JPS63141333A - Electronic part inspection device - Google Patents

Abstract

PURPOSE:To contain the distributed defective electronic parts separately corresponding to defective factors by a method wherein electronic parts are inspected as to existance of multiple defective factors to be distributed according to the results of inspection. CONSTITUTION:A control circuit is composed of a controller 71 controlling the whole system; a back surface defective mold detective part 72 detecting the defective mold on the back surface 1d of IC 1 by the output from the first and the second inspection parts 21, 22; a defective lead detective part 73 detecting the defective lead of lead part 1a of IC 1 by the output from the first and the second inspection parts 21, 22; a defective mark detective part 74 detecting the defective mark on marking surface 1c of IC 1 by the output from the third inspection part 26; another defective lead detecting part 75 detecting the defective lead of lead part 1a of IC 1 by the output from the fourth and the fifth inspection parts 27, 28; a defective surface mold detective part 76 detecting the defective mold on mark surface 1c by the output from the sixth inspection part 29. Furthermore, said controller 71 detects sticks 34 for defective parts corresponding to defective factors to contain the defective parts carried by a defective part carrier channel 32 in the sticks 34 for defective parts.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) This invention determines defects in, for example, leads, molds, marks, etc. of a DIP type IC, automatically sorts them into good products and defective products, and The present invention relates to an electronic component inspection device such as a high-speed IC visual inspection device that is then automatically stored in a stick.

(Prior art) Conventionally, DIP (dual 1n-1inepaCka
qe) type IC, for example, 16-bin OIP, or 42-bin OIP
The IC visual inspection process, in which defects in pin DIR leads, molds, marks, etc. are determined, and the ICs are classified into good and defective products, and then stored in a stick, is performed by human vision.

The above DIP type IC is, for example, 0.1 inch (2,54
mm) spacing, and the bin arrangement is standard packaging for ICs on both sides.

However, in this type of device, since the inspection was performed using human vision, there was a problem that the inspection results varied and accurate inspection could not be performed.

Therefore, it has been considered that the above-mentioned inspection can be carried out automatically by conveying the device on a conveyance path.

However, when the inspection is automatically performed as described above, the ICs are inspected for various factors (items) for defects, but they are all stored in one storage section. For this reason, there has been a demand for something that can be stored separately for each cause of failure.

(Problems to be Solved by the Invention) As mentioned above, one electronic component is
It is an object of the present invention to provide an electronic component inspection device which eliminates the disadvantage of storing electronic components in one place and which can store electronic components separately for each cause of failure.

[Structure of the Invention] (Means for Solving the Problems) The electronic component inspection apparatus of the present invention includes an inspection means for inspecting an electronic component for the presence or absence of a plurality of defective factors, and a branching method for dividing the electronic component based on the inspection results of the inspection means. The device is comprised of a branching means for distributing electronic components, and a storage means for storing defective electronic components separated by the branching means according to the cause of the defect.

(Operation) This invention inspects electronic components for the presence or absence of a plurality of defective factors, branches the electronic components based on the inspection results, and stores the branched defective electronic components separately for each defective factor. This is what I did.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A high-speed IC visual inspection apparatus as an electronic component inspection apparatus according to the present invention will be described with reference to FIGS. 1 to 3. That is, 11 is a housing part in which the stick 2 in which a plurality of ICs 1 to be tested (tested) is stored is stored. This storage section 11 has a capacity that can accommodate 400 sticks 2. The above-mentioned IC1 is classified as a DIP type IC with 16 to 42 bins.

If there are 16 IC1 bins in the stick 2, there are 25
It is designed to be stored individually.

In the case of a 16-bin DIP type IC, the IC 1 is composed of a lead part 1a, #, and a mold part 1b, each consisting of eight lead wires on the left and right sides, as shown in FIGS. 4(a) to (d). The mold part 1b is the surface, that is, the mark surface 1C1
and a back surface 1d.

The stick 2 is usually plugged at both ends to prevent the ICI inside from spilling out when it is tilted, but when it is stored in the storage section 11, it is placed on the inspection section side, that is, on the third side.
In the figure, the stopper on the 6th side is not closed. The sticks 2 in the storage section 11 are lifted up one by one by a stick lifting conveyor 12. The scraping conveyor 12 is provided with stick holding bars 13 at regular intervals.

