JPS63134966A - Electronic parts inspection equipment - Google Patents

Abstract

PURPOSE:To execute an exact and uniform external appearance inspection by taking out a prescribed number each of plural electronic parts housed in a stick, feeding them out to an inspecting part, and dividing them into a non- defective and a defective. CONSTITUTION:A stick 2 in which an IC is housed in carried from a housing part 11 by a scrape-up conveyor 12 and a horizontal conveyor 14, and held in a loader part 15. Subsequently, one end is raised by a cylinder (not shown in the figure), and the IC contained therein is led to a carrying path 17 through a shooter 16. As for the IC carried by the carrying path 17, a mold state of the reverse side and a state of a lead part are brought to an image pickup by inspecting parts 21, 22 and a state of a mark surface is brought to an image pickup by inspecting parts 26-29. This image pickup signal is sent to failure deciding parts 72-76 and an external appearance failure is discriminated. A non-defective is distributed to a carrying path 31, and housed in the stick 2 through a non-defective stacker 36. Also, a defective is distributed to a carrying path 32.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention determines defects in, for example, leads, molds, marks, etc. of a DIP type IC, automatically sorts them into good products and defective products, and The present invention relates to an electronic component inspection device such as a high-speed IC visual inspection device that is then automatically stored in a stick.

(Prior art) Conventionally, DIP (dual 1n-1ine packer)
Qe) type IC, for example 16. Bin DIR, or 4
The IC visual inspection process, in which defects in the leads, molds, marks, etc. of the two DIR bins are determined, and the products are separated into good and defective products, and then stored in the stick, is performed by human vision.

The above DIP type IC is, for example, 0.1 inch (2,54
mm) spacing, and the bin arrangement is standard packaging for ICs on both sides.

However, in this type of device, since the inspection was performed using human vision, there was a problem that the inspection results varied and accurate inspection could not be performed.

(Problems to be Solved by the Invention) As mentioned above, this invention eliminates the drawback that there is variation in test results and accurate testing cannot be performed.
An object of the present invention is to provide an electronic component inspection device that can perform accurate and uniform appearance inspection.

[Structure 1 of the Invention (Means for Solving the Problems) The electronic component inspection apparatus of the present invention includes a take-out means for taking out a plurality of electronic parts contained in a stick in predetermined numbers, and an electronic component taken out by the take-out means. inspection means for inspecting;
A sorting means for sorting electronic components into good and defective products based on the inspection results of the inspection means, a conveyance means for conveying the empty sticks from which the electronic components have been taken out by the above-mentioned extraction means, and empty sticks conveyed by the conveyance means. The storage device is comprised of storage means for storing good quality electronic components sorted by the sorting means.

(Function) This invention takes out a plurality of electronic components contained in a stick with a taking out means, inspects the taken out electronic parts,
Based on the inspection results, the electronic components are sorted into good and defective by the sorting means, and the good electronic parts sorted by the sorting means are stored in the empty stick from which the electronic components have been taken out by the taking out means. It is something.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A high-speed IC visual inspection apparatus as an electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 1 to 3. That is, reference numeral 11 denotes a housing section in which the sticks 2 containing a plurality of ICIs to be tested (tested) are stored. This storage section 11 has a capacity that can accommodate 400 sticks 2. As the IC1, a DIP type IC with 16 to 42 bins is handled.

If there are 16 ICIs in the stick 2, there are 25
It is designed to be stored individually.

In the case of the above ICIG; t, 16-bin DIP type IC, as shown in Figures (a) to (d), it is composed of a lead part 1a consisting of eight lead wires on each side and a mold part 1b, The mold part 1b is the surface, that is, the mark surface 1
G, and a back surface 1d.

The stick 2 is usually plugged at both ends to prevent the ICI inside from spilling out when it is tilted, but when it is stored in the storage section 11, it is placed on the inspection section side, that is, on the third side.
In the figure, the plug on the right side is not closed. The sticks 2 in the storage section 11 are lifted up one by one by a stick lifting conveyor (alignment means) 12. The above scraping conveyor 1
2 is provided with stick holding bars 13 at regular intervals. The spacing and height of the bars 13 are such that when the scraping stick 2 is in the desired direction, the center of gravity allows the scraping stick to ride on the bar 13 and scrape up, and when the scraping stick 2 is in a direction other than the desired direction, it does not ride on the bar 13. The dimensions are adjusted so that it will fall even if you ride on it. The desirable direction of the stick 2 is that when the stick 2 is located at the upper end of the scraping conveyor 12, the IC1 in the stick 2 is facing upward, that is, the ICI
The lead part 1a of the mold part 1b is directed upward, and the mark surface 1C of the mold part 1b is directed downward.

