JPH01176953A - Inspection device for electronic component - Google Patents

Abstract

PURPOSE:To securely decide serious defects which affect performance possibly and other defects by conveying a molded electronic component for outward appearance inspection and detecting outward appearance information on its outward appearance area. CONSTITUTION:A stick 2 contains electronic components IC 1 as bodies to be inspected and a stick storage part 11 contains many sticks 2. A stick 2 is moved onto a horizontal feed conveyor 14 through a scooping-up conveyor 12 and its internal ICs 1 are taken out at a loader part 15. Then the ICs 1 are guided, one by one, to a horizontal conveyance path 17 and molding states of reverse surfaces, states of lead parts, etc., are picked up by 1st and 2nd inspection parts 21 and 22, whose video signals are outputted to a decision means and a lead defective part. The decision means compares outward appearance information on the ICs 1 with pieces of decision level information on mold areas by positions which are stored in a decision level information storage means to decide the extents of defects of the outward appearance states by the positions.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic component inspection device, and more specifically, for example, a DIP (Dual In Line Packaging).
The present invention relates to an electronic component inspection device that accurately inspects the mold condition of electronic components such as e) type ICs.

(Prior art) Generally, in an electronic component inspection device that inspects the condition of a mold such as a DIP type IC, the IC is optically scanned and the reflected light from the molded area is photoelectrically converted to detect external appearance information of the molded area. However, from this appearance information, the area of scratches, holes, etc. is determined and compared with a unique determination level stored in a determination table in advance to determine whether the IC mold condition is good or bad.

However, it is related not only to the size of the good area of a good IC or a bad mold, but also to the position where the mold defect exists.

That is, if there is a defect in the central part of the IC mold where the circuit is arranged or near the lead terminals, even if the defect is small, there is a high possibility that malfunction or failure will occur later.

For this reason, in the past, the judgment level was set to be strict in order to reliably detect defects, but in this case, mold defects at positions that would not have any effect on the IC's performance could be judged as IC defects. This results in a problem in that the number of ICs determined to be defective increases significantly.

(Problems to be Solved by the Invention) As mentioned above, in conventional devices, even if a defect occurs in a part that does not affect the performance of the electronic component, it is determined that the electronic component is defective, resulting in an increase in the number of defects. There was a problem with putting it away.

The present invention was developed based on these circumstances, and it is possible to reliably distinguish between defects that may affect the performance of electronic components and defects that do not, and to identify only those with important defects as defective electronic components. It is an object of the present invention to provide an electronic component inspection device that can determine the following.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides an electronic component inspection apparatus that inspects the appearance of an electronic component while conveying the electronic component by a conveyance means, which detects appearance information of the electronic component. Appearance information detection means for detecting appearance information;
Judgment level information storage means that stores judgment level information for each area of the electronic component, and comparison of the appearance information obtained from the appearance information detection means and the judgment level information for each position from the judgment level information storage means. and determining means for determining whether the electronic component is good or defective according to position.

(for production) The operation of the apparatus having the above configuration will be explained below.

The conveyance means of this apparatus conveys molded electronic parts and provides them for visual inspection.

The appearance information detection means of this apparatus detects appearance information of the appearance area of the electronic component being transported, and sends this to the determination means.

The determining means compares the appearance information with determination level information for each position in the mold area of the electronic component stored in the determination level information storage means, and determines the degree of defective appearance of the electronic component for each position. Discern. This improves the appearance of electronic components.

The degree of defect can be determined by position.

(Example) An embodiment of the present invention will be described below with reference to the drawings.

1 to 3 (a>, (b) show the overall configuration of a high-speed IC visual inspection apparatus as an electronic component inspection apparatus according to this embodiment. In the figure, numeral 11 is a stick accommodating part; this stick accommodating part A stick 2 accommodating a plurality of electronic components (hereinafter referred to as ICs) 1 as objects to be inspected is housed in the stick 11 .

This stick storage section 11 can hold 400 sticks 2.
It has a volume that can accommodate.

As the above-mentioned IC1, a 16-pin to 42-pin DTP type IC is used. If the stick 2 has 16 pins, 25 ICs are accommodated in the stick 2.