The spacing and height of the bars 13 are determined by the center of gravity only when the raking stick 2 is in the desired direction.
The size is adjusted so that it rides on the bar 13 and is scraped up, and when it is in a direction other than the desired direction, it does not ride on the bar 13 or falls even if it rides on it.

The desirable direction of the stick 2 is that when the stick 2 is located at the upper end of the scraping conveyor 12, the IC inside the stick 2 is
1 is on its back, that is, the lead part 1a of IC1 is facing upward,
This is a state in which the mark surface 1C of the mold part 1b faces downward.

The sticks 2 riding on the bar 13 and being scraped up by the scraping conveyor 12 are rotated 90 degrees at the upper end of the scraping conveyor 12, and then the sticks 2 are rotated 90 degrees by the stick horizontal feeding conveyor 14.
Transfer to. At this time, as described above, only the sticks 2 whose direction has been selected by the bar 13 reach the upper end, so all the ICIs in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state.

The stick 2 conveyed by the horizontal stick conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), so that the ICs 1, . . . inside are taken out from the opening on the right side. ing. The ICs 1, . . . taken out are guided to a horizontal transport path 17 via a shooter 16. A stopper (not shown) is provided in the chute 16 to temporarily stop the ICs from sliding, and the ICs 1 are sent one by one to the horizontal transport path 17 in synchronization with the timing of horizontal transport.

The stick 2 from which the ICI, . Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any 101 remaining in the transported stick 2. If the result of this detection is that there is no residual, the IC is transported to the rear good IC storage section 19. If there is any remaining Ic, it is stored in the upper Ic residual storage section 20. A detailed explanation of the IC residual detecting section 18 and the IC residual accommodating section 20 is described in Japanese Patent Application No. 60-214501, and will therefore be omitted here.

As shown in FIGS. 18 and 19, the horizontal conveyance path 17 includes two rails 110 and 110 that support the IC1.
, by moving between these rails 110, 110 in a state protruding from the upper surface of the rail 110, the rail 11
Profile 111 as a push claw that presses IC1 on 0.110, ..., these profiles 111, ...
The timing belt 112 is connected to the timing belt 112, and a driven pulley 113 and a drive pulley 114, around which the timing belt 112 is stretched, rotates and moves the timing belt 112. The drive pulley 114 is rotated by a motor (not shown).

That is, as shown in FIG. 4(a), the IC 1 supplied from the shooter 16 rides on the rail 110, 110 with the lead portion 1a facing upward and the mark surface 1C downward, and is pushed by the profile 111. This allows it to move forward.

The profiles 111, . . . are lined up at regular intervals, and their drive systems are controlled to operate intermittently. That is, the ICI sent from the shooter 16 is transmitted to the rail 11 when the profiles 111, . . .
0.110, profile 111,...
is pushed forward with the movement of , but since there is also a profile 111 in front, there are two profiles 111.
The profile 111, .

The ICI transported on the horizontal transport path 17 includes a first inspection section 21 which is disposed opposite to each other with the horizontal transport path 17 interposed therebetween;
The second inspection section 22 determines the mold condition of the back surface 1d of the IC 1, the condition of the lead section 1a, etc., and the Ill image signal is output to the back side mold defect determination section 72 and lead defect determination section 73, which will be described later. It is supposed to be done.

The first inspection section 21 uses specular reflection, as shown in FIG. 4(a).
As shown in FIG. 5, this is an inspection section that performs an inspection (Ill) on the back surface 1d and lead portion 1a of the ICI, and as shown in FIG.
A mirror 42 that guides the reflected light from the ICI to a subsequent stage, and a mirror 42 that guides the reflected light from the ICI to a subsequent stage.
a mirror drive unit 43 that rotates the mirror, and a COD camera that converts the signal for each scanning line derived from the mirror 42 into an electrical signal.
It consists of

Further, the second inspection section 22 has the same configuration as the first inspection section 21, and is configured as shown in FIG. 6. The first inspection section 21 and the second inspection section 22 have an effective field of view equal to or longer than the fixed interval between the profiles 111, . . . It is approximately equal to the center point of the two profiles 111.111. As a result, profile 111,...
When stopped, the IC 1 located at any position between the two profiles 111, 111 can be captured within the field of view, and its back surface image can be visualized as an R image.