The sticks 2 riding on the bar 13 and being scraped up by the scraping conveyor 12 are rotated 90 degrees at the upper end of the scraping conveyor 12 and transferred to the stick horizontal feeding conveyor (supplying means, conveying means) 14. At this time, as described above, only the sticks 2 whose direction has been selected by the bar 13 reach the upper end, so all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state.

The stick 2 conveyed by the horizontal stick conveyor 14 is held by a loader section (take-out means) 15,
The left side is lifted by a cylinder (not shown), and the ICIs inside are brought out through the opening on the right side. The ICs 1, . . . taken out are guided to a horizontal transport path 17 via a shooter 16. A stopper (not shown) is provided in the chute 16 to temporarily stop the ICs being cleaned, and the ICs 1 are sent one by one to the horizontal transport path 17 in synchronization with the timing of horizontal transport. .

The stick 2 from which the IC1, . Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any IC 1 remaining in the transported stick 2. If the result of this detection is that there is no residual IC, the IC 1 is transported to the rear good IC storage section 19. If there is any remaining IC, it is accommodated in the upper IC remaining storage section 20. A detailed explanation of the IC residual detecting section 18 and the IC residual accommodating section 20 is described in Japanese Patent Application No. 60-214501, and will therefore be omitted here.

The horizontal conveyance path 17 includes a rail that directs the ICI and an IC.
The IC 1 supplied from the chute 16 is moved to the lead portion 1a as shown in FIG. 4(a). The robot rides on the rail with the mark surface 1C facing up and is pushed by the profile to move forward. The profiles (not shown) are arranged at regular intervals, and their drive systems are controlled to operate intermittently. That is, IC1 sent from the shooter 16
is placed on the rail when the profile stops, and is pushed forward as the profile moves, but since there is also a profile in front, it exists somewhere between the two profiles, and along with these profiles, it moves intermittently. It is designed to move forward while doing so.

The IC 1 transported on the horizontal transport path 17 includes a first inspection section 21 which is disposed opposite to each other with the horizontal transport path 17 interposed therebetween;
The second inspection/inspection section 22 checks the mold condition of the back surface 1d of the ICI, the condition of the lead section 1a, etc., and the image signal is sent to the back side mold defect determination section 72 and lead defect determination section 73, which will be described later. It is now output.

The first inspection section 21 uses specular reflection, as shown in FIG.
As shown in FIG. 5, this is an inspection section for inspecting (imaging) the back surface 1d and lead portion 1a of the IC 1, and as shown in FIG. 5, an illumination section 411. IC
A mirror 42 that guides the reflected light from the IC 1 to a subsequent stage, and a mirror 42 that guides the reflected light from the IC 1 to a subsequent stage.
The mirror drive unit 43 includes a mirror driving unit 43 that rotates the mirror 42, and an imaging unit 44 that is constituted by a COD camera that converts signals for each scanning line derived from the mirror 42 into electrical signals.

Further, the second inspection section 22 has the same configuration as the first inspection section 21, and is configured as shown in FIG. 6. The imaging section 44 of the first inspection section 21 and the second inspection section 22 has an effective field of view equal to or longer than the fixed interval between the profiles, and the center of the field of view is the center point of the two profiles when stopped. is almost equal to Thereby, when the profiles are stopped, it is possible to capture the IC 1 located at any position between the two profiles within its field of view and capture an image of its back surface.

As shown in FIG. 7, the first inspection section 21 outputs an imaging signal for determining mold defects and lead wire defects on the right half of the back surface 1d of the IC 1 from the center line in the transport direction, The second inspection section 22 outputs an imaging signal for determining mold defects and lead wire defects in the left half of the back surface 1d of the IC 1 from the center line.

As a result, although the first and second inspection sections 21 and 22 have the same configuration, they each target different halves of the back surface 1d of the ICI to be inspected, that is, to carry an image. The relationship between the incident light and the reflected light to the imaging unit 44 is reversed.

That is, in FIG. 3, in the first inspection section 21, the illumination section 41 is located in front of the horizontal conveyance path 17;
In the second inspection section 22, the illumination section 41
The @image section 44 of the second inspection section 22 is located at the back of the
In order to capture the reflected light directed toward this side from the horizontal conveyance path 17,
It overhangs the horizontal conveyance path 17.

In addition, in the first inspection section 21, the illumination section 41 is positioned at a position where the incident light from the illumination section 41 and the reflected light to the imaging section 44 are incident and reflected at approximately the same angle with respect to the normal plane of the back surface 1d of the Iol. , an imaging section 44 is arranged. Therefore, since the imaging section 44 is not on the normal plane to the back surface 1d of the ICI and forms a certain angle with this, the mold surface on the back surface 1d is viewed obliquely, and the leads on the imaging section 44 side The image overlaps the mold image on the same side, making it impossible to detect defects on the mold. Therefore, the back surface 1d of IC1
Since it is difficult to detect a signal for mold defect determination on the R image section 44 side from the center line of The half on the lighting section 41 side from the center line (
This is done only for the right half of Fig. 7).

