepreg 2, respectively, and a mold plate having 4 to 8 pins is used to pass the pins through the positioning holes f- to the inner layer core material 1.1.
In this method, the outer layer material 3 and the prepreg 2 are stacked in a state where they are aligned, and then laminated and molded. However, since this pin lamination method usually uses a small press, only small-sized materials can be wrapped around the inner layer core material 1゜1, outer layer material 3, and prepreg 2. There is a problem that the plate cannot be formed and productivity is poor. In addition, the caulking method uses inner layer core material 1.1
Positioning holes are provided at the ends of the inner layer core material 1.1, the outer layer material 3, and the prepreg 2, respectively, and four to six caulking pins are inserted into each positioning hole to align the inner layer core material 1.1, the outer layer material 3, and the prepreg 2, respectively. At the same time, set the caulking pins on the mold plate with both ends caulked, and stack them.
This is a method of performing FfC type. With this product, there is no need to use a mold plate with pins, and various presses can be used to perform molding, and large-sized materials can be used as the inner layer core material 1.1, outer layer material 3, and prepreg 2. This makes it possible to form multilayer laminates by molding multiple pieces. However, with this caulking method, in order to increase productivity, if a large piece of material is wrapped around 1°1, outer layer material 3, or prepreg 2, the size will be known and the laminated molding will be carried out. However, there is a problem in that the misalignment becomes large, and the misalignment of the circuit 8 becomes large, leading to a high incidence of defective products.

[Purpose of the invention]

The present invention has been made in view of the above point Vc6, and when performing multilayer laminated molding by the caulking method,
It is an object of the present invention to provide a temporary manufacturing method that can prevent large positional deviations from occurring even when the size of the laminated material increases.

[Disclosure of the invention]

Therefore, the method for manufacturing a multilayer laminate according to the present invention involves stacking the inner layer core material 1, the prepreg 2 and the outer layer material 3 as a laminate material 6, and positioning them at each end of Each bLN material 6.
When manufacturing a multilayer laminate by heating and pressurizing with 6... aligned, the positions of the caulking pins are set within a width of 7 to 30 mm around the periphery of the laminated material, and the positions of the caulking pins are The number and size of the laminated materials are 50
When it is less than 0 x 50041, it is less than 10 pieces, and the size of the laminated material is soo x so.

The present invention is characterized in that when the number of sets is more than 10, the number is set to 10 or more.The present invention will be described in detail below.

In manufacturing a multilayer laminate, 1-core material 1,
This is carried out by using the prepreg 2 and the outer layer material 3 as the layer material 6, and by laminating and molding the laminated material 6. Is the inner layer core material 1 on both sides of the laminate 7 made of glass cloth y, glass polyimide, etc.? The circuit 8 is formed by forming the circuit 8 by machining a metal foil such as a J eraser. In addition, prepreg 2 is used for bonding, and is made by impregnating a long glass cloth or the like with a thermosetting resin such as epoxy resin or polyimide at an impregnating amount of 40 to 55 degrees. By drying this at 140 to 160 degrees Celsius for about 10 minutes, a prepreg 2 with a thickness of about 0.05 to 0.2 cm, which has become a resin cut B stage, is created, and this is shaped into a predetermined size. The prepreg 2 is prepared by cutting it into pieces and surrounding it by bonding. At each end of these laminated plates 6 away from the position of the circuit 8, a circular positioning hole 4 having a diameter of about 2 to 5111 mm is perforated as shown in FIG. 1 fa). In the winter laminated board 6, the alignment holes 4 are provided in the same position and in the same number, and each alignment hole 4 has the same inner diameter.

