JPS63143568U - - Google Patents
Info
- Publication number
- JPS63143568U JPS63143568U JP3529687U JP3529687U JPS63143568U JP S63143568 U JPS63143568 U JP S63143568U JP 3529687 U JP3529687 U JP 3529687U JP 3529687 U JP3529687 U JP 3529687U JP S63143568 U JPS63143568 U JP S63143568U
- Authority
- JP
- Japan
- Prior art keywords
- sectional
- target
- view
- showing
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005477 sputtering target Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案の一実施例を示す概略縦断面図
、第２図は典型的なスパツタ装置を示す概略説明
図、第３図及び第４図はターゲツト３ａの要部拡
大断面図、第５図は本考案の他の実施例の概略縦
断面図、第６図は第５図における―線断面矢
視図、第７図はターゲツト３ａの一実施態様を示
す軸直角断面図、第８図及び第９図は分割片１０
の他の実施例を示す斜視図、第１０図はターゲツ
ト３ａ内における磁界の発生状況を示す概略説明
図、第１１図はターゲツト３ａの消耗状態を示す
軸直角断面図である。
１……スパツタ装置、２……真空容器、３……
ターゲツト、４……基板、５……ターゲツト支持
材、６……永久磁石、９……冷却管、１０，１０
ａ〜１０ｆ……分割片、１８……締付けナツト。
FIG. 1 is a schematic vertical sectional view showing an embodiment of the present invention, FIG. 2 is a schematic explanatory view showing a typical sputtering device, FIGS. 5 is a schematic vertical cross-sectional view of another embodiment of the present invention, FIG. 6 is a cross-sectional view taken along the line - in FIG. The figure and FIG. 9 show the divided piece 10.
FIG. 10 is a schematic diagram showing the state of magnetic field generation within the target 3a, and FIG. 11 is a cross-sectional view perpendicular to the axis showing the state of wear of the target 3a. 1... Sputtering device, 2... Vacuum container, 3...
Target, 4...Substrate, 5...Target support material, 6...Permanent magnet, 9...Cooling pipe, 10, 10
a to 10f...divided piece, 18...tightening nut.
Claims (1)
パツタ用ターゲツト。 A sputtering target characterized by being composed of an assembly tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3529687U JPS63143568U (en) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3529687U JPS63143568U (en) | 1987-03-11 | 1987-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63143568U true JPS63143568U (en) | 1988-09-21 |
Family
ID=30844658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3529687U Pending JPS63143568U (en) | 1987-03-11 | 1987-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63143568U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006104570A (en) * | 2004-09-30 | 2006-04-20 | Applied Films Corp | Non-bonded rotatable target for sputtering |
| JP2013133490A (en) * | 2011-12-26 | 2013-07-08 | Tokuriki Honten Co Ltd | Cylindrical sputtering target and method for producing the same |
-
1987
- 1987-03-11 JP JP3529687U patent/JPS63143568U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006104570A (en) * | 2004-09-30 | 2006-04-20 | Applied Films Corp | Non-bonded rotatable target for sputtering |
| JP2011117078A (en) * | 2004-09-30 | 2011-06-16 | Applied Materials Inc | Non-bonded rotatable target for sputtering |
| JP2013133490A (en) * | 2011-12-26 | 2013-07-08 | Tokuriki Honten Co Ltd | Cylindrical sputtering target and method for producing the same |