Further, in the first inspection section 21, the IC1 on the illumination section 41 side
The lead portion 1a is designed to block light reflected from the rail on the illumination portion 41 side to the imaging portion 44, and the lead portion 1a of the illumination portion 4
By giving the rail surface on the first side a property (white) that reflects light well, it is possible to image the shadow of the lead section 1a on the illumination section 41 side.

In addition, imaging of the half on the imaging section 44 side (the left half in FIG. 7) from the mold center line, which cannot be imaged by the first inspection section 21, and 1l for the shadow of the lead section 1a on the imaging section 44 side.
The ii image is performed in the second inspection section 22.

Further, the distance between the centers of the fields of view of the first inspection section 21 and the second inspection section 22 is an integral multiple of the distance between the profiles.

As a result, when the intermittent moving profile stops, the ICI exists both within the field of view of the first inspection section 21 and within the field of view of the second inspection section 22, and images can be taken simultaneously.

A rotation reversing section 23 is provided at the end of the upper sea horizontal conveyance path 17. This rotation reversing section 23 is connected to the horizontal conveyance path 1
The mounted ICI is sent to the horizontal conveyance path 24 or the defective IC storage box 25 according to the determination results of a back mold defect determination section 72 and a lead defect determination section 73, which will be described later. In other words, the ICI is a good product whose back mold condition and lead part condition are determined to be normal.
When the IC rotates 180 degrees, it is sent to the opposite horizontal conveyance path 24, and the defective IC whose condition is determined to be abnormal.
When I further rotates 90 degrees (270 degrees), the defective IC storage box 2 passes through an opposing ejection chute (not shown).
It is designed to be discharged at 5. As a result, the IC1 determined to be a defective product by the imaging by the first and second inspection sections 21 and 22 is eliminated, and the good ICI is turned upside down, that is, the lead part 1a faces downward and the mark surface 1C faces upward. The paper is turned upside down and sent to the horizontal transport path 24.

The IC 1 is sent out (discharged) by the rotary conveyance path 23 using high-pressure air.

The horizontal conveyance path 24 is similar to the horizontal conveyance path 17,
It is composed of a rail that directs IC1, a profile (push claw) that moves IC1, and a drive system for the profile, and the ICI supplied from the rotation reversing unit 23 is placed with the lead part 1a facing down and the mark surface 1C facing up. It is designed to move forward by riding on the rail and being pushed by the profile. The profiles (not shown) are arranged at regular intervals, and their drive systems are controlled to operate intermittently. That is, the rotation reversing section 23
IC1 sent from, when the profile is stopped,
It is placed on a rail and is pushed forward as the profile moves, but since there is also a profile in front of it, it exists somewhere between the two profiles, and moves forward while moving intermittently with these profiles. It has become.

The IC 1 transported on the horizontal transport path 24 includes a third inspection section 26 which is disposed opposite to each other with the horizontal transport path 24 interposed therebetween;
The fourth inspection section 27, the fifth inspection section 28, and the sixth inspection section 29 check the mark state of the mark surface 1C of the ICI, the lead section 1
The state of a, the mold state of the mark surface 1C, etc. are imaged, and the l1ii image signal is output to a mark defect determination section 74, a lead defect determination section 75, and a front mold defect determination section 76, which will be described later. It has become. Said third, fourth, fifth, and sixth inspection sections 26.27.28.2
Each interval between 9 is an integer multiple between profiles.

The third inspection section 26 uses diffuse reflection, as shown in FIG. 4(b).
As shown in FIG. 8, this is an inspection section for inspecting (imaging) the mark surface 1C of the ICI, and as shown in FIG. 8, an illumination section 51. ND filter 56
, reflects the light from the illumination section 51 and guides it to the IC 1;
A mirror 53 that guides the reflected light from the mirror 52.1C1 for preventing shading to a subsequent stage, and a mark surface 1C of the above-mentioned ICI.
In order to deal with the reflected light on the entire surface of the
3, and the mirror 53
The image pickup section 55 is composed of a COD camera that converts the signal for each scanning line derived from the image sensor into an electrical signal. The third inspection section 26 is configured to output an imaging signal for the entire mark surface, that is, the front surface 1 of the IC 1, to a mark defect determination section 74, which will be described later.

The fourth inspection section 27 can selectively use specular reflection or diffuse reflection, and as shown in FIG. 4(C),
This is an inspection section that performs an inspection (<m image) on the lead portion 1a of the IC 1, and as shown in FIG. A mirror 64 for preventing shading that reflects the light and guides it to the ICI, a mirror 65 that guides the reflected light from the IC1 to a subsequent stage, and a mirror drive unit that rotates the mirror 65 in order to respond to the reflected light from the entire surface of the IC1. 66, and an imaging section 67 constituted by a COD camera that converts the signal for each scanning line guided from the mirror 65 into an electrical signal. In this case, whether the fourth inspection section 27 is used for specular reflection or diffuse reflection depends on the mirror 65, mirror drive section 66, and image carrier 6.
7 and the illumination parts 62 and 61 that are illuminated.If the lead part 1a of IC1 is tin-plated, diffuse reflection is used, and if it is soldered, specular reflection is used. It has become.

