JPS63141335A - Electronic part inspection device - Google Patents

Abstract

PURPOSE:To enable the visual inspection to be performed accurately and evenly while making it feasible to perform the high speed inspection process by a method wherein electronic parts being intermittently carried are inspected at specified time after stoppage of carrier means. CONSTITUTION:An IC 1 carried by the third inspection part 26 (or the fourth inspection part 27, the fifth inspection part 28 and the sixth inspection part 29) and a horizontal carrier channel 24 i.e. profiles 121 corresponding to the third inspection part 26 (or the other inspection parts) is to be image picked up at 100 mmsec after stoppage of the profiles 121 (by time out signal of a timer). At this time, the IC 1 slides between the profiles 121 not to stop at once due to high speed carriage (two each/sec) even if the profiles 121 stop however to be stopped at a position between the profiles 121 without fail after 100 mmsec.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) This invention determines defects in, for example, leads, molds, marks, etc. of a DIP type IC, and distinguishes between good products and defective products.
The present invention relates to an electronic component inspection device such as a high-speed IC visual inspection device that sorts and then automatically stores it in a stick.

(Prior art) Conventionally, DIP (dual in-line packer)
ge) type IC, for example, 16-bin DIRl or 42
The IC visual inspection process, in which defects in the DIR leads, molds, marks, etc. of the bottle are judged, and the ICs are sorted into good and defective products, and then stored in the intrusion stick, is performed by human vision.

The above DIP type IC is, for example, 0.1 inch (2,54
It is a standard package for ICs with a pin arrangement on both sides, with a spacing of 1 mm).

However, in this type of device, since the inspection was performed using human vision, there was a problem that the inspection results varied and accurate inspection could not be performed.

(Problems to be Solved by the Invention) As mentioned above, this invention eliminates the drawback that there is variation in test results and accurate testing cannot be performed.
It is an object of the present invention to provide an electronic component inspection device capable of performing accurate and uniform appearance inspection and high-speed inspection processing.

[Structure of the Invention] (Means for Solving the Problems) The electronic component inspection apparatus of the present invention includes a conveying means for intermittently conveying electronic components, and an electronic component conveyed by this conveying means. It consists of an inspection means that performs an inspection after a predetermined period of time has elapsed after the system has stopped.

(Function) In the present invention, electronic components are intermittently transported by a transport means, and the electronic components that are intermittently transported are inspected after a predetermined FR period has elapsed after the transport means has stopped.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A high-speed IC visual inspection apparatus as an electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 1 to 3. That is, reference numeral 11 denotes a housing section in which several sticks 2 storing a plurality of ICIs to be inspected (tested) are stored.

This storage section 11 has a capacity that can accommodate 400 sticks 2. As the above-mentioned ICI, 16-bin to 42-pin DIP type ICs are used.

In the above stick 2, if lcl is 1'6 pin, 2
It is designed to store 5 pieces.゛The above summer C1 is a 16-pin DIP! S! In the case of IC, Figure 4(a)~
As shown in (d), it is composed of a lead part 1a consisting of eight lead wires on each side, and a mold part 1b, and the mold part 1b has a front surface, that is, a mark surface 1C1, and a back surface 1d.

The stick 2 is usually plugged at both ends to prevent the ICI inside from spilling out when it is tilted, but when it is stored in the storage section 11, it is placed on the inspection section side, that is, on the third side.
In the figure, the plug on the right side is not closed. The sticks 2 in the storage section 11 are lifted up one by one by a stick lifting conveyor 12. The scraping conveyor 12 is provided with stick holding bars 13 at regular intervals.

The spacing and height of the bars 13 are determined by the center of gravity only when the raking stick 2 is in the desired direction.
The size is adjusted so that it rides on the bar 13 and is scraped up, and when it is in a direction other than the desired direction, it does not ride on the bar 13 or falls even if it rides on it.

The desirable direction of the stick 2 is that when the stick 2 is located at the upper end of the scraping conveyor 12, the IC inside the stick 2 is
I is on its back, that is, the lead part 1a of IC1 is facing upward,
This is a state in which the mark surface 1C of the mold part 1b faces downward.

The sticks 2 riding on the bar 13 and being scraped up by the scraping conveyor 12 are rotated 90 degrees at the upper end of the scraping conveyor 12, and then the sticks 2 are rotated 90 degrees by the stick horizontal feeding conveyor 14.
transfer to. At this time, as described above, only the sticks 2 whose direction has been selected by the bar 13 reach the upper end, so all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state.

