JPS6314445Y2 - - Google Patents

Info

Publication number

JPS6314445Y2

JPS6314445Y2 JP10120083U JP10120083U JPS6314445Y2 JP S6314445 Y2 JPS6314445 Y2 JP S6314445Y2 JP 10120083 U JP10120083 U JP 10120083U JP 10120083 U JP10120083 U JP 10120083U JP S6314445 Y2 JPS6314445 Y2 JP S6314445Y2

Authority

JP

Japan

Prior art keywords

melting point

low melting

point metal

metal wire

resin

Prior art date

1983-06-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
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• 229910052751 metal Inorganic materials 0.000 claims description 43
• 239000002184 metal Substances 0.000 claims description 43
• 238000002844 melting Methods 0.000 claims description 40
• 230000008018 melting Effects 0.000 claims description 36
• 239000003990 capacitor Substances 0.000 claims description 28
• 239000011888 foil Substances 0.000 claims description 14
• 229920005989 resin Polymers 0.000 claims description 13
• 239000011347 resin Substances 0.000 claims description 13
• 239000000758 substrate Substances 0.000 claims description 8
• 239000000463 material Substances 0.000 claims description 5
• RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
• 239000003063 flame retardant Substances 0.000 claims description 4
• 239000000155 melt Substances 0.000 description 4
• RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
• 230000002159 abnormal effect Effects 0.000 description 2
• ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
• 230000015572 biosynthetic process Effects 0.000 description 2
• 238000002485 combustion reaction Methods 0.000 description 2
• 230000006378 damage Effects 0.000 description 2
• 230000020169 heat generation Effects 0.000 description 2
• 239000002985 plastic film Substances 0.000 description 2
• 229920006255 plastic film Polymers 0.000 description 2
• 229910001152 Bi alloy Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000004593 Epoxy Substances 0.000 description 1
• 229910000978 Pb alloy Inorganic materials 0.000 description 1
• 239000004743 Polypropylene Substances 0.000 description 1
• 229910001128 Sn alloy Inorganic materials 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
• 238000007664 blowing Methods 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 239000012141 concentrate Substances 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 230000003111 delayed effect Effects 0.000 description 1
• 239000003989 dielectric material Substances 0.000 description 1
• 238000007598 dipping method Methods 0.000 description 1
• 239000005038 ethylene vinyl acetate Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
• -1 polypropylene Polymers 0.000 description 1
• 229920001155 polypropylene Polymers 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 238000003466 welding Methods 0.000 description 1
• 238000004804 winding Methods 0.000 description 1