As shown in FIG. 7, the first inspection section 21 outputs an imaging signal for determining mold defects and lead wire defects on the right half of the back surface 1d of the IC 1 from the center line in the transport direction, The second inspection section 22 outputs an imaging signal for determining mold defects and lead wire defects in the left half of the back surface 1d of C1 from the center line.

As a result, the first and second inspection sections 21 and 22 have the same configuration, but inspect V! 1 @ Back side 1 of IC1
Each range of d targets separate halves,
The relationship between the incident light from the illumination section 41 and the reflected light to the 1119 section 44 is reversed.

That is, in FIG. 3, in the first inspection section 21, the illumination section 41 is located in front of the horizontal conveyance path 17;
In the second inspection section 22, the illumination section 41
The imaging section 44 of the second inspection section 22 is located at the back of the
In order to capture the reflected light directed toward this side from the horizontal conveyance path 17,
It overhangs the horizontal conveyance path 17.

In addition, in the first inspection section 21, the incident light from the illumination section 41 and the WA@ section 44 are
The illumination unit 41 is located at a position where the reflected light is incident and reflected at approximately the same angle. ! ! An image section 44 is arranged. Therefore, since the am part 44 is not on the normal plane to the back surface 1d of the ICI and forms a certain angle with this, the mold surface on the back surface 1d is viewed obliquely, and the leads on the imaging section 44 side The image overlaps the mold holder on the same side, making it impossible to detect defects on the mold. Therefore, it is difficult to detect a signal for mold defect determination from the center line of the back surface 1d of the IC 1 to the imaging section 44 side. The illumination section 4 determines mold defects from the center line of the mold.
This is done only for the first half (the right half in FIG. 7).

Further, in the first inspection section 21, the IC1 on the illumination section 41 side
The lead portion 1a is from the rail on the illumination portion 41 side! fi
It is designed to block the light reflected from the image section 44, and by making the rail surface on the illumination section 41 side reflect light well (white), it is possible to photograph the shadow of the lead section 1a on the illumination section 41 side. It looks like this.

In addition, the me of the half of the m1 section 44 side (the left half of FIG. 7) from the mold center line that cannot be imaged by the first inspection section 21 is
, and the shadow of the lead section 1a on the side of the imaging section 44 are carried out in the second inspection section 22.

Further, the distance between the centers of the visual fields of the first inspection section 21 and the second inspection section 22 is an integral multiple of the distance between the profiles 111, . . . . As a result, when the profiles 111, .
IC1 exists both in the field of view of the second inspection unit 22 and in the field of view of the second inspection unit 22, and it is possible to me simultaneously.

At the end of the horizontal conveyance path 17, a rotation reversal section 23 is provided. This rotation reversing section 23 is connected to the horizontal conveyance path 17
The purchased ICs 1 are sent to the horizontal transport path 24 or the defective IC storage box 25 according to the judgment results of a back mold defect judgment section 72 and a lead defect judgment section 73, which will be described later. In other words, when the back molded state and the lead part state are determined to be normal, the non-defective ICI is rotated 180 degrees and sent to the opposing horizontal conveyance path 24, and the defective ICI whose state is determined to be abnormal is rotated 180 degrees. Good quality IC
When 1 is further rotated 90 degrees (270 degrees), the defective IC storage box 2 is removed through an opposing ejection chute (not shown).
It is designed to be discharged at 5. As a result, the first
The IC1 determined to be a defective product by am of the second inspection section 21.22 is rejected, and the good ICI is turned upside down, that is, the lead part 1a faces downward, and the mark 1C faces upward. It is designed to be sent to a horizontal conveyance path 24.

The ICI is delivered (discharged) by the rotary conveyance path 23 using high-pressure air.

As shown in FIGS. 20 and 21, the horizontal conveyance path 24 includes two rails 120 and 120 that support the IC1.
1 By moving between these rails 120, 120 in a state protruding from the upper surface of the rail 120, the rail 12
Profile 121 as a push claw that presses IC1 on 0.120, ..., these profiles 121, ...
The timing belt 122 is connected to the timing belt 122, and a driven pulley 123 and a driving pulley 124 around which the timing belt 122 is wrapped around and rotates the timing belt 122. The driving pulley 124 is rotated by a motor (not shown).

