JPS63141337A - Electronic part inspecting device - Google Patents

Abstract

PURPOSE:To contrive to perform simply the respective inspections of a tinning treatment and a solder treatment even in case the sheathing treatment at the lead parts of an electronic part is the tinning treatment or the solder treatment by a method wherein the position of an optical system, which is an inspecting means, is changed- over according to the kind of the sheathing treatment at the lead parts of the electronic part. CONSTITUTION:A fourth inspecting part 27 consists of illumination part 61 and 62 to be constituted by straight pipe fluorescent lamps, a mirror 64 for shading prevention, a mirror 65 to guide a reflected light from an IC 1 to a rear stage, a mirror driving part 66 to make the mirror 65 rotate and an image sensing part 67 to be constituted by a CCD camera 65 which converts a signal in every one scanning line to be guided from the above mirror 65 into an electrical signal. In this case, whether the above fourth inspecting part 27 is used in specular reflection or is used in diffuse reflection is so contrived as to be modified by the movement of the mirror 65, the mirror driving part 66 and the image sensing part 67 and a difference between the illumination parts 62 and 61 to be lighted and in case the sheathing treatment at the lead parts 1a of the IC 1 is a tinning treatment, the diffuse reflection is used and in the case of a solder treatment, the specular reflection is so contrived as to be used.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention determines defects in, for example, leads, molds, marks, etc. of a DIP type IC, automatically sorts them into good products and defective products, and After that, high-speed IC%I automatically stores into the stick!
The present invention relates to electronic component testing equipment such as testing equipment.

(Prior art) Conventionally, DIP (dual 1n-line) aCk
A to le) Type IC, for example, 16-bin DTP or 42-bin DIR, is inspected for defects in leads, molds, marks, etc., and is sorted into good and defective products, and then stored in a stick. The process is carried out using human vision.

The above DIP type IC is, for example, 0.1 inch (2.54 inch
It is a standard package for ICs with a pin arrangement on both sides, with a spacing of 1 mm).

However, in this type of device, since the inspection was performed using human vision, there was a problem that the inspection results varied and accurate inspection could not be performed.

Therefore, by transporting the above inspection on a transport path,
A device that automatically determines whether there is a defect in the lead portion of C is being considered.

However, the above-mentioned devices only have an inspection section for those that have been tin-plated as the exterior treatment of the lead portion, so it is not possible to detect defects in the soldered lead portion, and It was not possible to perform the test.

(Problems to be Solved by the Invention) As mentioned above, this invention eliminates the drawback that only tin-plated lead parts can be inspected and half-plated lead parts cannot be inspected. An object of the present invention is to provide an electronic component inspection device that can easily inspect the exterior of the lead portion of the device, even if the exterior treatment is tin plating or soldering.

[Structure of the Invention] (Means for Solving the Problems) An electronic component inspection apparatus of the present invention includes an inspection means for inspecting a lead portion of an electronic component using an optical system, and a position of the optical system of the inspection means. It consists of a switching means that switches depending on the type of exterior treatment on the lead portion of the electronic component.

(Function) In this invention, the lead portion of an electronic component is inspected by an inspection means using an optical system, and the position of the optical system of the inspection means is changed depending on the type of exterior treatment on the lead portion of the Ifi electronic component. be.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A high-speed IC visual inspection apparatus as an electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 1 to 3. That is, 11 is a housing part in which the stick 2 in which a plurality of ICs 1 to be tested (tested) is stored is stored. This storage section 11 has a capacity that can accommodate 400 sticks 2. As the IC1, a DIP type IC with 16 to 42 bins is handled.

If there are 16 IC1 bins in the stick 2, there are 25
m is designed to be stored.

In the case of a 16-bin DIP type IC, the IC 1 is composed of a lead part 1a consisting of eight lead wires on each side, and a mold part 1b, as shown in FIGS. 4(a) to (d). The mold part 1b has a surface, that is, a mark surface 1c.
, and a back surface 1d.

The stick 2 is usually plugged at both ends to prevent the ICI inside from spilling out when it is tilted, but when it is stored in the storage section 11, it is placed on the inspection section side, that is, on the third side.
In the figure, the plug on the right side is not closed. The sticks 2 in the storage section 11 are lifted up one by one by a stick lifting conveyor 12. The scraping conveyor 12 is provided with stick holding bars 13 at regular intervals.