If the above IC is a 16-pin DIP type IC, the IC shown in Fig. 4 (
As shown in a) to (d), it is composed of a lead part 1a consisting of eight lead wires on each side and a mold part 1b, and the mold part 1b has a front surface, that is, a mark surface 1C and a back surface 1d.

The stick 2 is normally plugged at both ends to prevent the IC 1 inside from collapsing when it is tilted, but when it is stored in the storage section 11, it is placed on the inspection section side, that is, as shown in FIG. In state a), the stopper on the right side is not closed.

The sticks 2 in the storage section 11 are lifted up one by one by a stick lifting conveyor 12. The scraping conveyor 12 is provided with stick holding bars 13 at regular intervals. The spacing and height of the bars 13 are such that only when the raking stick 2 is in the desired direction, the stick 2 rides on the bar 13 due to its center of gravity and is raked up; It is also adjusted to fit the size. The desirable direction of the stick 2 is that when the stick 2 is located at the first position of the scraping conveyor 12,
1 is on the back, that is, the lead part 1a of the ICI is facing upward,
This is a state in which the mark surface 1C of the mold part 1b faces downward.

The sticks 2 riding on the bar 13 and being scraped up by the scraping conveyor 12 are rotated 90 degrees at the upper end of the scraping conveyor 12, and then the sticks 2 are rotated 90 degrees by the stick horizontal feeding conveyor 14.
transfer to. At this time, as described above, only the sticks 2 whose direction has been selected by the bar 13 reach the upper end, so all the ICs 1 in the sticks 2 on the stick horizontal feed conveyor 14 are in a supine state.

The stick 2 transported by the stick horizontal feed conveyor 14 is held by the loader section 15, and the left side is lifted by a cylinder (not shown), so that the IC 1 inside is taken out from the right side opening. There is. The ICI . Inside the shooter 16, there is an IC that slides.
It is equipped with a stopper (not shown) that temporarily stops the
The ICIs are sent one by one to the horizontal transport path 17 in synchronization with the timing of horizontal transport.

The stick 2 from which the IC1 has been released by the loader section 15 is returned to the original horizontal state by a cylinder (not shown), and then returned onto the stick horizontal feed conveyor 14. Here, when the stick 2 is released from being held by the loader section 15, the stick 2 is further moved horizontally by the stick horizontal feed conveyor 14, and is conveyed to the IC residual detection section 18 at the rear.

This IC residual detection section 18 detects whether or not there is any IC 1 remaining in the transported stick 2. If the result of this detection is that there is no residual IC, the IC is transported to the rear non-defective IC storage section 19. If there is any remaining IC, it is accommodated in the upper IC remaining storage section 20. A detailed explanation of the IC residual detecting section 18 and the IC residual accommodating section 20 is described in Japanese Patent Application No. 60-214501, and is therefore omitted here.

The IC 1 transported on the horizontal transport path 17'F is transported to the first IC 1, which constitutes the appearance information detecting means 100, which is disposed opposite to the horizontal transport path 17. The second inspection unit 21° 22 inspects the IC
The mold state of the back surface 1d of the I, the state of the lead portion 1a, etc. are carried as images, and the carried image signals are outputted to a determining means 72 and a lead defect determining section 73, which will be described later.

The first inspection section 21 is an inspection section that inspects (images) the back surface 1d of the ICI and the lead section 3a using specular reflection as shown in FIG. 4(a), and as shown in FIG. , a lighting section 41 composed of straight tube fluorescent lamps. A mirror 42 that guides the reflected light from IC1 to the subsequent stage. A mirror drive unit 43 that rotates the mirror 42 in order to respond to the reflected light from the front surface of the IC 1, and a 1 to which the mirror 42 is guided.
The image carrier 44 includes a COD camera that converts signals for each scanning line into electronic signals.

Further, the second inspection section 22 has the same configuration as the first inspection section 21, and is configured as shown in FIG. 6. The first inspection section 21. The imaging unit 44 of the second inspection unit 22 has an effective field of view that is equal to or longer than the interval between the profiles 99, which serve as a large number of pushing claws that push the IC 1 provided on the horizontal conveyance path 17, and has a center of the field of view. is approximately equal to the center point between the two profiles 99 when stopped.