That is, the IC1 supplied from the rotation reversing section 23 is
As shown in Figure (b), it rides on the rails 120, 120 with the lead portion 1a facing down and the mark surface 1C facing up, and is moved forward by being pushed by the profile 121.

The profiles 121, . . . are lined up at regular intervals, and their drive systems are controlled to operate intermittently. In other words, the ICI sent from the rotation reversing unit 23
is profile 1211. ? ... is placed on the rails 120, 120, and the profile 121,
. . is pushed forward, but since there is also a profile 121 in front, there are two profiles 121 .
121, and moves forward with these profiles 121, . . . while making intermittent movements.

The IC 1 transported on the horizontal transport path 24 includes a third inspection section 26 which is disposed opposite to each other with the horizontal transport path 24 interposed therebetween;
The fourth inspection section 27, the fifth inspection section 28, and the sixth inspection section 29 check the mark state of the mark surface 1C of the ICI, the lead section 1
The state of a and the mold state of mark surface 1C are ms
The image signal is outputted to a mark defect determination section 74, a lead defect determination section 75, and a surface mold defect determination section 76, which will be described later. 3rd above
, the intervals between the fourth, fifth, and sixth inspection sections 26, 27, 28, 29 are integral multiples of the profiles 121, . . . , respectively.

The third inspection section 26 uses diffuse reflection, as shown in FIG. 4(b).
As shown in the figure, the inspection (1
As shown in FIG. 8, the illumination section 51 is composed of a straight fluorescent lamp. ND filter 5
6. Reflecting the light from the illumination section 51 and guiding it to the IC1,
A mirror 52 for preventing shading, a mirror 53 that guides the reflected light from the IC1 to a subsequent stage, and a mark surface 1G of the above IC1.
In order to deal with the reflected light on the entire surface of the
3, and the mirror 53
It consists of an R image section 55 constituted by a COD camera that converts a signal for each scanning line derived from the image into an electrical signal. The third inspection section 26 is configured to output an image signal for the entire mark surface, that is, the front surface 1C of the IC 1, to a mark defect determination section 74, which will be described later.

The fourth inspection unit 27 can selectively use specular reflection or diffuse reflection, and as shown in the fourth factor (C),
This is an inspection section that inspects (images) the lead section 1a of the IC 1, and as shown in FIG. A shading prevention mirror 64 that reflects and guides the light to the ICI, a mirror 65 that guides the reflected light from the IC1 to a subsequent stage, and a mirror drive unit that rotates the mirror 65 in order to respond to the reflected light from the entire surface of the IC1. 66, and an imaging section 67 constituted by a COD camera that converts the signal for each scanning line guided from the mirror 65 into an electrical signal. In this case, whether the fourth inspection section 27 is used for specular reflection or diffuse reflection depends on the mirror 65, the mirror drive section 66, and the dancing image section 6.
7 and the illumination parts 62 and 61 that are illuminated.If the lead part 1a of IC1 is tin-plated, diffuse reflection is used, and if it is soldered, specular reflection is used. It has become.

The fourth inspection section 27 is configured to output an imaging signal for the lead section 1a of the ICI to a lead defect determination section 75, which will be described later.

Furthermore, the fifth inspection section 28 also has the same configuration as the fourth inspection section 27, as shown in FIG. The fifth inspection section 28 is configured to output an imaging signal for the lead section 1a of the ICI (on the opposite side to the fourth inspection section 27) to a lead defect determination section 75, which will be described later.

The sixth inspection section 26 is an inspection section that inspects (images) the mark surface 1C of the IC 1 using specular reflection, as shown in FIG. The configuration is similar to that of the first inspection section 21. This sixth inspection section 29 includes a surface mold defect determination section 76 which will be described later, which receives an image signal for the mark surface of the IC 1, that is, the entire surface 1C.
It is designed to output to .

A branch portion 30 is provided at the terminal end of the horizontal conveyance path 24 . This branching part 3o is connected to the non-defective transport path 3o depending on the judgment results of the judgment parts 74, 75, 76 (to be described later), that is, whether the IC 1 supplied from the horizontal transport path 24 is a good product or a defective product.
1 or to the defective product conveyance path 32.