The stick 2 conveyed by the horizontal stick conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), so that the ICs 1, . . . inside are taken out from the opening on the right side. ing. The ICs 1, . . . taken out are guided to a horizontal transport path 17 via a shooter 16. The chute 16 is provided with a stopper (not shown) for temporarily stopping the tC that is being dislodged.
The lcl is sent one by one to the horizontal transport path (Ill transport means) 17 in synchronization with the transport.

The stick 2 from which the IC1, . Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any remaining ICI in the transported stick 2. If the result of this detection is that there is no residual ICI, the IC is transported to the rear non-defective IC storage section 19. If there is any remaining IC, it is accommodated in the upper IC remaining storage section 20. A detailed explanation of the IC residual detecting section 18 and the IC residual accommodating section 20 is described in Japanese Patent Application No. 60-214501, and will therefore be omitted here.

As shown in FIGS. 18 and 19, the horizontal conveyance path 17 includes two rails 110 and 110 that support the IC1.
, by moving between these rails 110, 110 in a state protruding from the upper surface of the rail 110, the rail 11
Profile 111 as a push claw that presses IC1 on 0,110,... These profiles 111,...
The timing belt 112 is connected to the timing belt 112, and a driven pulley 113 and a drive pulley 114, around which the timing belt 112 is stretched, rotates and moves the timing belt 112. The drive pulley 114 is rotated by a motor (not shown).

That is, as shown in FIG. 4(a), the ICI supplied from the shooter 16 rides on the rail 110, 110 with the lead portion 1a facing upward and the mark surface 1G downward, and is pushed by the profile 111. This allows it to move forward.

The profiles 111, . . . are lined up at regular intervals, and their drive systems are controlled to operate intermittently. That is, the ICI sent from the shooter 16 is transmitted to the rail 11 when the profiles 111, . . .
0.110, profile 111,...
is pushed forward with the movement of , but since there is also a profile 111 in front, there are two profiles 111.
The profile 111, .

The ICI transported on the horizontal transport path 17 includes a first inspection section 21 which is disposed opposite to each other with the horizontal transport path 17 interposed therebetween;
The second inspection section 22 images the molding state of the back surface 1d of the IC 1, the state of the lead section 1a, etc., and at that time, the image signal is sent to the back surface mold defect determination section 72, which will be described later.
and is output to the lead defect determination section 73.

The first inspection section 21 uses specular reflection, as shown in FIG. 4(a).
As shown in FIG. 5, this is an inspection section that performs an inspection (!H1) on the back surface 1d and lead portion 1a of the IC1, and as shown in FIG.
Mirror 42 that guides the reflected light from C1 to the subsequent stage, the above ICI
In order to cope with the reflected light from the entire surface of the mirror 4,
2, and the mirror 42
llltIA section 44, which is composed of a COD camera that converts the signal for each scanning line derived from the
It consists of

Further, the second inspection section 22 has the same configuration as the first inspection section 21, and is configured as shown in FIG. 6.

The image selling section 44 of the first inspection section 21 and the second inspection section 22 is
The effective field of view is equal to or longer than the fixed interval between the profiles 111, .

As a result, when the profiles 111, . . . There is.

For example, between two profiles 111.111 is 50.
In mm, the effective field of view of the first inspection section 21 and the second inspection section 22 is 51.2 mm.

Further, the relationship between the first inspection section 21 (or the second inspection section 22) and the horizontal conveyance path 17, that is, the ICs 1 conveyed by the profiles 111, .
The first inspection section 21
The ICI image is taken between the profiles 111 and 111 to which the profile corresponds. In this case, since high-speed conveyance (2 pieces per second) is being carried out, the profile 111,...
Even if the ICI stops, it does not stop immediately as the ICI slides through the profile 111,111 questions, but 1
After 00mm5ec, the profile is definitely 111.11
It is designed to stop after 1 hour.

This allows profile 1 to be transferred while ICI is transported at high speed.
11, . . . even if the ICI slips, reliable am, that is, inspection processing can be performed.

The above-mentioned timer starts when the profiles 111, . . . stop, and outputs a timeout signal after 100 mm 5 ec.