As a result, when the profiles 99 are stopped, the IC 1 located at any position between the profiles 99 can be captured within the field of view, and an image of the back side of the IC 1 can be captured.

As shown in FIG. 7, the first inspection section 21 outputs a carrier image signal for determining mold defects and lead wire defects in the right half of the back surface 1d of the IC 1 from the center line in the transport direction. , from the second inspection section 22, the back surface 1 of the IC 1 is inspected.
An imaging signal is output for determining mold defects and lead wire defects in the left half of the center line of d.

As a result, the first. The second inspection sections 21 and 22 have the same configuration, but each half of the back surface 1d of the IC 1 to be inspected, ie, imaged, is targeted at different halves, and the incident light from the illumination section 41 and the imaging section 44 are The relationship of reflected light is the opposite.

That is, as shown in FIG. 3(a), the first inspection section 21
In this case, the illumination section 41 is located in front of the horizontal conveyance path 17, whereas in the second inspection section 22, the illumination section 41 is located at the back of the horizontal conveyance path 17, and the ta image of the second inspection section 22 is The portion 44 overhangs the horizontal conveyance path 1 in order to catch reflected light directed toward the front of the horizontal conveyance path 17 .

Further, in the first inspection section 21, the incident light from the illumination section 41 and the reflected light to the image carrier section 44 are incident at approximately the same angle with respect to the normal plane of the back surface 1d of the ICI.

An illumination section 41 and an image carrier section 44 are arranged at a position where light is reflected. Therefore, since the N placement part 44 is not on the normal plane of the back surface 1d of the IC 1 and forms a certain angle with this, the back surface 1
The mold surface d is viewed obliquely, and the lead image on the image carrier 44 side overlaps the mold image on the same side, making it impossible to detect defects on the mold.

Therefore, from the center line of the back surface 1d of the IC 1 to the imaging section 44
Since it is difficult to detect a signal for mold defect determination on the side, in the back side mold defect determination section 72, which will be described later, the first inspection section 3
The mold defect determination based on the carrier signal from 1 is performed only on the half on the side of the illumination section 41 from the mold center line (the right half in FIG. 7).

Further, in the first inspection section 31, the IC1 on the illumination section 41 side
The lead portion 1a is designed to block light reflected from the rail on the illumination portion 41 side to the image carrier portion 44, and the lead portion 1a of the illumination portion 4
By giving the rail surface on the first side a property (white) that reflects light well, it is possible to image the shadow of the lead section 1a on the illumination section 41 side.

In addition, the image transferred in the half on the image transfer section 44 side (the left half in FIG. 7) from the mold center line, which cannot be transferred in the first inspection section 21, and the image transferred on the shadow of the lead part 1a on the ti image section 44 side are The inspection is carried out in two inspection sections 22.

Further, the distance between the centers of the fields of view of the first inspection section 21 and the second inspection section 22 is an integral multiple of the distance between the profiles 99 . . . . As a result, Profile 9 for intermittent exercise
9... stops, the IC1 exists both within the field of view of the first inspection section 21 and within the field of view of the second inspection section 22, and the images can be transported simultaneously.

A rotation reversal section 23 is provided at the end of the horizontal conveyance path 17 serving as the first conveyance means.

The rotation reversing unit 23 transfers the ICI supplied from the horizontal conveyance path 17 to the horizontal conveyance path 24 as a second conveyance means or to It is sent to the IC storage box 25. In other words, when a good ICI whose back side mold condition and lead part condition are determined to be normal is rotated 180 degrees, the compressed air ejected from the compressed air ejecting nozzle (not shown) serving as the sending means causes the ICI to face the opposite side. On the other hand, when the defective IC 1 determined to be in the above condition is further rotated by 90 degrees (270 degrees in total), it is ejected from the air ejection nozzle 50 as an ejection means. The compressed air is removed from the defective IC storage box 25 through an opposing discharge chute (not shown).
It is designed to be discharged.

In this way, the appearance information detection means 100@ constitutes the first.
The ICs 1 that are determined to be defective because the lead portion 1a has an inward/outward orientation that would impede the downward conveyance of the leads are eliminated in advance by the conveyed image of the second inspection unit 21, 22, and the ICs that are good
1 is upside down, that is, the lead part 1a faces downward, and the mark surface 1
The paper is inverted so that C faces upward and is sent to a horizontal transport path 24 having the same configuration as the horizontal transport path 17.