The spacing and height of the bars 13 are determined by the center of gravity only when the raking stick 2 is in the desired direction.
It is raked up while riding on the bar 13, and the size is adjusted so that when it is in a direction other than the desired direction, it does not ride on the bar 13 or falls even if it rides on it.

The desired direction and □ of the stick 2 are as follows:
C1 is facing upward, that is, the lead portion 1a of the ICI is facing upward, and the mark surface 1C of the mold portion 1b is facing downward.

□The stick 2 that rides on the bar 13 and is scraped up by the scraping conveyor 12 is rotated 90 degrees at the upper end of the scraping conveyor 12, and then transferred to the stick horizontal feed conveyor 1.
Move on to 4. At this time, as described above, only the sticks 2 whose direction has been selected by the bar 13 reach the upper end, so all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state.

The stick 2 conveyed by the horizontal stick conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), so that the ICs 1, . . . inside are taken out from the opening on the right side. ing. The ICs 1, . . . taken out are guided to a horizontal transport path 17 via a shooter 16. A stopper (not shown) is provided in the chute 16 to temporarily stop the ICs being cleaned, and the ICs 1 are sent one by one to the horizontal transport path 17 in synchronization with the timing of horizontal transport. .

The stick 2 from which the IC1, . Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 1B at the rear.

This IC residual detection section 18 detects whether or not there is any remaining ICI in the transported stick 2. If the result of this detection is that there is no residual ICI, the IC is transported to the rear non-defective IC storage section 19. If there is any remaining IC, it is accommodated in the upper IC remaining storage section 2o. A detailed explanation of the IC residual detecting section 18 and the IC residual accommodating section 20 is described in Japanese Patent Application No. 60-214501, and will therefore be omitted here.

As shown in FIGS. 18 and 19, the horizontal conveyance path 17 includes two rails 110 and 110 that support the IC1.
1 By moving between these rails 110 and 110 in a state protruding from the upper surface of the rail 110, the rail 11
Profiles 111 as push claws pushing TCl on 0,110, . . . , these profiles 111, . .
The timing belt 112 is connected to the timing belt 112, and a driven pulley 113 and a drive pulley 114, around which the timing belt 112 is stretched, rotates and moves the timing belt 112. The drive pulley 114 is rotated by a motor (not shown).

That is, as shown in FIG. 4(a), the IC 1 supplied from the shooter 16 rides on the rail 110, 110 with the lead portion 1a facing upward and the mark surface 1C downward, and is pushed by the profile 111. This allows it to move forward.

The profiles 111, . . . are lined up at regular intervals, and their drive systems are controlled to operate intermittently. That is, the IC1 sent from the chute 16 is moved to the rail 11 when the profiles 111, . . .
0.110, profile 111,...
is pushed forward with the movement of , but since there is also a profile 111 in front, there are two profiles 111.
The profile 111, .

The IC 1 transported on the horizontal transport path 17 includes a first inspection section 21 which is disposed opposite to each other with the horizontal transport path 17 interposed therebetween;
The second inspection section 22 photographs the mold condition of the back surface 1d of the ICI, the condition of the lead section 1a, etc., and the image signals are sent to a back surface mold defect determination section 72, which will be described later.
and is output to the lead defect determination section 73.

The first inspection section 21 uses specular reflection, as shown in FIG. 4(a).
As shown in FIG. 5, this is an inspection section that inspects (images) the back surface 1d and lead portion 1a of the IC1, and as shown in FIG.
A mirror 42 that guides the reflected light from the IC 1 to a subsequent stage, a mirror drive unit 43 that rotates the mirror 42 in order to respond to the reflected light from the entire surface of the IC 1, and a signal for each scanning line guided from the mirror 42. It consists of a VA image section 44 constituted by a COD camera that converts into electrical signals.

Further, the second inspection section 22 has the same configuration as the first inspection section 21, and is configured as shown in FIG. 6. The imaging section 44 of the first inspection section 21 and the second inspection section 22 has an effective viewing culm length that is equal to or longer than the fixed interval between the profiles 111, . The center point of the two profiles 111 and 111 is approximately equal to each other. As a result, the profile 111,
When ... is stopped, two profiles 111.111
It is possible to capture the IC 1 located at any position between them within its field of view and capture an image of its back surface.

As shown in FIG. 7, the first inspection section 21 outputs 18 image signals for determining mold defects and lead wire defects on the right half of the back surface 1d of the ICI from the center line in the transport direction. The second inspection section 22 outputs an imaging signal for determining mold defects and lead wire defects on the left half of the back surface 1d of the ICI from the center line.