The shuttle 33 provided at the i end of the defective product transport path 32 moves the ICI supplied to the defective product transport path 32 in accordance with the cause (type, item) of the defect. 19 defective sticks 34 corresponding to the factors
,... are selectively stored. Which stick of these defective sticks 34 corresponds to which defective product due to which factor (C1 is stored is set in advance by the user by operating the operation unit 35,
The information is stored in an internal memory (not shown) by a control unit 71, which will be described later. In this case, the number of sticks for one specific defective factor is up to five, and the number of defective factors classified into one category is up to nine.

The causes of the above defects include those determined by the mark defect determination section 74, lead defect determination section 75, and surface mold defect determination section 76, which will be described later, based on the Il image signals from the third inspection section 26 to the sixth inspection section 29. , mark defects such as no marks, typos, lead defects such as clouding, repelling, and nests,
The surface molding of the crank etc. is defective.

Furthermore, the ICs 1 supplied to the non-defective product transport path 31 are accommodated in a non-defective product stacker 36 provided at the terminal end of the non-defective product transport path 31. When the ICs 1 accommodated in the good product stacker 36 become full, the JCl in the good product stacker 36 is pushed out to the good product IC storage section 19 by an unillustrated extrusion mechanism, and at this time, the JCl in the non-defective product stacker 36 is pushed out into the corresponding empty stick 2. It is designed to be stored. This good IC
The stick 2 containing the IC 1 is further sent to a later stage by the stick horizontal feed conveyor 14, and after a rubber plug stopper for preventing IC 1 from falling is inserted by the rubber plug stopper insertion mechanism 100, it is placed in the good stick storage box 37. It is supposed to be released.

ICI in the above-mentioned good product transport path 31 and defective product transport path 32
The conveyance is carried out by high pressure air, and the
- Since the details are described in No. 190114,
The explanation thereof will be omitted here.

Also, regarding the rubber plug stopper insertion mechanism 100,
Since the details are described in Japanese Patent Application No. 61-231709, the explanation thereof will be omitted here.

The operating section 35 is housed in a drawer section 38 shown in FIG.

Further, a CRT display 39 is provided in each of the above sections, particularly above the inspection section. This CRT display 39
are detectors 40 installed at main positions on the conveyance path,...
・It is designed to display the location of conveyance abnormality corresponding to the detection signal from, the number of non-defective products, the number of various types of defective products, and the branching details of the defective product stick.

Next, the control circuit will be explained using FIG. 12. That is, the control section 71 that controls the entire
, a back side mold defect determination section 72 that determines whether there is a mold defect on the back surface 1d of the IC 1 based on the output from the second inspection section 21.22; A lead defect determination section 73 that determines a lead defect, a mark defect determination section 74 that determines a mark defect on the mark surface 1C of the IC 1 based on the output from the third inspection section 26, and the fourth and fifth inspection sections 27 and 28. A lead defect determination section 75 determines a lead defect in the rCl lead portion 1a based on the output of the above, a surface mold defect determination section 76 determines a mold defect on the mark surface 1C of the IC 1 based on outputs from the two sixth inspection sections, and the above. It is composed of drivers 77 and 81 that drive each part.

The back side mold defect determination section 72 extracts only the imaging signal of the mold section changing surface 1d based on the S image signal from the first and second inspection sections 21 and 22, and determines whether there is black information or not. This is to determine whether there is a mold defect on the back surface 1d. This mold defect is shown in Figs. 13(a) to (e).
These include pinholes, unfilled parts, chips, cracks, and scratches as shown in the figure.

The lead defect determination section 73 includes the first and second inspection sections 2
1. Only the lead part 1a is taken out by the ff1ll signal from 22, and depending on the length of the black information and the number of black blocks, the IC is
This is to determine whether there is a lead defect in the lead portion 1a of No. 1.

These lead defects include lead bending, lead bending, dam cut eccentricity, and lead bending inside and outside, as shown in FIGS. 14(a) to 14(d). The defective inner and outer surfaces of the lead portion 1a can be determined by measuring the length of the shadow of the lead portion 1a by utilizing the fact that the length of the shadow of the lead portion 1a is proportional to the inward or outward bending angle of the lead portion 1a. The decision is made based on this.