As shown in FIG. 7, the first inspection section 21 outputs an imaging signal for determining mold defects and lead wire defects in the right half of the receiver surface 1d of the IC 1 from the center line in the transport direction. , from the second inspection section 22, the back of the ICI.
1lli for determining mold defects and lead wire defects on the left half of the center line of surface 1d! A signal is now output.

As a result, although the first and second inspection sections 21 and 22 have the same configuration, the inspection is difficult! The range of the back surface 1d of the lcl that is imaged has different halves, and the relationship between the incident light from the illumination unit 41 and the reflected light to the imaging unit 44 is reversed.

That is, in FIG. 3, in the first inspection section 21, the illumination section 41 is located in front of the horizontal conveyance path 17;
In the second inspection section 22, the illumination section 41
The m-image section 44 of the second inspection section 22 is located at the back of the
In order to capture the reflected light directed toward this side from the horizontal conveyance path 17,
It overhangs the horizontal conveyance path 17.

In addition, in the first inspection section 21, the illumination section 41 is positioned at a position where the incident light from the illumination section 41 and the reflected light to the ms section 44 are incident and reflected at approximately the same angle with respect to the normal plane of the back surface 1d of the ICI. , Il image section 44 are arranged. For this reason, the imaging section 44 is not on the normal plane to the back surface 1d of the IC 1 and forms a certain angle with this, so the mold surface on the back surface 1d is viewed obliquely, and the image section 44 side The lead image overlaps the mold image on the same side, making it impossible to detect defects on the mold. Therefore, it is difficult to detect a signal for mold defect determination from the center line of the back surface 1d of the IC 1 to the Ill image section 44 side. The mold defect determination is performed only on the half on the side of the illumination section 41 from the mold center line (the right half in FIG. 7).

In addition, in the first inspection section 21, the ICI on the illumination section 41 side
The lead portion 1a is designed to block reflected light from the rail on the illumination portion 41 side to the Ome portion 44, and the lead portion 1a of the illumination portion 4
By giving the rail surface on the first side a property (white) that reflects light well, it is possible to cast eleven shadows from the lead section 1a on the illumination section 41 side.

In addition, the first inspection section 21 cannot inspect the half of the we part 44 side from the mold center line (the left half in Fig. 7)! l
@,and! Imaging of the shadow of the dot portion 1a on the side of the liill image portion 44 is performed in the second inspection portion 22.

Further, the distance between the centers of the fields of view of the first inspection section 21 and the second inspection section 22 is equal to the distance between the profiles 111, . . . ! ! It has increased several times. As a result, when the profiles 111, . . . that perform intermittent motion stop, the first inspection section 2
Since the ICI exists both in the field of view of the first inspection unit 22 and in the field of view of the second inspection unit 22, images can be taken simultaneously.

At the end of the horizontal conveyance path 17, a rotation reversal section 23 is provided. This rotation reversing section 23 is connected to the horizontal conveyance path 17
The mounted ICI is sent to a horizontal transport path (transport means) 24 or a defective IC storage box 25 according to the determination results of a back mold defect determination section 72 and a lead defect determination section 73, which will be described later. In other words, a non-defective IC 1 whose back mold condition and lead part condition are determined to be normal is sent to the opposing horizontal conveyance path 24 when rotated 180 degrees, and a defective IC 1 whose back side mold condition and lead part condition are determined to be normal is sent to the opposite horizontal conveyance path 24. When the good ICI is further rotated by 90 degrees (270 degrees), it is discharged into the defective IC storage box 25 via an opposing discharge chute (not shown). As a result, the IC1 determined to be a defective product by the imaging by the first and second inspection sections 21 and 22 is eliminated, and the good ICI is turned upside down, that is, the lead part 1a faces downward and the mark surface 1C faces upward. The paper is inverted and sent to the horizontal transport path 24. Sending out the IC1 by the rotating conveyance path 23 (
Discharge) is performed using high pressure air.

As shown in FIGS. 20 and 21, the horizontal conveyance path 24 includes two rails 120 and 120 that support the IC1.
, by moving between these rails 120, 120 in a state protruding from the upper surface of the rail 120, the rail 12
Profile 121 as a push claw that presses IC1 on 0.120, ..., these profiles 121, ...
The timing belt 122 is connected to the timing belt 122, and a driven pulley 123 and a driving pulley 124 around which the timing belt 122 is wrapped around and rotates the timing belt 122. The driving pulley 124 is rotated by a motor (not shown).