The fourth inspection section 27 is configured to output an image signal for the lead section 1a of the IC 1 to a lead defect determination section 75, which will be described later.

Furthermore, the fifth inspection section 28 also has the same configuration as the fourth inspection section 27, as shown in FIG. The fifth inspection section 28 is configured to output an imaging signal for the lead section 1a of the IC 1 (on the opposite side to the fourth inspection section 27) to a lead defect determination section 75, which will be described later.

The sixth inspection section 26 uses specular reflection, as shown in FIG. 4(d).
As shown in the figure, the mark surface 1c of IC1 is inspected (!
This is an inspection section that performs ffi@), and as shown in FIG. 11, it has the same configuration as the first inspection section 21 described above.

This sixth inspection section 29 inspects the mark surface, that is, the surface 1 of the ICI.
An imaging signal for the entire surface of 1 is output to a surface mold defect determination section 76, which will be described later.

At the terminal end of the horizontal conveyance path 24, a branching section (distributing means) is provided.
30 are provided. This branching section 3° is connected to determining sections 74 and 75, which will be described later, regarding the ICI supplied from the horizontal conveyance path 24.
．． Depending on the judgment result of 76, that is, whether it is a good product or a defective product,
Either sort it to the good product conveyance path 31 or send it to the defective product conveyance path 3.
This is what separates the pregnancy into two.

The ICI supplied to the defective product transport path 32 corresponds to the type of defect by moving the shuttle 33 provided at the end of the defective product transport path 32 in accordance with the type (item) of the defect. 19 defective sticks 34...
・It is designed to be selectively stored in. Which stick of these defective sticks 34, . In this case, the number of sticks for one specific defect is up to five, and the number of types of defects is up to nine.

Furthermore, the ICs 1 supplied to the non-defective transport path 31 are accommodated in a non-defective stacker (recovery means) 36 provided at the II end of the non-defective transport path 31. When the ICs 1 accommodated in the non-defective stacker 36 become full, the ICs in the non-defective stacker 36 are
1 is pushed out to the good IC storage section 19 and stored in the corresponding empty stick 2 at this time.

The stick 2 containing the good ICI is further sent to a subsequent stage by a stick horizontal feed conveyor 14, and a rubber stopper to prevent the IC1 from falling is inserted by a rubber stopper insertion mechanism (sealing means) 100. , and are discharged into the good stick storage box 37.

IC1 in the above-mentioned good product conveyance path 31 and defective product conveyance path 32
The conveyance is carried out by high pressure air, and the
- Since the details are described in No. 190114,
The explanation thereof will be omitted here.

Also, regarding the rubber plug stopper insertion mechanism 100,
Since the details are described in Japanese Patent Application No. 61-231709, the explanation thereof will be omitted here.

The operating section 35 is housed in a drawer section 38 shown in FIG.

Further, a CRT display 39 is provided in each of the above sections, particularly above the inspection section. This CRT display 39
are detectors 40 installed at main positions on the conveyance path,...
・It is designed to display the location of conveyance abnormality corresponding to the detection signal from, the number of non-defective products, the number of various types of defective products, and the branching details of the defective product stick.

Next, the control circuit will be explained using FIG. 12. That is, a control section 71 that controls the whole, a back mold defect determination section 72 that determines mold defects on the back surface 1d of the IC 1 based on outputs from the first and second inspection sections 21 and 22, and the first and second inspection sections 21 and 22. The outputs from parts 21 and 22 cause IC1
a lead defect determination section 73 that determines a lead defect in the lead portion 1a; a mark defect determination section 74 that determines a mark defect on the tCl mark surface 1C based on the output from the third inspection section 26; and the fourth and fifth inspections. A lead defect determination section 75 that determines a lead defect in the lead portion 1a of the ICI based on the outputs from sections 27 and 28, and a surface mold defect determination section that determines a mold defect on the mark surface 1C of the IC 1 based on the output from the sixth inspection section 29. part 76, a driver 7 that drives each of the above parts;
7, to 81.

The back side mold defect determination 1!172 extracts only the carrier image signal of the mold part, that is, the back side 1d, based on the imaging signal from the M1 and second inspection section 2L22, and determines whether there is black information or not. This is used to determine mold defects. This mold defect refers to FIGS. 13(a) to (e).
), pinholes, unfilled parts, chips, cracks, N, etc.