As a result, the first and second inspection sections 21 and 22 have the same configuration, but the back side of the ICI to be inspected (I[i
The range of ld targets different halves, and the relationship between the incident light from the illumination unit 41 and the reflected light to the imaging unit 44 is reversed.

That is, in FIG. 3, in the first inspection section 21, the illumination section 41 is located in front of the horizontal conveyance path 17;
In the second inspection section 22, the illumination section 41
The imaging section 44 of the second inspection section 22 is located at the back of the
In order to capture the reflected light directed toward this side from the horizontal conveyance path 17,
It overhangs the horizontal conveyance path 17.

Further, in the first inspection section 21, the illumination section 41 is positioned at a position where the incident light from the illumination section 41 and the reflected light to the imaging section 44 are incident and reflected at approximately the same angle with respect to the normal plane of the back surface 1d of the IC1. , an imaging section 44 is arranged. Therefore, since the imaging section 44 is not on the normal plane to the back surface 1d of the ICI and forms a certain angle with this, the mold surface on the back surface 1d is viewed obliquely, and the leads on the imaging section 44 side The image overlaps the mold image on the same side, making it impossible to detect defects on the mold. Therefore, the back surface 1d of IC1
Since it is difficult for the imaging section 44Illll to detect a signal for mold defect determination from the center line of This is carried out only for the half on the illumination section 41 side (the right half in FIG. 7).

In addition, in the first inspection section 21, the ICI on the illumination section 41 side
The lead portion 1a is designed to block light reflected from the rail on the illumination portion 41 side to the imaging portion 44, and the lead portion 1a of the illumination portion 4
By giving the rail surface on the first side a property (white) that reflects light well, it is possible to image the light of the lead section 1a on the illumination section 41 side.

In addition, Il of the half on the imaging section 44 side (the left half in FIG. 7) from the mold center line that cannot be imaged by the first inspection section 21.
The second inspection section 22 performs Illra on the L image and the shadow of the lead section 1a on the imaging section 44 side.

Further, the distance between the centers of the visual fields of the first inspection section 21 and the second inspection section 22 is an integral multiple of the distance between the profiles 111, . . . . As a result, when the profiles 111, . . . that perform intermittent motion stop, the first inspection section 2
The IC 1 exists both in the field of view of the first inspection unit 22 and in the field of view of the second inspection unit 22, so that images can be taken simultaneously.

At the end of the horizontal conveyance path 17, a rotation reversal section 23 is provided. This rotation reversing section 23 is connected to the horizontal conveyance path 17
The mounted ICIs are sent to the horizontal transport path 24 or the defective IC storage box 25 according to the judgment results of a back mold defect judgment section 72 and a lead defect judgment section 73, which will be described later. That is, when a good ICI whose back mold condition and lead part condition were determined to be normal was rotated 180 degrees, it was delivered to the opposing horizontal conveyance path 24, and the above conditions were determined to be abnormal. Defective IC
When I further rotates 90 degrees (270 degrees), the defective IC storage box 2 passes through an opposing ejection chute (not shown).
It is designed to be discharged at 5. As a result, the first
Based on the II images of the second inspection unit 21 and 22, ICIs that are determined to be defective are rejected, and good ICIs are flipped upside down, that is, flipped so that the lead portion 1a faces downward and the mark surface 1C faces upward. It is designed to be sent to a horizontal conveyance path 24. The delivery (discharge) of lcl by the rotary conveyance path 23 is as follows:
This is done using high pressure air.

As shown in FIGS. 20 and 21, the horizontal conveyance path 24 includes two rails 120 and 120 that support the IC1.
, by moving between these rails 120.1 and 20 in a state protruding from the upper surface of the rail 120, the rail 1
20. Profile 121 as a push claw that presses IC1 on 120, . . . , these profiles 121, .
The timing belt 122 is connected to the timing belt 122, and a driven pulley 123 and a driving pulley 124 around which the timing belt 122 is wrapped around and rotates the timing belt 122. The driving pulley 124 is rotated by a motor (not shown).

That is, the IC1 supplied from the rotation reversing section 23 is
As shown in Figure <b>, it rides on the rail 120° 120 with the lead portion 1a facing down and the mark surface 1G facing up, and is moved forward by being pushed by the profile 121.