That is, Ic1 supplied from the rotation reversing unit 23 is
As shown in Figure (b), it rides on the rails 120, 120 with the lead portion 1a facing down and the mark surface 1C facing up, and is moved forward by being pushed by the profile 121.

The profiles 121, . . . are lined up at regular intervals, and their drive systems are controlled to operate intermittently. That is, IC1 sent from the rotation reversing unit 23
is placed on the rail 120, 120 when the profile 121, ↑... stops, and the profile 121, ↑... is placed on the rail 120, 120.
... is pushed forward as it moves, but since there is also a profile 121 in front, there are two profiles 121.1.
21, and moves forward while making intermittent movements together with these profiles 121, .

The IC 1 transported on the horizontal transport path 24 includes a third inspection section 26 which is disposed opposite to each other with the horizontal transport path 24 interposed therebetween;
The fourth inspection section 27, the fifth inspection section 28, and the sixth inspection section 29 check the mark state of the mark surface 1C of the IC 1 and the lead section 1.
The condition of a and the mold condition of the mark surface 1C are determined, and the hearsay signal is outputted to a mark defect determination section 74, a lead defect determination section 75, and a front mold defect determination section 76, which will be described later. It has become. 3rd above
, the intervals between the fourth, fifth, and sixth inspection sections 26, 27, 28, 29 are integral multiples of the profiles 121, . . . , respectively.

The third inspection section 26 uses diffuse reflection, as shown in FIG. 4(b).
As shown in FIG.
lli image), and as shown in FIG. 8, an illumination section 51 composed of a straight fluorescent lamp, an ND filter 56, and a shading section that reflects the light from the illumination section 51 and guides it to the IC1. A prevention mirror 52, a mirror 53 that guides the reflected light from the ICI to a subsequent stage, a mirror drive unit 54 that rotates the mirror 53 in order to respond to the reflected light from the entire surface of the ICI on the mark surface 1C, and the mirror 53. 2) An image section 55 constituted by a COD camera that converts a signal for each scanning line derived from 53 into an electric signal. The third inspection section 26 is configured to output a carrier signal for the mark surface of the IC 1, that is, the entire surface of the front IC, to a mark defect determination section 74, which will be described later.

The fourth inspection section 27 can selectively use specular reflection or diffuse reflection, and as shown in FIG. 4(C),
This is an inspection section that performs inspection 11 (II) on the lead section 1a of the IC 1, and as shown in FIG. A mirror 64 for preventing shading, a mirror 65 that guides the reflected light from the ICI to a subsequent stage, and a mirror that rotates the mirror 65 to accommodate the reflected light from the entire surface of the IC1. It consists of a driving section 66, and a 1fflO section 67 constituted by a COD camera that converts the signal for each scanning line guided from the mirror 65 into an electrical signal.In this case, the fourth inspection section 27 is configured by specular reflection. Whether it is used for diffuse reflection or for diffuse reflection is changed depending on the movement of the mirror 65, mirror drive section 66, and imaging section 67 and the lighting section 62, 61. In the case of tin plating, diffuse reflection is used, and in the case of soldering, specular reflection is used.

The fourth inspection section 27 is configured to output a signal for the lead section 1a of the ICI to a lead defect determination section 75, which will be described later.

Furthermore, the fifth inspection section 28 also has the same configuration as the fourth inspection section 27, as shown in FIG. The fifth inspection section 28 is configured to output an imaging signal for the lead section 1a of the IC 1 (on the opposite side to the fourth inspection section 27) to a lead defect determination section 75, which will be described later.

The 1116 inspection unit 26 uses specular reflection, and the 41st (
As shown in d), this is an inspection section that performs an inspection (Ilfl) on the mark surface 1C of TCl, and as shown in FIG. 11, it has the same configuration as the first inspection section 21 described above. This sixth inspection section 29 is adapted to output a signal 111 (m) for the entire marked surface, that is, the surface 1C of the IC 1, to a surface mold defect determination section 76, which will be described later.

A branch portion 30 is provided at the terminal end of the horizontal conveyance path 24 . This branching section 30 determines whether the ICI supplied from the horizontal conveyance path 24 is a good product or a defective product, based on the determination result of a determination section 74, 75, or 76 (described later).
1 or to the defective product conveyance path 32.

The IC1 supplied to the defective product transport path 32 corresponds to the type of defect by moving the shuttle 33 provided at the end of the defective product transport path 32 in accordance with the type (item) of the defect. 19 defective sticks 34...
・It is designed to be selectively stored in. Which stick of the defective sticks 34, . In this case, the number of sticks for one specific defect is up to 5, and the number of types of defects is up to 9.