The lead defect determination section 73 includes the first and second inspection sections 2
Only the lead portion 1a is taken out based on the imaging signal from 1.22, and a lead defect in the lead portion 1a of the IC 1 is determined based on the length of black information and the number of black blocks. This lead defect is as shown in FIGS. 14(a) to (d).
The lead is bent, the lead is bent, the dam cut is eccentric, and the lead is bent inside and out. The above-mentioned defective direction of the lead part 1a inward and outward direction can be solved by using the fact that the length of the shadow of the lead part 1a is proportional to the inward or outward bending angle of the lead part 1a.
The determination is made by measuring the length of the shadow of a.

The mark defect determination section 74 extracts an image signal of only the mark surface 1c from the image signal from the third inspection section 26, and compares it with a pre-registered reference pattern (pattern recognition) to detect the mark of C1. This is for determining mark defects on the surface 1C. This mark defect is the 15th
No marks, reverse marks, and errors as shown in Figures (a) to (i).

Characters, misalignment, slanting, blurring, blurring, chips, scratches, etc.

The lead defect determination section 75 includes the fourth and fifth inspection sections 2
Only the lead portion is taken out by the 111m signal from 7.28, and a lead defect in the lead portion 1a of the IC 1 is determined based on the length of black information and the number of black blocks. These lead defects include poor tint and solder defects as shown in FIGS. 16(a), (b)<c).

The surface mold defect determination section 91 includes the sixth inspection section 2
The mold part, that is, the mark surface 1C by the @ image signal from 9.
The IC extracts only the suspended image signal and determines whether there is black information or not.
This is to determine whether there is a mold defect on the mark surface 1C of No. 1. The mold defects include pinholes, unfilling, chips, cracks, and scratches as shown in FIGS. 13(a) to 13(e).

It should be noted that the mark defect determination section 74 determines that the I is a good product.
C1 is as shown in FIG.

The control section 71 determines whether the corresponding ICI is a good product or a defective product due to which defect, according to the determination results of each of the determination sections.

Further, the control section 71 counts the number of non-defective products and the number of defective products for each item, and stores the counting results in an internal memory (not shown).

The contents of the count are displayed on the three CRT displays or printed out using a printer (not shown).

Further, the criteria for each of the above-mentioned determination units are stored in advance in a ROM or floppy disk (not shown). For example, when determining the length of the lead portion 1a of the IC 1, the above-mentioned criteria are such that, when determining the length of the lead portion 1a of the IC 1, whether or not the length is shorter than a predetermined length is determined to be within the standard if it is within 1 mm, or within the standard if it is within 0.5. The criteria for each of the above judgment sections are:
It can be changed in advance by the user. This change method involves rewriting the contents of a floppy disk (not shown) in which the above change criteria is stored.

Next, the operation in such a configuration will be explained.

For example, when the power (not shown) is turned on, the operation section 35
Accordingly, the classification of defective products to the defective sticks 34, . . . is set in advance. Then, the rubber stopper on the right side is removed, and the sticks 2, . . . containing the ICIs to be inspected, . Then, the sticks 2 in the storage section 11 are scraped up one by one by the bar 13 of the stick scraping conveyor 12. At this time, due to the center of gravity of the stick 2, the stick 2 is raked upward only when it is in a desired direction, and is otherwise dropped into the storage section 11.

Next, the sticks 2 that ride on the bar 13 and are scraped up by the scraping conveyor 12 are transferred to the scraping conveyor 12.
The stick is rotated 90 degrees at the upper end and transferred to the stick horizontal feed conveyor 14. At this time, as mentioned above, the bar 13
Since only the stick 2 whose direction has been selected reaches the upper end, all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state as shown in FIG. 4(a).

The stick 2 conveyed by the stick horizontal feed conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), and the ICIs, . It is guided to the horizontal conveyance path 17 via.

The ICI supplied to this horizontal transport path 17 is transported 1 g at a time.

The stick 2 from which the IC1, . Here, when the stick 2 is released from being held by the O-da part 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and the rear IC 9
It is transported to the 5-stop detection section 18.

This IC residual detection section 18 detects whether or not there is any IC 1 remaining in the stick 2 that has been transported. As a result of this detection, if there is no residue, the stick 2 is further conveyed to the rear non-defective IC storage section 19 by the horizontal stick conveyor 14, and if there is any residue, the stick 2 is
is stored in the upper IC residual storage section 20.

Ic1 transported on the horizontal transport path 17 is the first
The inspection section 21 and the second inspection section 22 take images of the mold condition of the back surface 1d, the condition of the lead section 1a, etc.
i! The signals are supplied to a back mold defect determining section 72 and a lead defect determining section 73, respectively. As a result, the back mold defect determination section 72 detects the first and second inspection sections 21.2.
Based on the VA image signal from 2, only the image carrier signal of the mold part, that is, the back surface 1d, is extracted, and depending on whether there is black information, IC1
Holes (pinholes), unfilled, chipped,
It determines mold defects such as cracks and cracks, and outputs the determination results to the control section 71.