The mark defect determination section 74 extracts an image signal of only the mark surface 1c from the image signal from the third inspection section 26, and compares it with a pre-registered reference pattern (pattern recognition) to detect the mark surface 1C of the IC1. This is to determine whether the mark is defective or not. This mark defect is the 15th
As shown in Figures (a) to (i), there are no marks, reverse marks, typos, misalignments, inclinations, blurring, blurring, chips, scratches, etc.

The lead defect determination section 75 includes the fourth and fifth inspection sections 2
7. Take out only the lead part using the imaging signal from 28.
A read failure in the lead portion 1a of the IC 1 is determined based on the length of the black information and the number of black blocks. This lead defect is as shown in FIGS. 16(a), (b), and (c).
The soldering is good, but the soldering is bad.

The surface mold defect determination section 91 includes the sixth inspection section 2
The mold part, that is, the mark surface 1C by the imaging signal from 9.
The IC extracts only the image signal and determines whether there is black information or not.
This is to determine whether there is a mold defect on the mark surface 1C of I. The mold defects include pinholes, unfilling, chips, cracks, and scratches as shown in FIGS. 13(a) to 13(e).゛It should be noted that the mark defect determination unit 74 determines that the I
The CI is as shown in FIG.

The control section 71 is configured to control the transport 1lI111 of the IC1 or the distribution according to the detection results of the detectors 40, . . . .

The control unit 71 determines whether the corresponding IC 1 is a good product or is a defective product due to which defective factor, according to the results of the determinations made by each of the determination units.

Further, the control section 71 has an internal memory (not shown).
The defective stick 34 corresponding to the defective cause is determined based on the data stored in the defective product transport path 3 by moving the shuttle 33 according to the determination result.
The defective products transported in step 2 are stored in defective product sticks 34 corresponding to the cause of the defect.

Further, the control section 71 counts the number of non-defective products and the number of defective products for each defect factor (item), and stores the counting results in an internal memory (not shown). The contents of the count are displayed on the CRT display 39 or printed out using a printer (not shown).

Further, the criteria for each of the above-mentioned determination units are stored in advance in a ROM or floppy disk (not shown). For example, when determining the length of the lead portion 1a of the IC 1, the above-mentioned criteria may include determining whether the length is shorter than a predetermined length within 1 mm or within the standard. It is within the standard. The determination criteria of each of the determination units described above can be changed in advance by the user. This change method involves rewriting the contents of a floppy disk (not shown) in which the above change criteria is stored.

Next, the operation in such a configuration will be explained.

For example, when the power (not shown) is turned on, the operation section 35
Accordingly, the allocation of defective products to the defective sticks 34, . . . is set in advance. Then, the rubber stopper on the right side is removed, and the sticks 2, . . . containing the ICs 1, . Then, the sticks 2 in the storage section 11 are scraped up one by one by the bar 13 of the stick scraping conveyor 12. At this time, due to the center of gravity of the stick 2, the stick 2 is raked upward only when it is in a desired direction, and is otherwise dropped into the storage section 11.

Next, the sticks 2 that ride on the bar 13 and are scraped up by the scraping conveyor 12 are transferred to the scraping conveyor 12.
The stick is rotated several times by 90 degrees at the upper end and transferred to the stick horizontal feed conveyor 14. At this time, as mentioned above, the bar 13
Since only the stick 2 whose direction has been selected reaches the upper end, all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state as shown in FIG. 4(a).

The stick 2 conveyed by the horizontal stick conveyor 14 is held by the O-da part 15, the left side is lifted by a cylinder (not shown), and the ICs 1, . . . inside are taken out from the opening on the right side. It is guided to a horizontal conveyance path 17 via a shooter 16 .

The ICs 1 supplied to this horizontal transport path 17 are transported one by one.

The stick 2 from which the IC1, . Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any IC 1 remaining in the stick 2 that has been transported. As a result of this detection, if there is no residue, the stick 2 is roughly conveyed to the rear non-defective IC storage section 19 by the horizontal stick conveyor 14, and if there is any residue, the stick 2 is roughly conveyed to the rear good IC storage section 19.
is stored in the upper IC residual storage section 20.