When forming a multilayer laminate A having a six-layer arrangement, two inner layer core materials 1.
A prepreg 2 is interposed between each inner layer core material 1.
A gold r4 foil 3 such as a printed foil as the outer layer material 3 is attached to the outer surface of the laminate 6 through the prepreg 2, and the caulking pin 5 is passed through the positioning hole 4 of each of these laminated materials 6, 6,... As shown in Part 11 (b), both ends of the caulking pin 5 are caulked like a rivet to integrate each laminated material 6, 6, etc. in a stacked state. At this time, by passing the caulking pin 5 through the alignment hole 4, the laminated materials 6, 6, etc. are aligned with each other based on the caulking pin 5, and the inner layer core material 1
．． 1+7) The circuits 8.8 and 14 can be aligned with each other. After integrating the laminated materials 6,6... with the caulking pin 5 in this way, the product is formed by applying pressure in the same manner as explained in Fig. 5(a). , a multilayer laminate A similar to that shown in FIG. 5(b) can be obtained. Gold rA as the outer layer material 3 of this multilayer laminate A
By etching 963a and forming a circuit, a six-layer pre-printed wiring board having a six-layer circuit configuration can be obtained. Outside, as the single material 3, in addition to the above-mentioned gold foil 3a, glass epoxy or glass boliimi F
Product I! Gold r4 such as steel foil on one side of 1 plate (11)
It is also possible to use a circuit made of foil and a metal foil such as I1 foil applied to one side of the outer side of the laminate to form the outer layer core material.

As mentioned above, the 1rU-material 6゜6・
When performing laminated molding with...
Since the caulking pin 5 is used as an integral part on the side of the laminated material 6, there is no need to use a mold plate with integrally protruding pins as a mold plate for laminated molding, and the mold used Laminated material 6 without plates being identified
This means that the size can be set arbitrarily. As the size of the layered material 6 increases, the positional deviation of each layered material 6 during lamination molding increases. Therefore, in the present invention, each layered material 6 is The number of positioning holes 4 to be provided, that is, the number of caulking pins 5, is set. Therefore, when the size of each laminated material 6 is less than 500 x 5 GG, the number of alignment holes 4 provided in each laminated material 6 is set to less than 10, and the size of each laminated material 6 is less than 500 x 5 GG in length and width. s
oo or more, the number of alignment holes 4 that serve each laminated material 6 is set to 10 or more, and the position of the caulking pin is provided inside the 7-30'n width around the periphery of each laminated material 6. be. When the dimensions of each laminate 6 are as follows, the alignment hole 4
If the number of pieces is smaller than these, the number of pieces caulked by the caulking pins 5 will be small, and it will be difficult to hold each laminated material 6, 6... in the aligned state and perform laminated molding.
Laminated materials 6, 6... The occurrence of misalignment between the laminated materials becomes large. The larger the number of alignment holes 4, the more effective it is to suppress the displacement of the laminated material 6, but if the number of alignment holes 4 is too large, the number of caulking pins 5 to be attached will also be too large. This will reduce work efficiency. Therefore, the upper limit number of alignment holes 4 is appropriately set in consideration of workability. When the position of the caulking pin is within the 7ff width around the laminated material, the pin position is likely to shift,
If the position of the caulking pin is inside the 30M width or more around the base material, work efficiency will decrease.

The inner layer core material l, the prepreg 2, and the outer f @ material 3, which are the laminated materials 6 in layer forming 8, are each formed to have the same dimensions. The arrangement is set so that the force distribution is approximately equal in the i@ part. For example, the 21st ψ shows the arrangement of eight alignment holes 4 provided in the laminated material 6 with dimensions soo x 500 fl, but the horizontal interval dimension i ti of the alignment holes 4
The spacing dimension of the alignment holes 4 is changed by about 100 to 300 gm to about 100 to 300 @ 11, and the separation dimension c of the alignment holes 4 from the edge of the m-layer material 6 is about 7 to 309 g. It is better to set each, and in Fig. 3 510 x
This shows the arrangement of 122 positioning holes 4 provided in the laminated material 6 having the dimensions of the pivot 510Ln, and the horizontal distance a and the vertical distance between the positioning holes 4 are ioo to 2, respectively.
It is preferable that the distance C of the alignment hole 4 from the edge of the compensating rH material 6 is set to about 7 to 30n1, respectively.

The invention will now be illustrated by examples.

EXAMPLE A prepreg of about 50% resin gold was prepared by impregnating a glass cloth base material with a thickness of Q and 1 Wff with an epoxy resin and drying it at 150° C. for 10 minutes.