That is, the IC1 supplied from the rotation reversing section 23 is
As shown in Figure (b), it is conveyed with the lead portion 1a facing down and the mark surface 1G facing up.

The IC 1 transported on the horizontal transport path 24 is placed in the third to fifth inspection sections 26, 27, which are arranged facing the horizontal transport path 24.
．． 28, the mark surface, mark state, lead part 1
The state of a is conveyed as an image, and each of the conveyed image signals is sent to a mark defect determination section 74.a, which will be described later. It is designed to be output to the lead defect determination section 75.

Further, the mold state of the mark surface 1C of the IC 1 is conveyed by the sixth inspection section 29, which is arranged after the fifth inspection section 28 and constitutes the appearance information detection means 100, and the conveyed image signal is discriminated. It is designed to be outputted to means 72.

Incidentally, the intervals between the third to sixth inspection sections 26 to 29 described above are integral multiples of the intervals of the profiles described above. Further, the sixth inspection section 29 has a similar configuration to the first inspection section 21.

A branch portion 30 is provided at the terminal end of the horizontal conveyance path 24 as the second conveyance means. This branch part 30 is
ICI supplied from the horizontal conveyance path 24 is determined by a determining means 72, which will be described later. Lead defect determination section 73. Mark defective determination section 74
According to each discrimination or judgment result, that is, whether the IC1 is a good product or a defective product, it is distributed to the good product conveyance path 31 or the defective product conveyance path 32.

The IC 1 supplied to the defective product transport path 32 corresponds to the type of defect by moving the shuttle 33 provided at the end of the defective product transport path 32 in accordance with the type (item) of the defect. The 19 defective sticks 34 are selectively stored. The user selects which IC 1 corresponding to which defective product is stored in which stick of the defective stick 34 through the operation unit 35.
It is set in advance by the operation of .

In this case, the number of sticks 34 for one specific defect is up to five, and the number of types of defects is up to nine.

Furthermore, the ICs 1 supplied to the non-defective product transport path 31 are accommodated in a non-defective product stacker 36 provided at the terminal end of the non-defective product transport path 31. When the ICs 1 stored in the non-defective stacker 36 become full, the ICs 1 in the non-defective stacker 36 are pushed out to the non-defective IC storage section 19 by a push-out mechanism (not shown), and the corresponding empty stick 2
It is now stored inside. The stick 2 containing the good IC 1 is sent to a later stage by a rough stick horizontal feed conveyor 14, and is sent to a later stage by a rubber plug stopper insertion mechanism 9.
After the rubber plug stopper for preventing the IC 1 from falling is inserted at 0, the IC 1 is released into the good stick storage box 37.

ICs in the above-mentioned good product transport path 31 and defective product transport path 32
1 is transported using high-pressure air.
Since the details are described in 1-109114@, the explanation will be omitted here.

Further, since the rubber plug stopper insertion mechanism 90 is also described in detail in Japanese Patent Application No. 61-231709, its explanation will be omitted here.

The operating section 35 is housed in a drawer section 38 shown in FIG.

Further, a CRT display 39 is provided above each of the above sections, particularly above each inspection section. This CRT display 39
is a detector 50 installed at main positions on the conveyance path...
Displays transport abnormalities corresponding to detection signals from
It displays the number of non-defective products, the number of various types of defective products, and the branch contents of the defective product stick.

Next, the control system of the apparatus of this embodiment will be explained with reference to FIG.