The ICIs supplied to the non-defective transport path 31 are stored in a non-defective stacker 36 provided at the end of the non-defective transport path 31. When the ICs 1 stored in the non-defective stacker 36 become full, the ICs 1 in the non-defective stacker 36 are pushed out to the non-defective IC storage section 19 by a push-out mechanism (not shown), and placed in the corresponding empty stick 2. It is designed to be stored. This good IC
The stick 2 containing the ICI is further sent to a later stage by the stick horizontal feed conveyor 14, and after a rubber stopper to prevent the ICI from falling is inserted by the rubber stopper insertion mechanism 100, it is placed in the good stick storage box 37. It is supposed to be released.

IC1 in the above-mentioned good product conveyance path 31 and defective product conveyance path 32
The conveyance is carried out by high pressure air, and the
- Since the details are described in No. 190114,
The explanation thereof will be omitted here.

Further, the details of the rubber plug stopper inserting machine jI4100 are also described in Japanese Patent Application No. 1982-231709, so the explanation thereof will be omitted here.

The operating section 35 is housed in a drawer section 38 shown in FIG.

Further, a CRT display 39 is provided in each of the above sections, particularly above the inspection section. This CR,T display 3
9 is a detection installed at main positions on the conveyance path! ! 40,
. . . It displays the location of transport abnormality corresponding to the detection signal from ..., the number of non-defective products, the number of various types of defective products, and the branch details of the defective product stick.

Next, the control circuit will be explained using FIG. 12. That is, the control section 71 that controls the entire
, a back side mold defect determination section 72 that determines mold defects on the back surface 1d of the ICI based on outputs from the second inspection section 21.22; A lead defect determination section 73 that determines a lead defect, a mark defect determination section 74 that determines a mark defect of the mark 1ii1c of the IC1 based on the output from the third inspection section 26, and a mark defect determination section 74 that determines a mark defect of the mark 1ii1c of the IC1 based on the output from the third inspection section 26; A lead defect determination section 75 that determines a lead defect in the lead portion 1a of the IC 1 based on the output. It is comprised of a surface mold defect determination section 76 that determines mold defects on the mark surface 1C of the ICI based on the output from the sixth inspection section 29, and drivers 77 to 81 that drive each of the above sections.

The back side mold defect determination section 72 receives the 111Ifa signal from the first and second inspection sections 21 and 22 to detect W11! of the mold part, that is, the back side 1d! Only the I signal is extracted and a mold defect on the back surface 1d of the ICI is determined based on whether there is black information. The mold defects include pinholes, unfilling, chips, cracks, and scratches as shown in FIGS. 13(a) to 13(e).

The lead defect determination section 73 includes the first and second inspection sections 2
Only the lead part 1a is taken out by the 11mm signal from 1.22, and the ICI is determined by the length of the black information and the number of black blocks.
This is to determine whether there is a lead defect in the lead portion 1a. These lead defects include lead bending, lead bending, dam cut eccentricity, and lead bending inside and outside, as shown in FIGS. 14(a) to 14(d). The defective inner and outer surfaces of the lead portion 1a can be determined by measuring the length of the shadow of the lead portion 1a by utilizing the fact that the length of the shadow of the lead portion 1a is proportional to the inward or outward bending angle of the lead portion 1a. The decision is made based on this.

The mark defect determination section 74 extracts an image signal of only the mark surface 1c from the image signal from the third inspection section 26, and compares it with a pre-registered reference pattern (pattern recognition) to detect the mark surface 1C of the IC1. This is to determine whether the mark is defective or not. This mark defect is the 15th
e As shown in (a) to (+), there are no marks, reverse marks, typos, misalignment, inclinations, blurring, blurring, chips, scratches, etc.

The lead defect determination section 75 includes the fourth and fifth inspection sections 2
11 from 7.28! Only the lead portion is taken out based on the ICI image signal, and a lead defect in the lead portion 1a of the ICI is determined based on the length of black information and the number of black blocks. These lead defects include poor tintness and poor soldering as shown in FIGS. 16(a), 16(b), and 16(c).