The profiles 121, . . . are lined up at regular intervals, and their drive systems are controlled to operate intermittently. In other words, the ICI sent from the rotation reversing unit 23
is placed on the rail 120, 120 when the profile 121, . . . is stopped, and the profile 121, .
... is pushed forward as it moves, but since there is also a profile 121 in front, there are two profiles 121.1.
21, and moves forward while making intermittent movements together with these profiles 121, .

The IC 1 transported on the horizontal transport path 24 includes a third inspection section 26 which is disposed opposite to each other with the horizontal transport path 24 interposed therebetween;
The fourth inspection section 27, the fifth inspection section 28, and the sixth inspection section 29 check the mark state of the mark surface 1C of the IC 1 and the lead section 1.
The state of a and the mold state of mark surface 1C are Wi
The image signal is outputted to a mark defect determination section 74, a lead defect determination section 75, and a surface mold defect determination section 76, which will be described later. The intervals between the third, fourth, fifth, and sixth inspection sections 26, 27, 28, and 29 are integral multiples of the profiles 121, . . . , respectively.

The third inspection section 26 uses diffuse reflection, as shown in FIG. 4(b).
As shown in FIG.
This is the inspection section that performs the
An illumination section 51 composed of a straight tube fluorescent lamp, an ND filter 56, and an ND filter 56 reflect the light from the illumination section 51 and guide it to the IC 1 (
, a mirror 52 for preventing shading, a mirror 53 that guides the reflected light from the ICI to a subsequent stage, and a mark surface 1 of the above IC1.
A mirror driving section 54 that rotates the mirror 53 in order to respond to the reflected light from the entire surface toward
186 section 55 constituted by a COD camera that converts the signal for each scanning line derived from 3 into an electrical signal. The third inspection section 26 is configured to output an imaging signal for the mark surface of the ICI, that is, the entire surface 1C, to a mark defect determination section 74, which will be described later.

The fourth inspection section 27 can selectively use specular reflection or diffuse reflection, and as shown in FIG. 4(C),
This is an inspection section that inspects (images) the lead section 1a of the IC 1, and as shown in FIG. a shading prevention mirror 64 that reflects and guides the light to the IC1; a mirror 65 that guides the reflected light from the IC1 to a subsequent stage; a mirror drive unit that rotates the mirror 65 in order to respond to the reflected light from the entire surface of the IC1; 66, and an m-image section 67 constituted by a COD camera that converts the signal for each scanning line guided from the mirror 65 into an electrical signal. In this case, whether the fourth inspection section 27 is used for specular reflection or diffuse reflection depends on the mirror 65, mirror drive section 66, and image carrier 6.
Due to the movement of 7 and the difference in lighting parts 62 and 61.

If the ICI lead part 1a is tin-plated, diffuse reflection will be used, and if it is soldered,
It uses specular reflection.

That is, when the exterior treatment of the lead portion 1a of the ICI to be inspected is tin plating, the operator specifies in advance through the operation unit 35 that the exterior treatment of the lead portion is tin plating, and then the fourth inspection section 27 mirror 65,
The optical system consisting of the image carrier 67 is moved to the position shown by the solid line in FIG. Therefore, the corresponding I by the fourth inspection unit 27
At the time of image transport of CI, the illumination section 61 is turned on, and the irradiation light from the illumination section 61 is irradiated to the lead section 1a of the LCL via the NO filter 63, and the irradiation light from the illumination section 61 is irradiated via the mirror 64. is irradiated onto the lead portion 1a of the IC1,
The reflected light is reflected by the mirror 65 at the solid line position and guided to the imaging section 67 at the solid line position. As a result, the fourth inspection section 27 uses an inspection method using diffuse reflection.
CI imaging is now being performed.

Furthermore, when the exterior treatment of the lead portion 1a of the IC 1 to be inspected is soldering, the operator specifies in advance that the exterior treatment of the lead portion 1a is soldering using the operation unit 35, and then the fourth inspection portion 27 The optical system consisting of the mirror 65 and the m part 67 is moved to the position shown by the broken line in FIG. Therefore, when the fourth inspection section 27 images the corresponding ICI, the illumination section 62 is turned on, the irradiation light from the illumination section 62 is directly irradiated to the lead section 1a of the ICI, and the reflected light is reflected by the mirror 65 at the broken line position. It is reflected and guided to the m-image section 67 located at the position of the broken line. As a result, the fourth inspection section 2
7, an inspection method using specular reflection is used to image the ICI.