The control system of the device of this embodiment includes a control section 7 that performs overall control.
1 and the above 1. Based on the output signals from the second inspection section 21 and 22, it is determined whether the mold is defective on the back surface 1d of the IC 1, and based on the output signal from the sixth inspection section 29, it is determined whether the mold on the mark surface 1G of the IC 1 is defective. a discriminating means 72 for determining the above-mentioned first. A lead defect determination section 73 determines a lead defect in the lead portion 1a of the IC 1 based on the output from the second inspection section 21, 22, and a mark defect on the mark surface 1G of the IC 1 is determined based on the output from the third inspection section 26. The mark defect determination section 74 and the fourth. Fifth inspection section 27
．． 28, a lead defect determination section 75 that determines a lead defect in the lead section 1a of the ICI based on the output from the ICI lead section 28; Shuttle 33.
Drivers 77 that drive the transport paths 32 and 32, respectively.
to 81, and an operating section 35 connected to the control section 71, respectively. CRT display39. a detector 40, and a determination level information storage means 82 in the form of a table that stores in advance determination level information for each position of the mold area on the mark surface 1C and back surface 1d of the IC 1, which is necessary for the determination operation by the determination means 72. , a mold state information collecting means 83 is provided which collects mold state information for each position of a large number of ICs, that is, discrimination information for each defective position in the mold area, based on the determination result of the above-described determination means 72.

Assuming that, for example, the mark surface 1G of the IC 1 is divided as shown in FIG. 12(a), the judgment level information storage means 82 stores Xo Yo as shown in FIG. 12(b) for each divided area. With coordinates consisting of ~Xn Yn,
It has a configuration in which coordinate information and determination level information indicating the degree of good or defective are stored for each coordinate. This determination level is the number of black information to be determined as defective, that is, the limit value of the defective area.

As shown in FIG. 13, the mold state information collecting means 83 has a table having a coordinate area 84 corresponding to the coordinates Xo Yo to XnYn described above and a writing area (counter area) 85 in which the determination result of the determining means 72 is written. The determination result of the determination means 72 can be written for each position. Note that this writing area is not limited to one corresponding to one IC1, but also one corresponding to one IC1.
It goes without saying that it can be configured to correspond to the number of ICs 1 (several tens to hundreds or more) to be subjected to multiple inspections.

Here, the appearance information detection means 100 and the discrimination means 72 will be described in further detail with reference to FIGS. 9 and 10.

The discriminating means 72 receives the carrier signal from the sixth inspection section 29 and extracts only the Vri image signal for each position of the mark surface IC of the IC 1 from this carrier signal, and also extracts from the judgment level information storage means 82 the mark surface 1C. The coordinate information and degree information are taken in via the control unit 71, and these are compared to determine the mold defect status of the mark surface 1C from Xo Yo to Xn Y.
The determination is made for each position corresponding to the coordinate of n, and the determination result is sent to the control unit 71. Here, mold defects include pinholes, unfilling, chips, cracks, scratches, etc. as shown in FIGS. 9(a) to (e), and as shown in FIGS. 10(a) and (b). It is a depression 95 like this.

Further, the determining means 72 includes the first. The same determination operation as described above is performed on the carrier signals from the second inspection section 21 and 22, and the mold defect state on the back surface 1d of the IC 1 is determined by position.

The discriminating operation in the discriminating means 72 is performed, for example, by setting the mark plane 1C of the IC 1 at the coordinates Xa to Y2 in FIG. 10 (a
), (b), if there is a depression 95 as shown in FIG. 12(a), the coordinates X4 Y2 of the mark surface 1G
The image carrier signal is compared with the degree information of the coordinates X4 Y2 taken from the determination level information storage means 82, and if the level of the image signal is lower than the level of the degree information due to the difference in the black and white level between the two, the mold is If the mold is defective, and vice versa, it is determined that the mold is good.

Such a determination operation is the above-mentioned coordinate Xo Y.

The results of each determination are sent to the mold state information collecting means 83 via the control unit 71, where they are written in the writing area 85 by coordinates, for example, with * marks. There is.

The operation for determining the mold state for 1C will be mainly described, with reference also to a flowchart showing the determination operation shown in FIG.

The sixth inspection section 29 operates in the same manner as the first inspection section 21 shown in FIG.
The surface of the object is imaged, an image signal is obtained (STI), and this is sent to the discrimination means 72.