The surface mold defect determination section 91 includes the sixth inspection section 2
The mold part, that is, the mark surface 1C by the imaging signal from 9.
IC
This is to determine whether there is a mold defect on the mark surface 1C of I. The mold defects include pinholes, unfilling, chips, cracks, and scratches as shown in FIGS. 13(a) to 13(e).

It should be noted that the mark defect determination section 74 determines that the I is a good product.
The CI is as shown in FIG.

Each image section of the third inspection section 26 to the sixth inspection section 29 is as follows:
The effective field of view is equal to or longer than the fixed interval between the profiles 121, .

As a result, when the profiles 121, . . .
It is now possible to take images of lead Japanese movies).

For example, two profiles have 121.121 questions and 50
In mm, the effective field of view of the third inspection section 26 to the sixth inspection section 29 is 51.2 mm.

Also, the third inspection section 26 (or the fourth inspection section 27, the fifth inspection section
The relationship between the inspection section 28, the sixth inspection section 29) and the horizontal conveyance path 24, that is, the ICI transported by the profiles 121, . ), the third inspection unit 26 (or other inspection unit) detects the IC1 between the corresponding profiles 121 and 121.
It is designed to take images of In this case, high-speed transport (
2 per second), the profile 121,・
Even if ... stops, IC1 has profile 121.12.
It slides between 1 and does not stop immediately, but the 100mm5ecll definitely has a profile of 121.
．． It is designed to stop between 121 and 121 seconds.

With this, while transferring IC1 at high speed, profile 1
Even if the ICI slips when 21, . . . is stopped, reliable imaging, that is, inspection processing can be performed.

The above-mentioned timer starts when the profiles 121, . . . stop, and outputs a timeout signal after 100 mm 5 ec.

The control section 71 is configured to perform ICI transport control or distribution control in accordance with the detection results of the detectors 40, . . . .

The control unit 71 intermittently rotates the drive pulleys 114, 124 by driving a motor (not shown), and the horizontal conveyance path 17, that is, the profile 111,...
and the horizontal conveyance path 24, that is, the profile 121,
...is operated intermittently at high speed. As a result, the profile 111, ... or 121,
...ICI is 21IIW per second! It is set to be sent.

The control section 71 determines whether the corresponding ICI is a good product or a defective product due to which defect, according to the determination results of each of the determination sections.

Further, the ill 111 section 71 counts the number of non-defective products and the number of defective products for each item, and stores the counting results in an internal memory (not shown).

The contents of the count are displayed on the CRT display 39 or printed out using a printer (not shown).

Further, the criteria for each of the above-mentioned determination units are stored in advance in a ROM or floppy disk (not shown).゛The above criterion is, for example, IC1
When determining the length of the lead portion 1a, it is determined whether the length is shorter than a predetermined length by within 1 mm, or if the length is within the standard. The determination criteria of each of the determination units described above can be changed in advance by the user. This modification method involves modifying the contents of a floppy disk (not shown) in which the modification criteria are stored.

Next, the operation in such a configuration will be explained.

For example, when the power (not shown) is turned on, the operation section 35
Accordingly, the allocation of defective products to the defective sticks 34, . . . is set in advance. Then, the rubber stopper on the right side is removed, and the sticks 2, . . . containing the inspected objects 1-CI, . Then, the sticks 2 in the storage section 11 are scraped up one by one by the bar 13 of the stick scraping conveyor 12. At this time, due to the center of gravity of the stick 2, the stick 2 is raked upward only when it is in a desired direction, and is otherwise dropped into the storage section 11.

Next, the sticks 2 that ride on the bar 13 and are scraped up by the scraping conveyor 12 are transferred to the scraping conveyor 12.
It rotates 90 degrees at the upper end and transfers to the stick horizontal feed conveyor 14. At this time, as mentioned above, the bar 13
Since only the stick 2 whose direction has been selected reaches the upper end, all the ICIs in the stick 2 on the stick horizontal feed conveyor 14 are in a supine state as shown in FIG. 4(a).

The stick 2 conveyed by the stick horizontal feed conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), and the lcl, . - is led to the horizontal conveying path 17 via the pipe 16.

The ICIs supplied to this horizontal transport path 17 are transported one by one.

The stick 2 from which the ICI, . Here, when the stick 2 is released from being held by the O-der section 15, the stick 2 is further horizontally moved by the stick horizontal feed conveyor 14 and conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any ICI remaining in the stick 2 that has been transported. As a result of this detection, if there is no residue, the stick 2 is further conveyed to the rear non-defective IC storage section 19 by the horizontal stick conveyor 14, and if there is any residue, the stick 2 is
is stored in the upper IC residual storage section 20.