Further, the lead defect determination section 73 extracts only the lead portion 1a based on the carrier signal from the first and second inspection sections 21. Lead defects such as lead bending, lead breakage, dam cut eccentricity, and lead internal/external bending are determined, and the determination results are output to the control section 71.

Therefore, the control section 71 controls the back mold defect determination section 72.
Based on the determination result from the lead defect determination section 73, it is determined whether the corresponding ICI can be sent to the subsequent inspection section. As a result, if the control section 71 determines that the control section 71 can send it to the subsequent inspection section, that is, there is no mold defect on the back surface 1d and no bending of the lead section 1a, the corresponding IC 1 is sent to the rotation reversing section 23.
When it is rotated by 180 degrees, it is delivered to the horizontal conveyance path 24.

In addition, if the control unit 71 determines that it cannot be sent to the subsequent inspection unit, that is, that there is a mold defect on the back surface 1d and a bend in the lead part 1a, it takes appropriate action (C1 is
When the paper is rotated 70 degrees, it is discharged to the defective IC storage box 25.

Further, the state of the mark on the front surface 1C of the ICI transported through the horizontal transport path 24 is imaged by the third inspection section 26, and the imaged signal is supplied to the mark defect determination section 74, and the fourth inspection section 27
, the condition of the lead part 1a is imaged by the fifth inspection section 28, and the image signals are respectively supplied to the lead defect determination section 75, and the mold condition of the surface 1C is imaged by the two sixth inspection sections, and its R(! !The double signal is supplied to the surface mold defect determination section 76.

As a result, the mark defect determination section 74 extracts only the decoy image signal of the mark surface, that is, the surface 1C, based on the surface image signal from the third inspection section 6, and compares it with the reference pattern recorded in advance (pattern recognition). ), it is determined whether there is a mark defect on the JCl mark surface 1C, and this 11-determined result is output to the control section 71.

Further, the lead defect determination unit 75 extracts only the lead portion 1a based on the head image signals from the fourth and fifth inspection portions 27 and 28, and determines the lead portion 1a of the ICI based on the length of the black information and the number of black blocks. It determines lead defects such as poor tintness or poor soldering, and transmits this determination result to the control unit 71.
Output to.

In addition, the surface mold defect determination section 76 extracts only the carrier image signal of the mold section, that is, the surface 1C, based on the signal from the sixth inspection section 29, and determines whether or not there is black information on the IC1.
Holes (pinholes), unfilled, chipped,
The crank and mold defects such as scratches are determined, and the determination results are output to the ill 10 section 71.

Therefore, the control section 71 includes a mark defect determination section 74, a lead defect determination section 75, and a surface mold defect determination section 76.
Based on the determination result from , it is determined whether the corresponding IC1 is a good product or a defective product. As a result, the control unit 71 detects a non-defective product, that is, a mark defect on the surface 1C, a mold defect, and a lead portion 1a.
If it is determined that there is no cracking or soldering defect, the corresponding IC 1 is transferred to the good product conveyance path 31 at the branching section 30.
Separate.

In addition, when the control unit 71 determines that there is a defective product, that is, a mark defect on the surface 1C, a mold defect, and a lead portion 1a that has a cracked or soldered defect, the corresponding IC
1 is distributed to a defective product conveyance path 31 at a branching section 30.

The ICs 1 transported through the non-defective transport path 31 are sequentially stored in the non-defective stacker 36 . When the detector 40 for detecting fullness of the good product stacker 36 detects the full state, the stopper 101 in front of the detector 40 stops the ICI conveyed through the good product conveyance path 31, and the non-defective product stacker 36 is moved by a push-out mechanism (not shown). The IC 1 inside is pushed out to the good IC storage section 19 and stored in the empty stick 2 corresponding to this one. The stick 2 containing this good IC1 is
Further, the stick is sent to a later stage on the horizontal stick conveyor 14, and after a rubber stopper for preventing the IC 1 from falling is inserted in the rubber stopper insertion structure 100, it is discharged into the good stick storage box 37.

Furthermore, the IC 1 transported through the non-defective transport path 31 is transported by the shuttle 33 provided at the end of the defective transport path 32, which moves in accordance with the type (item) of the defect.
19 defect sticks 34 corresponding to the type of defect;
... are stored in one of eight options.

As mentioned above, multiple ICs contained in a stick are taken out by the loader section, and the taken out ICs are inspected for mold defects, mark defects, lead defects, etc., and based on the inspection results, the ICs are classified as good or defective. Good ICs picked up by the branching section are stored in empty sticks from which the ICs are sorted by the branching section and taken out by the loader section. That is, the IC is designed to determine whether the leads, mold, and marks of the IC are defective, automatically select good products from defective products, and automatically store them in the stick. As a result, accurate and uniform inspections can be performed automatically, and all appearance inspections can be performed quickly and fully automatically, making it possible to rationalize the inspection process.