The determining means 72 receives the carrier signal from the sixth inspection section 29, and detects the presence or absence of a defect and the position of the defect from the longitudinal projection and construction projection of this carrier signal (Si2). Extremely minute scratches etc. are not judged as defective. Furthermore, when the defect extends over a plurality of areas, the position of the center of gravity of the defective surface is determined, and the area where this center of gravity is located is determined to be defective. When a defect is detected here (Sr1), the area of the defect is then calculated from the carrier image signal of the defective surface, that is, the region of the depression 95 (Sr1). Then, the discrimination level information of the coordinates X4Y2 corresponding to the depression 95 is taken from the discrimination level means 82 and compared with the value of the defective area (5T5). When the value of the defective area is larger than the discrimination level, the IC1 is removed from the mold. It is determined that it is defective (5T6), and the determination result is sent to the mold state information collection means 83.

The mold state information collecting means 83 determines the writing area 8 corresponding to the coordinates X4 Y2 based on the determination result from the determining means 72.
Write an * mark in 5 (Sr1). Once the determination of one defective area is completed, it is checked whether or not other areas are also defective, and if yes, the operation from Sr1 is repeated (Sr1).
.

On the other hand, if the defect area obtained from the carrier signal is determined to be smaller than the determination level in Sr1 described above, the determination means 72
determines that IC1 at this time is slightly defective.

When all the areas detected as defective in Sr1 described above have been judged, the mold state information collecting means 8
3 is displayed on the screen of the CRT display 39 via the control section 71 (Sr1).

The above-mentioned operations are carried out on each IC1 used for testing this device.
The determination results for each IC 1 are successively displayed on the screen of the CRT display 39.

As a result, the operator of this device can grasp the mold status of each IC1 by position (by coordinate) of its mold area, and if a mold defective * mark is displayed at a common coordinate for a large number of IC1s, In this case, it can be recognized that the mold used for manufacturing this ICI is defective.

Furthermore, if the coordinate position where the * mark indicating a mold defect is displayed is, for example, near the lead portion 1a, the IC in this case
The mold defect No. 1 can be recognized as a serious defect that impairs the original function of the ICI, and the coordinate position is
If the area is far from a, it can be recognized that it is a mild defect.

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the invention.

For example, it goes without saying that the detection 1 determination of the mold state of the IC 1 can be performed on the back surface 1a of the IC 1 in addition to the case described above.

It goes without saying that it can be carried out in the same way.

[Effects of the Invention] According to the present invention described in detail above, it is possible to accurately determine the appearance state of an electronic component according to the position of its area and whether it is good or bad, and to identify defects common to each electronic component. It is also possible to provide an electronic component inspection device that can also detect electronic components.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention; FIG. 1 is a diagram for schematically explaining the overall configuration, FIG. 2 is an external view of FIG. 1, and FIG. 3(a) is an internal configuration. 3(b) is a schematic configuration diagram, FIG. 4 is a diagram for explaining the configuration of the IC, and FIG. 5 is a diagram schematically illustrating the configuration of the first inspection section. , FIG. 6 is a diagram schematically showing the configuration of the second inspection section, and FIG. 7 is a diagram schematically showing the configuration of the second inspection section. A diagram for explaining the image carrying range of the second inspection section, FIG. 8 is a diagram schematically showing the configuration of the third inspection section, and FIGS. 9(a) to (e) are respective states of defective ICs. Figures 10 (a) and (b) are block diagrams showing the control system when the IC has a recess, Figure 12 (a) is an enlarged explanatory diagram of the mark surface of the IC, and Figure 12 (b). ) is an explanatory diagram showing the contents of the judgment level information storage means corresponding to the mark surface of FIG. 12(a), FIG. 13 is an explanatory diagram showing the contents of the mold condition information collecting means, and FIG. It is a flowchart showing the mold state determination operation. 1... IC as an electronic component, 72... Discrimination means,
82... Judgment level information storage means, 83... Mold condition information collection means, 100... Appearance information storage means. Fig. 4 Cone '1tN mortar (d) E2221' Crank Fig. 9 Fig. 10 ncrJ

Claims (1)

[Claims] An electronic component inspection apparatus that inspects the external appearance of an electronic component while transporting the electronic component by a transport means, comprising: external appearance information detection means for detecting external appearance information of the electronic component; and storage of judgment level information for each area of the electronic component. The external appearance information obtained from the external appearance information detecting means is compared with the judgment level information for each position from the judgment level information storage means to judge whether the electronic component is good or bad according to the position. 1. An electronic component inspection device comprising: a determining means for determining an electronic component;