Therefore, in the fourth inspection section 27, by changing the position of the optical system, that is, the optical axis position, imaging is performed by diffuse reflection or specular reflection corresponding to the exterior treatment of the lead section 1a.

The fourth inspection section 27 is configured to output an imaging signal for the lead section 1a of the ICI to a lead defect determination section 75, which will be described later.

Further, the fifth inspection section 28 also has the same configuration as the fourth inspection section 27, as shown in the tenth factor. The fifth inspection section 28 is configured to output an imaging signal for the lead section Ia of the ICI (on the opposite side to the fourth inspection section 27) to a lead defect determination section 75, which will be described later.

The sixth inspection section 26 uses specular reflection, as shown in FIG. 4(d).
As shown in FIG.
This is the inspection section that performs m-image), and as shown in Figure 11,
The configuration is similar to that of the first inspection section 21 described above. The sixth inspection section 29 is configured to output an image signal for the mark surface of the IC 1, that is, the entire surface 1C, to a surface mold defect determination section 76, which will be described later.

A branch portion 30 is provided at the terminal end of the horizontal conveyance path 24 . This branching section 30 selects the IC 1 supplied from the horizontal transport path 24 from the non-defective transport path according to the judgment result of a judgment unit 74, 75, 76 (to be described later), that is, whether it is a good product or a defective product.
1 or to the defective product conveyance path 32.

The IC1 supplied to the defective product transport path 32 corresponds to the type of defect by moving the shuttle 33 provided at the end of the defective product transport path 32 in accordance with the type (item) of the defect. 19 defective sticks 34...
・It is designed to be selectively stored in. Which stick of the defective sticks 34, . In this case, the number of sticks for one specific defect is up to five, and the number of types of defects is up to nine.

The ICIs supplied to the non-defective transport path 31 are stored in a non-defective stacker 36 provided at the end of the non-defective transport path 31. When the TCl stored in the good product stacker 36 becomes full, the IC1 in the good product stacker 36 is pushed out to the good product IC storage section 19 by an unillustrated extrusion mechanism, and at this time, the IC1 in the good product stacker 36 is pushed out into the corresponding empty stick 2. It is designed to be stored. tC of this good product
The stick 2 containing the IC 1 is further sent to a later stage by the stick horizontal feed conveyor 14, and after a rubber stopper to prevent the IC 1 from falling is inserted by the rubber stopper insertion mechanism 100, it is placed in the good stick storage box 37. It is supposed to be released.

IC1 in the above-mentioned good product conveyance path 31 and defective product conveyance path 32
The conveyance is carried out by high pressure air, and the
- Since the details are described in No. 190114,
The explanation thereof will be omitted here.

Also, regarding the rubber plug stopper insertion mechanism 100,
Since the details are described in Japanese Patent Application No. 61-231709, the explanation thereof will be omitted here.

The operating section 35 is housed in a drawer section 38 shown in FIG.

Further, a CRT display 39 is provided in each of the above sections, particularly above the inspection section. This CRT display 39
are detectors 40 installed at main positions on the conveyance path,...
・It is designed to display the location of conveyance abnormality corresponding to the detection signal from, the number of non-defective products, the number of various types of defective products, and the branching details of the defective product stick.

Next, the control circuit will be explained using FIG. 12. That is, a control section 71 that controls the whole, a back mold defect determination section 72 that determines a mold defect on the back surface 1d of the IC 1 based on outputs from the first and second inspection sections 21 and 22, and the first and second inspection sections. ICI by the output from 21.22
a lead defect determination section 73 that determines a lead defect in the lead portion 1a; a mark defect determination section 74 that determines a mark defect on the mark surface 1C of the IC 1 based on the output from the third inspection section 26; and the fourth and fifth inspections. A lead defect determination section 75 that determines a lead defect in the lead portion 1a of the IC 1 based on the outputs from sections 27 and 28, and a surface mold defect determination section that determines a mold defect on the mark surface 1C of the IC 1 based on the output from the sixth inspection section 29. part 76, a driver 7 that drives each of the above parts;
7, to 81.

The back side mold defect determination section 72 extracts only the image pickup signal of the mold part, that is, the back side 1d, based on the image pickup signals from the first and second inspection sections 21 and 22, and determines whether there is black information or not. This is used to determine mold defects. This mold defect is shown in Figs. 13(a) to (e).
These include pinholes, unfilled parts, chips, cracks, and scratches as shown in the figure.