The IC 1 transported on the horizontal transport path 17 is
The inspection section 21 and the second inspection section 22 check the mold state of the back surface 1d, the state of the lead section 1a, etc., and the image signals thereof are supplied to the back surface mold defect determination section 72 and the lead defect determination section 73, respectively. As a result, the back side mold defect determination section 72 detects the 1!5@
Only the signal is extracted, and based on whether or not there is black information, mold defects such as pinholes, unfilling, chips, cracks, and scratches on the back side 1d of the ICI are determined, and the control unit uses this determination result. Output to 71.

In addition, the lead defect determination section 73 extracts only the lead portion 1a based on the carrier image signals from the first and second inspection sections 21 and 22, and detects the lead portion 1a of the IC 1 based on the length of black information and the number of black blocks. Lead defects such as lead bending, lead breakage, dam cut eccentricity, and lead internal/external bending are determined, and the determination results are output to the i-control unit 71.

Therefore, the control section 71 controls the back mold defect determination section 72.
Based on the determination result from the lead defect determination section 73, it is determined whether the corresponding TCI can be sent to the subsequent inspection section. As a result, if the control unit 71 determines that it can be sent to the subsequent inspection unit, that is, that there is no mold defect on the back surface 1d and no bending of the lead portion 1a, the corresponding IcI is sent to the rotation reversing unit 23.
When it is rotated 180 degrees, it is sent to the horizontal conveyance path 24.

In addition, if it is determined that the control 111PA71 cannot be sent to the subsequent inspection section, that is, there is a mold defect on the back surface 1d and a bend in the lead section 1a, the corresponding fcl is sent to the rotation reversing section 2.
3, when it is rotated 270 degrees, it is discharged to the defective IC storage box 25.

Further, the condition of the mark on the front surface 1C of the IC 1 transported through the horizontal transport path 24 is imaged by the third inspection section 26, and the imaged signal is supplied to the mark defect determination section 74, and the fourth inspection section 27
, the state of the lead portion 1a is imaged by the fifth inspection section 28,
The imaging signals are respectively supplied to the lead defect determination section 75, the mold state of the front surface 1C is imaged by the sixth inspection section 29, and the imaging signal is supplied to the front mold defect determination section 76.

As a result, the mark defect determination section 74 extracts only the imaging signal of the mark surface, that is, the surface 1C, from the ms multiplied signal from the third inspection section 26, and compares it with a pre-registered reference pattern (pattern recognition). Mark defects on the mark surface 1C of the ICI are determined, and the determination results are output to the control section 71.

Further, the lead defect determination unit 75 extracts only the lead portion 1a from the ms multiplied signals from the fourth and fifth inspection portions 27 and 28, and determines whether the lead portion 1a of the IC 1 is detected based on the length of the black information and the number of black blocks. Determine lead defects such as poor tintness or poor soldering, and use this determination result as llll1.
It is output to the first section 71.

Further, the surface mold defect determination section 76 extracts only the image signal of the mold section, that is, the surface 1C, based on the image carrier signal from the sixth inspection section 29, and determines whether there is black information or not.
Mold defects such as m (pinhole), unfilled, chipped, cracked, and scratches on the surface 1C of C1 are determined, and the determination result is output to the control section 71.

Therefore, the control section 71 includes a mark defect determination section 74, a lead defect determination section 75, and a surface mold defect determination section 76.
Based on the determination result from , it is determined whether the corresponding IC1 is a good product or a defective product. As a result, the control unit 71 detects a non-defective product, that is, a mark defect on the surface 1C, a mold defect, and a lead portion 1a.
If it is determined that there is no cracking or soldering defect, the corresponding IC 1 is separated into a non-defective conveyance path 31 at the branching section 30.

In addition, when the control unit 71 determines that there is a defective product, that is, a mark defect on the surface 1C, a mold defect, and a lead portion 1a that has a cracked or soldered defect, the corresponding IC
I is distributed to a defective product conveyance path 32 at a branching section 30.

The ICs 1 transported through the non-defective transport path 31 are sequentially stored in the non-defective stacker 36 . And good product stacker 36
When the detector 40 for detecting fullness detects fullness, the stopper 101 in front of the detector 40 stops the ICI being conveyed through the non-defective conveyance path 31, and a push-out mechanism (not shown)
The ICIs in the non-defective stacker 36 are pushed out to the non-defective IC storage section 19 and stored in the corresponding empty sticks 2 at this time. The stick 2 containing this good LCL is further sent to a later stage by a stick horizontal feed conveyor 14, and after a rubber stopper to prevent the ICI from falling is inserted by a rubber stopper insertion mechanism 100, it is placed in a good stick storage box. It is released within 37 days.