In addition, the lead may be bent, broken, chipped, or damaged.
It is possible to detect cavities, chips, cracks on molds, fades, chips, blurring, typographical errors, etc. on marks, and store them in different sticks for each defective item.In addition, the criteria for determining good and defective products can be detected. can be set arbitrarily by the user.

Furthermore, just by placing the stick containing the IC to be tested into the storage section, the stick and IC will be automatically supplied, and the IC after being inspected will be stored in the empty stick.
After that, a rubber plug stopper is inserted into the stick, allowing for fully automatic operation, that is, continuous unattended operation, resulting in significant labor savings.

In addition, all inspections for mold defects, mark defects, and lead defects necessary for the external appearance inspection of ICs can be performed with one device.

[Advantageous Effects of the Invention 1] As described in detail above, according to the present invention, it is possible to provide an electronic component inspection apparatus that can perform accurate and uniform appearance inspection.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention; FIG. 1 is a diagram for schematically explaining the overall configuration, FIG. 2 is an external view of FIG. 1, and FIG. 3 is an explanation of the internal configuration. FIG. 4 is a diagram for explaining the configuration of the IC, FIG. 5 is a diagram schematically showing the configuration of the first inspection section, and FIG. 6 is a diagram schematically showing the configuration of the second inspection section. The diagram shown in FIG. 7 shows the first and second
A diagram for explaining the image carrying range of the inspection section, FIG. 8 is a diagram schematically showing the configuration of the third inspection section, FIG. 9 is a diagram schematically showing the configuration of the fourth inspection section, and FIG. 10 11 is a diagram schematically showing the configuration of the fifth inspection section, FIG. 11 is a diagram schematically showing the configuration of the sixth inspection section, and FIG. 12 is a block diagram showing the main parts of the control circuit.
Figure 13 is a diagram for explaining mold defects, Figures 14 and 16 are diagrams for explaining lead defects, Figure 15 is a diagram for explaining mark defects, and Figure 17 is a diagram for explaining normal marks. It is a figure which shows the example of IC in such a case. 1...IC (electronic component), 1a...Lead part, 1b
...Mold part, 1C...Mark surface (front surface), 1d
...back side, 2...stick, 11...accommodation section,
12...stick scraping conveyor (alignment means),
13... Bar, 14... Stick horizontal feed conveyor (supply means, conveyance means), 15... Loader section (takeout means), 16... Shooter, 17. 24... Horizontal conveyance path, 21 ...first inspection section, 22...second inspection section,
23... Rotation reversal section, 26... Third inspection section, 27.
... Fourth inspection section, 28... Fifth inspection section, 29... Sixth inspection section, 30... Branching section (distribution means), 31...
Good product conveyance path, 32... Defective product conveyance path, 33... Shuttle, 34-... Defective product stick, 36... Good product stacker (recovery means), 71... Control unit, 72...
Back side mold failure determination unit, 73... Lead failure determination unit, 74... Mark failure determination unit, 75... Lead failure determination unit, 76... Front side mold failure determination unit, 77-8
1...driver, 100...rubber plug stopper insertion trowel structure (sealing means). Applicant's Representative Patent Attorney Takehiko Suzue Figure 2 (b) AI' (C) (d) M4 Figure 6 Figure 7 Figure 8 Figure 11 (Figure 3 Figure 14 (0) J] Marg・僻・し′ (b) 组YO!寫行wa=]・Ki mark (f)) completed M
+zl;・b jl16 Figure (9
) Xi; Lottery Figure 15 Procedural Amendments Showa Whip 2.1-60 Director General of the Patent Office Kunio Ogawa 1, Indication of Case Patent Application No. 1982-282474 2, Title of Invention Electronic Component Inspection Device 3, Amendment Patent applicant (307) Toshiba Corporation 4, agent UBE Building 7, 3-7-2 Kasumigaseki, Chiyoda-ku, Tokyo;
Contents of amendment (1) The scope of claims is corrected as shown in the attached sheet. (2) On page 4, line 11 of the specification, the word "stick" is corrected to "stick." (3) From page 6, line 15 to line 16 of the specification, the phrase "16 pins to 42 pins" is corrected to "14 pins to 28 pins." (4) In the specification, on page 7, line 1, on page 12, line 9, and on page n12, the words "lead line" are corrected to "lead." (5) Page 10, line 1, and page 16, line 3 of the specification.
In the first line, the word "instruction" should be corrected to "support." (6) From line 3 to line 6 of page 24 of the specification, it is stated that ``These lead defects include lead cracks, lead breaks, dam cuts, etc. as shown in Figures 14 (a) to (d). The statement "The lead is eccentric and the lead is bent inside and out." is corrected to "The second lead failure is the lead is bent inside and out as shown in FIG. 14(d)." (7) From line 4 to line 6 on page 25 of the specification, it is stated that ``This lead failure means
) As shown in Fig. 2, there is good soldering and poor soldering. "This lead defect is as shown in Figure 14 (a).
) to (c) show lead distortion, lead bending, and dam cut eccentricity, and as shown in FIGS. 16(a) to (c), there is poor tinting and poor soldering. ” he corrected. (8) From the 15th line to the 17th line on page 29 of the specification, it is stated that ``the lead portion for the lead portion 1a of the IC1,
Determine lead defects such as lead breakage, dam cut eccentricity, lead bending inside and outside, etc."
This is corrected as follows. (9) From the 12th line to the 14th line on page 31 of the specification, determine whether the lead portion 1a of the 1-ICI is defective or has a poor lead such as poor soldering.'' Lead portion relative to lead portion 1a;
It is corrected to determine if there is a broken lead, eccentric dam cut, poor tinting, or poor soldering. (10) Figure 4 of the drawings will be corrected as shown in the attached sheet. 2. Claims (1) Removal means for taking out a predetermined number of electronic components from a stick, inspection means for inspecting the electronic components taken out by this extraction means, and inspection results of this inspection means a sorting means for sorting electronic components into good and defective products; a conveying means for conveying the empty sticks from which the electronic components have been taken out by the taking-out means; and a sorting means for the empty sticks conveyed by the conveying means. An electronic component inspection device comprising: storage means for storing good electronic components sorted by; (2) The electronic component inspection apparatus according to claim 1, wherein the inspection means is for inspecting external defects of the electronic component. (3) The electronic component inspection apparatus according to claim 2, wherein the inspection means inspects mold defects, mark defects, lead defects, etc. of electronic components. (4) The electronic component inspection device according to claim 1, wherein the electronic component is a package containing an IC. (5) an alignment means for arranging the sticks containing a plurality of electronic components; a supply means for supplying the sticks from the alignment means; and a supply means for arranging the plurality of electronic components contained in the sticks supplied by the supply means. An extraction means for taking out the electronic components one by one; an inspection means for inspecting the electronic components taken out by the extraction means; a sorting means for sorting the electronic components into non-defective products and defective products based on the inspection results of the inspection means; a collection means for once collecting the good electronic components sorted by the means; a transport means for transporting the empty sticks from which electronic components have been taken out by the retrieval means; and a collection means for transporting the empty sticks transported by the transport means. An electronic component inspection system comprising: a storage means for storing recovered good electronic components; and a sealing means for sealing a stick in which the electronic components have been stored by the storage means to prevent falling. Device. (6) An electronic component inspection device according to claim 5, characterized in that the inspection means is an inspection device for inspecting defects in the external appearance of electronic components. (7) The electronic component inspection apparatus according to claim 6, wherein the inspection means inspects mold defects, mark defects, lead defects, etc. of electronic components. (8) The device according to claim 1, wherein the electronic component is a package containing an IC. Electronic component inspection equipment. .