The lead defect determination section 73 includes the first and second inspection sections 2
Only the lead portion 1a is taken out based on the m-image signal from 1.22, and a lead defect in the ICI lead portion 1a is determined based on the length of black information and the number of black blocks. These lead defects include lead bending, lead breakage, dam cut eccentricity, and lead bending inside and outside, as shown in FIGS. 14(a) to 14(d). The above-mentioned inward/outward defect of the lead portion 1a is determined by measuring the length of the shadow of the lead portion 1a by utilizing the fact that the length of the shadow of the lead portion 1a is proportional to the inward or outward bending angle of the lead portion 1a. The decision is made based on this.

The mark defect determination section 74 extracts the imaging signal of only the mark surface 1C based on the Il signal from the third inspection section 26, and compares it with a reference pattern registered in advance (
(pattern recognition) to determine mark defects on the mark surface 1C of the IC 1. This mark defect is the first
As shown in Figures 5 (a) to (i), there are no marks, reverse marks, typos, misalignments, inclinations, blurring, blurring, chips, scratches, etc.

The lead defect determination section 75 includes the fourth and fifth inspection sections 2
7. Take out only the lead part by the image signal from 28,
The length of the black information and the number of black blocks are used to determine whether there is a read failure in the lead portion 1a of the ICI. This lead defect is as shown in FIGS. 16(a), (b), and (c).
The soldering is good, but the soldering is bad.

The surface mold defect determination section 91 includes the sixth inspection section 2
It (I signal) from 9 extracts only the am signal of the mold part, that is, the mark surface 1C, and depending on whether there is black information,
This is to determine a mold defect on the mark surface 1C of the ICI. This mold defect is shown in Figs. 13(a) to (e).
These include pinholes, unfilled parts, chips, cracks, and scratches as shown in the figure.

It should be noted that the mark defect determination section 74 determines that the I is a good product.
C1 is as shown in FIG.

The control section 71 is configured to perform transport control or distribution control of the ICs 1 in accordance with the detection results of the detectors 40, . . . .

The control unit 71 determines whether the corresponding IC 1 is a non-defective product or a defective product, depending on the determination results of each of the determination units.

Further, the control section 71 counts the number of non-defective products and the number of defective products for each item, and stores the counting results in an internal memory (not shown).

The contents of the count are displayed on the CRT display 39 or printed out using a printer (not shown).

Further, the criteria for each of the above-mentioned determination units are stored in advance in a ROM or floppy disk (not shown). For example, when determining the length of the lead portion 1a of an ICI, the above criteria may be used to determine whether the length is shorter than a predetermined length within 1 mm, or whether the length is within the standard.
This is considered to be within the standards due to illness. The determination criteria of each of the determination units described above can be changed in advance by the user. This change method involves rewriting the contents of a floppy disk (not shown) in which the above change criteria is stored.

Next, the operation in such a configuration will be explained.

For example, when the power (not shown) is turned on, the operation section 35
Accordingly, the classification of defective products to the defective sticks 34, . . . is set in advance. Then, the rubber stopper on the right side is removed, and the sticks 2, . . . containing the ICIs to be inspected, . Then, the sticks 2 in the storage section 11 are scraped up one by one by the bar 13 of the stick scraping conveyor 12. At this time, due to the center of gravity of the stick 2, the stick 2 is raked upward only when it is in a desired direction, and is otherwise dropped into the storage section 11.

Next, the sticks 2 that ride on the bar 13 and are scraped up by the scraping conveyor 12 are transferred to the scraping conveyor 12.
It rotates 90 degrees at the upper end and transfers to the stick horizontal feed conveyor 14. At this time, as mentioned above, the bar 13
Since only the stick 2 whose direction has been selected reaches the upper end, all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state as shown in FIG. 4(a).

The stick 2 conveyed by the horizontal stick conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), and the IOL inside is taken out from the opening on the right side, and the shooter 16 is It is guided to the horizontal conveyance path 17 via the horizontal conveyance path 17.

The ICIs supplied to this horizontal transport path 17 are transported one by one.

The stick 2 from which the ICI, . Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any ICI remaining in the stick 2 that has been transported. As a result of this detection, if there is no indication, the stick 2 is further conveyed to the rear non-defective IC storage section 19 by the stick horizontal conveyor 14, and if there is any remaining, the stick 2 is
is stored in the upper IC residual storage section 20.