In addition, the IC 1 transported through the defective product transport path 32 is transported by a shuttle 33 provided at the terminal end of the defective product transport path 32.
By moving corresponding to the cause (item) of the defect, the 19 defect sticks 34 corresponding to the defect cause,
It is selectively stored in one of...

As mentioned above, ICs are inspected separately for non-defective products and multiple causes of failure, the ICs are branched based on the inspection results, and the branched ICs are stored separately for each cause of the failure. It is. This allows ICs to be stored separately for each cause of failure.

In addition, you can specify up to 9 categories of the above failure factors.
Moreover, the number of defective sticks for each item (factor) is up to 5.
You can set it up to anything you want.

[Effects of the Invention] As described in detail above, according to the present invention, it is possible to provide an electronic component inspection apparatus that can store electronic components separately for each cause of failure.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention; FIG. 1 is a diagram for schematically explaining the overall configuration, FIG. 2 is an external view of FIG. 1, and FIG. 3 is an explanation of the internal configuration. FIG. 4 is a diagram for explaining the configuration of the IC, FIG. 5 is a diagram schematically showing the configuration of the first inspection section, and FIG. 6 is a diagram schematically showing the configuration of the second inspection section. Figure 7 is a diagram for explaining the imaging range of the first and second inspection parts for the IC, and Figure 8 is a diagram for explaining the imaging range of the first and second inspection parts for the IC.
FIG. 9 is a diagram schematically showing the configuration of the fourth inspection section, FIG. 10 is a diagram schematically showing the configuration of the fifth inspection section, and FIG. 11 is a diagram schematically showing the configuration of the fifth inspection section. 6 is a diagram schematically showing the configuration of the inspection section, FIG. 12 is a block diagram showing the main parts of the control circuit, FIG. 13 is a diagram for explaining mold defects, and FIG. 14 is a diagram schematically showing the configuration of the inspection section.
Figure 16 is a diagram for explaining lead failure, Figure 15
The figure is a diagram for explaining a defective mark, Figure 17 is a diagram showing an example of an IC with a normal mark, and Figures 18 and 19 are diagrams for explaining a horizontal transport path for transporting an IC upward. 20 and 21 are diagrams for explaining a horizontal conveyance path for conveying an IC in a downward direction. 1...IC (electronic component), 1a...Lead part, 1b
...Mold part, 1C...Mark surface (surface), 1d
...back side, 2...stick, 11...accommodation section,
12... Stick scraping conveyor, 13... Bar, 14... Stick horizontal feed conveyor, 15...
- Loader section, 16... Shooter, 17... Horizontal conveyance path, 21... First inspection section, 22... Second inspection section, 2
3...Rotation reversal unit, 24...Horizontal conveyance path, 26...
・Third inspection department, 27...Fourth inspection department, 28...Fifth
Inspection section, 29...Sixth inspection section, 3o... Branching section (branching means), 31... Good product conveyance path. 32...Defective product conveyance path, 33...Shuttle (branching means) 34-...Defective product stick (storage means), 36
・・・Good product stacker, 71...AQI [1 copy, 72・
... Back side mold defect determination section, 73... Lead defect determination section, 74... Mark defect determination section, 75... Lead defect determination section, 76... Front side mold defect determination section, 77
~81...driver, 100...rubber plug stopper insertion structure. Applicant's agent Patent attorney Takehiko Suzue #l! Figure 2 (C) (d) Figure 4 pJ6 Figure 7 Figure 13 Figure 14 Figure 15 Figure 20 Figure 21

Claims (3)

[Claims] (1) Inspection means for inspecting electronic components for the presence or absence of multiple failure factors; Branching means for branching out electronic components based on the inspection results of this inspection means; and An electronic component inspection device characterized by comprising: storage means for storing each factor separately; (2) The storage means is comprised of a shuttle that moves the electronic components depending on the cause of the defect and a plurality of sticks that store the electronic components from the shuttle. Electronic component inspection equipment. (3) The electronic component inspection apparatus according to claim 1, wherein the number of items stored by the storage means is equal to or greater than the number of defective factors.