70μ thick copper foil etched circuit on both sides of 6 fl laminate board.
I created one core paulownia. Furthermore, I made outer 1 samurai material using 9 foils with a 35μ barrier. These inner layer core materials, prepreg, resin I [
Each piece of material was formed into a silk size of 450 x 280 in length and breadth, and each of these was made into a piece with a diameter of 3-1 with the arrangement shown in Figure 4.
Eight digit 1 grooves were provided. Here, the horizontal spacing of the position 9 alignment holes is F! : a (:t 210 ms, the vertical spacing of the alignment holes was set to 1251111, and the separation dimension of the alignment holes from the edge q:C was set to 1.'l fl.

Next, two sheets of prepreg are sandwiched between two sheets of inner core material, and two sheets of prepreg are placed on the outer surface of each inner layer core material, and f! Layer A foil as the outer layer material (
1st %(al), each of these parts; d Pass a total of 8 caulking pins with a diameter of 3 fl through the alignment holes, caulk both ends of each caulking pin, and insert the core material, prepreg,
C1 nol integrated with outer layer material aligned)
). The material that has been folded and caulked with a caulking bottle in this way is sandwiched between mold plates, and then it is molded by a laminated molding machine.
The multilayer laminate A was obtained by heat-pressing molding at 70° C., 40° C., 9/d, and 2 hours (No. 5 Doichi)).

Comparative example The number of alignment holes for the inner layer core material, prepreg, and outer layer material of 450 yax x 280 pieces in length and width was set to 6, and the number of locations to be caulked with a caulking bottle was set to 6, and the alignment holes from the edge were set to 6. A multi-laminate plate A was obtained in the same manner as in Example 1, except that the interwax dimension C was changed to 5 fins.

For each of the four multilayer laminates A obtained in the above Examples and Comparative Examples, the positional deviation between the non-core circuits was measured. The positional deviation was measured by cutting the multilayer laminate A and examining its cross section with a microscope bowl. The results are shown in the table below.

As a result of the above table, the deviation of the example can be made smaller than that of the comparative example, and the defective amount needs to be 0.21 or less in order to secure the yield. In this case, the yield defect could be suppressed to 0.2% or less.

〔Effect of the invention〕

As described above, the present invention has the following feature: When producing a multi-layer ramming board by laminating and molding each stacked material with alignment using the D1 sewage method, the position of the shimbin can be adjusted using force. 11- Provide the number of crimping pins inside the 7-30 fl width of the periphery of the material, and the size of the laminated material is soo x so.

If the number is less than 1, the number of alignment holes provided in the laminated material is 1.
0 (161 is set to unnegative, and when the size of the laminated material is 500 x 500 tx or more, the number of alignment holes to be provided in the laminated material is set to 10 or more, and the dimensions of the laminated material become large. Also, the number of alignment holes according to this,
In other words, when manufacturing multilayer laminates using the caulking method, the number of caulking points increased by caulking bins allows for forming with less misalignment of the laminated material, and the use of large press metals and plates allows for highly productive forming. ,
It is possible to form the laminated material with less deviation by 1d.

[Brief explanation of the drawing]

Figures 1 (a) and 4 (b) are exploded cross-sectional views and cross-sectional views showing a method of manufacturing a laminate board with a six-layer circuit configuration using the caulking method, and Figures 2, 3, and 4 show laminated materials, respectively. FIG. 5(a) is a plan view showing the arrangement of the alignment holes provided in (1) is an exploded view and a cross-sectional view showing the method of fabricating a laminate with a six-layer circuit configuration. , 2 is a prepreg, 3 is an outer layer material, 5 is a caulking pin, and 6 is a laminated material.

Claims (1)

[Claims] (1) A state where the inner layer core material, prepreg for bonding, and outer layer material are stacked as a laminate, and each laminate is aligned with a caulking pin passed through each alignment hole provided at each end of these laminates. When manufacturing a multi-layer laminate by heating and pressure forming with If the number is less than 10, the size of the laminated material is 50 mm in length and width.
A method for producing a multilayer laminate, characterized in that when the size is 0 x 500 mm or more, the number is set to 10 or more.