Claims (8)

[Claims] (1) A take-out means for taking out a predetermined number of electronic components from a stick; an inspection means for inspecting the electronic components taken out by the take-out means; a conveying means for conveying the empty sticks from which the electronic components have been taken out by the above-mentioned taking-out means; and a conveying means for conveying the empty sticks from which the electronic components have been taken out by the above-mentioned taking-out means; An electronic component inspection device comprising: storage means for storing electronic components; (2) The electronic component inspection apparatus according to claim 1, wherein the inspection means is for inspecting external defects of the electronic component. (3) The electronic component inspection apparatus according to claim 2, wherein the inspection means inspects mold defects, mark defects, lead defects, etc. of electronic components. (4) The electronic component inspection device according to claim 1, wherein the electronic component is a case housing an IC. (5) Aligning means for arranging sticks containing a plurality of electronic components; supply means for supplying the sticks from the alignment means; and a plurality of electronic components contained in the sticks supplied by the supply means. an extraction means for taking out the components one by one; an inspection means for inspecting the electronic components taken out by the extraction means; a sorting means for sorting the electronic components into non-defective and defective products based on the inspection results of the inspection means; a collecting means for once collecting good electronic components sorted by the sorting means; a conveying means for conveying the empty sticks from which the electronic components have been taken out by the extracting means; and a collecting means for conveying the empty sticks transported by the conveying means. An electronic device characterized by comprising: a storage means for storing good electronic parts recovered by the storage means; and a sealing means for sealing a stick in which the electronic parts have been stored by the storage means to prevent it from falling. Parts inspection equipment. (6) The electronic component inspection apparatus according to claim 5, wherein the inspection means is for inspecting external appearance defects of the electronic component. (7) The electronic component inspection apparatus according to claim 6, wherein the inspection means inspects mold defects, mark defects, lead defects, etc. of electronic components. (8) The electronic component inspection device according to claim 1, wherein the electronic component is a case housing an IC.