The IC 1 transported on the horizontal transport path 17 is
The inspection section 21 and the second inspection section 22 take images of the mold state of the body 1d, the state of the lead section 1a, and the like, and the image signals are supplied to the back mold defect determination section 72 and the lead defect determination section 73, respectively. As a result, the back side mold defect determination unit 72 extracts only the ffi image signal of the mold part, that is, the back side 1d, based on the imaging signals from the first and second inspection units 21 and 22, and determines whether there is black information or not. Mold defects such as holes (pinholes), unfilling, chips, cracks, and scratches on the back surface 1d of the mold are determined, and the determination results are output to the control section 71.

In addition, the lead defect determination section 73 extracts only the lead section 1a based on the ll image signals from the first and second inspection sections 21 and 22, and uses the ICI
Determine lead defects such as bending the lead portion 1a, bending the lead, bending the dam cut, eccentrically bending the lead, etc.
This determination result is output to the control section 71.

Therefore, the control section 71 controls the back mold defect determination section 72.
Based on the determination result from the lead defect determination section 73, it is determined whether the corresponding ICI can be sent to the subsequent inspection section. As a result, if it is determined that the control section 71 can be sent to the subsequent inspection section, that is, there is no mold defect on the back surface 1d and no bending of the lead section 1a, the corresponding IC 1 can be sent to the rotation reversing section 23.
When it is rotated by 180a, it is delivered to the -horizontal conveyance path 24.

In addition, if the control unit 71 determines that it cannot be sent to the subsequent inspection unit, that is, that there is a mold defect on the back surface 1d and a bend in the lead part 1a, the corresponding IC 1 is
When it is rotated 70 degrees, it is discharged to the defective IC storage box 25.

Moreover, the condition of the mark on the surface 1C of the IC 1 transported through the horizontal transport path 24 is imaged by the third inspection section 26, and its Ifi
The image signal is supplied to the mark defect determination section 74, the fourth inspection section 27 and the fifth inspection section 28 perform m-images of the state of the lead portion 1a, and the Ii image signals are supplied to the lead defect determination section 75, respectively. 6 Inspection section 29 images the mold condition of surface 1C, and the image signal is supplied to surface mold defect determination section 76.

As a result, the mark defect determination section 74 extracts only the m-image signal of the mark surface, that is, the surface 1C, based on the vayu signal from the third inspection section 26, and compares it with a pre-registered reference pattern (pattern recognition). , determines whether there is a mark defect on the mark surface 1C of the IC1, and outputs the determination result to the control section 71.

Further, the lead defect determination section 75 extracts only the lead portion 1a based on the m-image signals from the fourth and fifth inspection sections 27 and 28, and determines whether the lead portion 1a of the IC 1 is detected based on the length of the black information and the number of black blocks. The control unit 71 determines if the lead is defective, such as lead failure or poor soldering.
Output to.

Further, the surface mold defect determination section 76 extracts only the imaging signal of the mold section, that is, the surface 1C, from the me multiplied signals from the two sixth inspection sections, and determines whether there is black information or not.
Holes (pinholes), unfilled, chipped,
Mold defects such as cracks and scratches are determined, and the determination results are output to the slope control section 71.

Therefore, the control section 71 includes a mark defect determination section 74, a lead defect determination section 75, and a surface mold defect determination section 76.
Based on the determination result from , it is determined whether the corresponding IC1 is a good product or a defective product. As a result, the control unit 71 detects a non-defective product, that is, a defective mark on the surface 1c, a defective mold, and a defective lead portion 1a.
When it is determined that there is no cracking or soldering defect, the corresponding IC 1 is distributed to the non-defective WI return path 1 at the branching section 30.

In addition, when the control unit 71 determines that there is a defective product, that is, a mark defect on the surface 1c, a mold defect, and a lead portion 1a that has a cracked or soldered defect, the corresponding IC
1 is distributed to a defective product conveyance path 32 at a branching section 30.