The IC 1 transported on the horizontal transport path 17 is
The inspection section 21 and the second inspection section 22 take images of the mold state of the back surface 1d, the state of the lead section 1a, etc., and the positive image signals are supplied to the back surface mold defect determination section 72 and the lead defect determination section 73, respectively. As a result, the back side mold defect determination section 72 extracts only the W11 signal of the mold section, that is, the back side 1d, based on the imaging signals from the first and second inspection sections 21 and 22, and determines the ICI depending on whether there is black information. Mold defects such as holes (pinholes), unfilling, chips, cracks, and scratches on the back surface 1d are determined, and the determination results are output to the control section 71.

In addition, the lead defect determination unit 73 extracts only the lead portion 1a based on the imaging signals from the first and second inspection portions 21 and 22, and determines the lead portion 1a of the ICI based on the length of the black information and the number of black blocks. Lead defects such as lead bending, lead bending, dam cut eccentricity, lead bending inside and outside, etc. are determined, and the determination results are output to the control section 71.

However, the control section 71 controls the back mold defect determination section 7.
2 and the determination results from the lead defect determination section 73,
It is determined whether the corresponding IC1 can be sent to the subsequent testing section. As a result, if the control section 71 determines that the control section 71 can send it to the subsequent inspection section, that is, there is no mold defect on the back surface 1d and no bending of the lead section 1a, the corresponding IC 1 can be sent to the rotation reversing section 2.
When it is rotated 180 degrees in step 3, it is delivered to the horizontal conveyance path 24.

In addition, if the control unit 71 determines that it cannot be sent to the subsequent inspection unit, that is, that there is a mold defect on the back surface 1d and a bend in the lead part 1a, the corresponding tCl is
When it is rotated 70 degrees, it is discharged to the defective IC storage box 25.

Further, the IC 1 transported through the horizontal transport path 24 is imaged to show the state of the mark on the front surface 1C by the third inspection section 26, and the image signal is supplied to the mark defect determination section 74, and the fourth inspection section 2
7. The state of the lead portion 1a is imaged in the fifth inspection section 28,
The IN image signals are respectively supplied to the lead defect determination section 75, the mold state of the surface 1C is imaged by the sixth inspection section 29, and the Ill image signal is sent to the surface mold lower defect determination section 76.
supplied to

As a result, the mark defect determination section 74 extracts only the image signal of the mark surface, that is, the surface 1C, based on the Wi image signal from the third inspection section 26, and compares it with a pre-registered reference pattern (pattern recognition). Mark defects on the mark surface 1C of the ICI are determined, and the determination results are output to the control section 71.

Further, the lead defect determination section 75 extracts only the lead section 1a based on the Il image signals from the fourth and fifth inspection sections 27 and 28, and detects the IC1 according to the length of the black information and the number of black blocks.
The control unit 7 determines whether the lead portion 1a has a lead defect such as a crack or a solder defect.
Output to 1.

Further, the surface mold defect determination section 76 receives the ! from the sixth inspection section 29! The mold part, that is, the surface 1C by the l image signal.
The IC extracts only the image signal and determines whether there is black information or not.
Mold defects such as holes (pinholes), unfilling, chips, cranks, and scratches on the surface 1C of I are determined, and the determination results are output to the control section 71.

Therefore, the control section 71 includes a mark defect determination section 74, a lead defect determination section 75, and a surface mold defect determination section 76.
Based on the determination result from , it is determined whether the corresponding ICI is a good product or a defective product. As a result, the control unit 71 detects a non-defective product, that is, a defective mark on the surface 1c, a defective mold, and a defective lead portion 1a.
If it is determined that there is no cracking or soldering defect, the corresponding IC 1 is distributed to the non-defective conveyance path 31 at the branching section 30.

In addition, when the control unit 71 determines that there is a defective product, that is, a mark defect on the surface 1C, a mold defect, and a lead portion 1a that has a cracked or soldered defect, the corresponding IC
1 is distributed to a defective product conveyance path 32 at a branching section 30.

The ICs 1 transported through the non-defective transport path 31 are sequentially stored in the non-defective stacker 36 . When the detector 40 for detecting fullness of the good product stacker 36 detects the full state, the stopper 101 in front of the detector 40 stops the IC 1 conveyed through the good product conveyance path 31, and the non-defective product stacker 36 is stopped by the pusher mechanism (not shown). The ICIs inside are pushed out to the good IC storage section 19 and stored in the corresponding empty sticks 2 at this time. The stick 2 containing this good quality ICI is
Further, the stick is sent to a later stage by the horizontal stick conveyor 14, and after a rubber stopper for preventing the ICI from falling is inserted by the rubber stopper insertion mechanism 100, it is discharged into the good stick storage box 37.

