JPS6314470Y2 - - Google Patents

Info

Publication number

JPS6314470Y2

JPS6314470Y2 JP1981004759U JP475981U JPS6314470Y2 JP S6314470 Y2 JPS6314470 Y2 JP S6314470Y2 JP 1981004759 U JP1981004759 U JP 1981004759U JP 475981 U JP475981 U JP 475981U JP S6314470 Y2 JPS6314470 Y2 JP S6314470Y2

Authority

JP

Japan

Prior art keywords

lead

main body

semiconductor device

package

package main

Prior art date

1981-01-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 239000004065 semiconductor Substances 0.000 claims description 34
• 238000000605 extraction Methods 0.000 claims description 3
• 239000002184 metal Substances 0.000 claims 1
• 230000000694 effects Effects 0.000 description 4
• 238000005476 soldering Methods 0.000 description 4
• 239000000919 ceramic Substances 0.000 description 3
• 239000012212 insulator Substances 0.000 description 2
• 230000002950 deficient Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1
• 230000037431 insertion Effects 0.000 description 1
• 238000009434 installation Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1