The ICs 1 transported through the non-defective transport path 31 are sequentially stored in the non-defective stacker 36 . When the detector 40 for detecting fullness of the good product stacker 36 detects the full state, the stopper 101 in front of the detector 40 stops the IC 1 conveyed through the good product conveyance path 31, and the non-defective product stacker 36 is stopped by the pusher mechanism (not shown). The ICIs inside are pushed out to the good IC storage section 19 and stored in the corresponding empty sticks 2 at this time. The stick 2 containing this good IC1 is
The IC 1 is then sent to a later stage by the horizontal stick conveyor 14, and after a rubber stopper for preventing the IC 1 from falling is inserted by the rubber stopper insertion mechanism 100, it is discharged into the good stick storage box 37.

In addition, the IC 1 transported through the defective product transport path 32 is transported by a shuttle 33 provided at the terminal end of the defective product transport path 32.
The 19 defect sticks 34 corresponding to the defect type are moved in accordance with the defect type (item).
, . . . are selectively stored in one of them.

As described above, the ICs that are intermittently transported by the horizontal transport path, that is, the profile, are imaged by the corresponding inspection section 100 mm and 5 ec after the profile stops.

Thereby, it is possible to carry out reliable imaging even if the IC slips while transporting the IC at a high speed. Therefore, high-speed visual inspection can be performed reliably.

[Effects of the Invention] As described in detail above, the present invention provides an electronic component inspection device that can inspect accurate and uniform appearance and also perform high-speed inspection processing. can.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention; FIG. 1 is a diagram for schematically explaining the overall structure, FIG. 2 is an external view of FIG. 1, and FIG. 3 is an illustration of the internal structure. Figure 4 is a perspective view for explaining the configuration of the IC, Figure 5 is a diagram schematically showing the configuration of the first inspection section, and Figure 6 is a diagram schematically showing the configuration of the second inspection section. Figure 7 shows the first and second
A diagram for explaining the imaging range of the inspection section, FIG. 8 is a diagram schematically showing the configuration of the third inspection section, FIG. 9 is a diagram schematically illustrating the configuration of the fourth inspection section, and FIG. 10 11 is a diagram schematically showing the configuration of the fifth inspection section, FIG. 11 is a diagram schematically showing the configuration of the sixth inspection section, FIG. 12 is a block diagram showing the main parts of the control circuit, and FIG. 13 is a mold diagram. Diagram for explaining defects, No. 14
Figure 16 is a diagram for explaining lead failure, Figure 15
The figure is a diagram for explaining a defective mark, Figure 17 is a diagram showing an example of an IC with a normal mark, and Figures 18 and 19 are diagrams for explaining a horizontal transport path for transporting an IC upward. 20 and 21 are diagrams for explaining a horizontal conveyance path for conveying an IC in a downward direction. 1...IC (electronic component), 1a...Lead part, 1b
...Mold part, 1C...Mark surface (front surface), 1d
...back side, 2...stick, 11...accommodation section,
12... Stick scraping conveyor, 13... Bar, 14... Stick horizontal feed conveyor, 15...
・Loader section, 16... Shooter, 17... Horizontal conveyance path (m feeding means), 21... 1st inspection '1 part (inspection means)
, 22... Second inspection section (inspection means), 23... Rotation reversal section, 24, Horizontal transport path (transport means), 26-.
- Third inspection section (inspection means), 27... Fourth inspection section (inspection means), 28-Fifth inspection section (inspection means), 29...
6th inspection section (inspection means), 30...branch section, 31...
・Good product conveyance path, 32... Defective product transfer path, 33... Shuttle, 34゛~... Defective product stick, 36...
Good product stacker, 71... Control unit, 72... Back mold defect determination unit, 73... Lead defect determination unit, 74.
... Mark defective leg, 75... Lead defective leg, 76... Surface mold defect determination section, 77-81.
...Driver, 1oo...Rubber plug stopper insertion mechanism,
110.110.120,120...Rail, 111
, ~. 121, ~... Profile, 112.122
... Timing belt, 113.123 ... Driven pulley, 114.124 ... Drive pulley. Applicant's Representative Patent Attorney Takehiko Suzue Figure 2 (C) (d) Figure 4 Figure 6 Figure 7 Figure 8 Figure 11 IJ415 Figure 16 Figure 17 #! Figure 20Figure 21

Claims (2)

[Claims] (1) It is characterized by comprising: a transport means for intermittently transporting electronic components; and an inspection means for inspecting the electronic components transported by the transport means after a predetermined period of time has elapsed since the transport means stopped. Electronic component inspection equipment. (2) The electronic component inspection apparatus according to claim 1, wherein the inspection means inspects lead defects, mark defects, or mold defects of electronic components.