In addition, the IC 1 transported through the defective product transport path 32 is transported by a shuttle 33 provided at the terminal end of the defective product transport path 32.
The 19 defect sticks 34 corresponding to the defect type are moved in accordance with the defect type (item).
, . . . are selectively stored in one of them.

As mentioned above, when the external processing of the IC is soldering,
By changing the optical axis positions of the fourth and fifth inspection sections depending on the case of tin plating, each inspection section can be imaged using a specular reflection or diffuse reflection inspection method. This makes it possible to easily inspect the soldering process and the tin plating process. That is, by switching the optical system of the inspection section with a single touch, it is possible to inspect not only the tin plating process as the exterior treatment but also the lead portion of the soldered IC.

[Effects of the Invention] As detailed above, according to the present invention, even if the exterior treatment of the lead portion of the electronic component is tin plating treatment or soldering treatment, the electronic component inspection can be performed easily. equipment can be provided.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention; FIG. 1 is a diagram for schematically explaining the overall configuration, FIG. 2 is an external view of FIG. 1, and FIG. 3 is an explanation of the internal configuration. FIG. 4 is a diagram for explaining the configuration of the IC, the fifth factor is a diagram schematically showing the configuration of the first inspection section, and FIG. 6 is a diagram schematically showing the configuration of the second inspection section. Figure 7 shows the first and second factors for the IC.
A diagram for explaining the imaging range of the inspection section, FIG. 8 is a diagram schematically showing the configuration of the third inspection section, FIG. 9 is a diagram schematically showing the configuration of the fourth inspection section, and FIG. A diagram schematically showing the configuration of the fifth inspection section, FIG. 11 a diagram schematically showing the configuration of the sixth inspection section, and FIG. 12 a block diagram showing the main parts of the control circuit.
Figure 13 is a diagram for explaining mold defects, Figures 14 and 16 are diagrams for explaining lead defects, Figure 15 is a diagram for explaining mark defects, and Figure 17 is a diagram for explaining normal marks. Figures 18 and 19 show examples of ICs in such cases. !
1 is a diagram for explaining a horizontal conveyance path for conveying an IC upward, and FIGS. 20 and 21 are diagrams for explaining a horizontal conveyance path for conveying an IC downward. 1...IC (electronic component), 1a-...Lead part, 1b
...Mold part, 1G...Mark surface (surface), 1d
...back side, 2...stick, 11...accommodation section,
12... Stick scraping conveyor, 13... Bar, 14... Stick horizontal feed conveyor, 15...
- Loader section, 16... Shooter, 17... Horizontal conveyance path, 21... First inspection section, 22... Second inspection section, 2
3...Rotation reversal unit, 24...Horizontal conveyance path, 26...
・Third inspection section, 27...Fourth inspection section (inspection means), 2
8... Fifth inspection section (inspection means), 29... Sixth inspection section, 30... Branch section, 31... Good product conveyance path, 32.
...Defective product transport path, 33...Shuttle, 34...
Defective stick, 36... Good product stacker, 71...
・Control unit, 72...Back side mold defect determination unit, 73・
...Lead defective determination section, 74... Mark defective determination section,
75... Lead defect determination unit, 76... Surface mold defect determination unit, 77-81... Driver, 100...
Rubber stopper insertion mechanism. Applicant's agent Patent attorney Takehiko Suzue Figure 2 (b) (C) (d) Figure 4 Figure 6 Figure 7 Figure 8 Figure 11 Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 20

Claims (3)

[Claims] (1) Inspection means for inspecting the lead portion of an electronic component using an optical system; and switching means for switching the position of the optical system of the inspection means depending on the type of exterior treatment on the lead portion of the electronic component. Features of electronic component inspection equipment. (2) The type of exterior treatment on the lead part of the electronic component is
The electronic component inspection apparatus according to claim 1, wherein the electronic component inspection apparatus is subjected to tin plating treatment or soldering treatment. (3) The electronic component according to claim 1, wherein the switching means switches the inspection method to diffuse reflection or specular reflection by switching the optical axis position of the optical system of the inspection means. Inspection equipment.