JPS63141302A - Flexible circuit plate and manufacture thereof - Google Patents
Flexible circuit plate and manufacture thereofInfo
- Publication number
- JPS63141302A JPS63141302A JP28810686A JP28810686A JPS63141302A JP S63141302 A JPS63141302 A JP S63141302A JP 28810686 A JP28810686 A JP 28810686A JP 28810686 A JP28810686 A JP 28810686A JP S63141302 A JPS63141302 A JP S63141302A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- film
- flexible circuit
- base film
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000010408 film Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000002313 adhesive film Substances 0.000 claims abstract description 15
- 239000013039 cover film Substances 0.000 claims abstract description 11
- 238000004804 winding Methods 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 abstract description 4
- 239000004642 Polyimide Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 241001060350 Acalypha Species 0.000 abstract 2
- 238000007747 plating Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Manufacture Of Motors, Generators (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、フレキシブル回路板及びその製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a flexible circuit board and a method for manufacturing the same.
（従来の技術）
一般に、コイル状の導体回路を有するフレキシブル回路
板は、薄形マイクロモーターやコンパクトディスク・プ
レーヤーのピックアップヘッド等の薄形コイルの性能向
上という点で注目されている。(Prior Art) Generally, a flexible circuit board having a coil-shaped conductor circuit is attracting attention from the viewpoint of improving the performance of thin coils such as thin micro motors and pickup heads of compact disc players.
この種のフレキシブル回路板は、従来、第３図に示すよ
うに構成され、スルーホール１０を有するベースフィル
ム９の表裏両面に、夫々コイル８ａ、８ｂが同位置に形
成され、両コイル８ａ、８ｂは上記スルーホール１０の
めっきにより接続されている。更に、これらコイル８ａ
、８ｂを覆うように、カバーフィルム７．１１が接合さ
れている。This type of flexible circuit board has conventionally been constructed as shown in FIG. are connected by the plating of the through hole 10. Furthermore, these coils 8a
, 8b, a cover film 7.11 is bonded to cover them.
このような従来のフレキシブル回路板を製造するには、
第４図（ｂ）に示すようなポリイミドフィルム等からな
るベースフィルム９の表裏両面に、同じ厚さの銅箔を接
着し、フォトエツチング法により夫々コイル８ａ、８ｂ
を表裏同形状に表４個、裏４個と表裏同位置に形成する
。そして、スルーホール１０にて、コイル８ａとコイル
８ｂをめっき方法により導通させる。更に、第４図（ａ
＞、（Ｃ）に示すようなカバーフィルム７．１１により
、ベースフィルム９の表裏に形成されたコイル８ａ、８
ｂを挟持するように、貼り合せる。また、線材のみによ
るコイルの形成方法もあった。To manufacture such conventional flexible circuit boards,
Copper foils of the same thickness are adhered to both the front and back surfaces of a base film 9 made of polyimide film or the like as shown in FIG. 4(b), and coils 8a and 8b are formed by photoetching, respectively.
are formed in the same shape on the front and back, 4 on the front and 4 on the back, and in the same position on the front and back. Then, the coil 8a and the coil 8b are electrically connected to each other through the through hole 10 by a plating method. Furthermore, Fig. 4 (a
>, coils 8a, 8 formed on the front and back sides of the base film 9 by cover films 7.11 as shown in (C)
Attach them so that b is sandwiched between them. There was also a method of forming a coil using only wire.
（発明が解決しようとする問題点）
上記従来の製造方法においては、ベースフィルム９の銅
箔接着後のフォトエツチング法により形成されるコイル
８ａ１８ｂは、スルーホール１０をめっき方法によって
導通させて製造するコイルのため、工程が繁雑である。(Problems to be Solved by the Invention) In the conventional manufacturing method described above, the coil 8a18b is formed by the photoetching method after adhering the copper foil to the base film 9, and the coil 8a18b is manufactured by making the through hole 10 conductive by a plating method. Because it is a coil, the process is complicated.
更に、フォトエツチング法によりコイルを形成し導体の
断面積を稼ぐため、めっきを施した場合、例えば幅が広
くなり過ぎた時のコイル８ａとコイル８ｂの接触不良の
他、スルーホール１０のめつき不足による導通不良など
の問題があり、歩留りが向上しなかった。Furthermore, if the coil is formed by photoetching and plating is applied to increase the cross-sectional area of the conductor, for example, if the width becomes too wide, contact failure between coil 8a and coil 8b, as well as plating of through hole 10. There were problems such as poor conductivity due to the shortage, and the yield did not improve.
このため、導体間の間隔を３Ｃ１ｍ以上広げなければな
らないこともあり、フレキシブル回路板の小形化が固片
であった。また、線材のみによるコイルは折れ等でコイ
ル自身の金属疲労が起りやすく断線しやすかった。For this reason, it was sometimes necessary to increase the distance between the conductors by 3C1m or more, making it difficult to miniaturize the flexible circuit board. In addition, coils made only of wire are susceptible to metal fatigue of the coil itself due to bending, etc., and are prone to breakage.
この発明は、従来の問題点である導体間の接触不良や導
通不良を解消し、歩留りの向上を図ると共に、小形化を
図ったフレキシブル回路板及びその製造方法を提供する
ことを目的とする。An object of the present invention is to solve the conventional problems of poor contact and poor conduction between conductors, improve yield, and provide a flexible circuit board that is miniaturized and a method for manufacturing the same.
［発明の構成］
（問題点を解決するための手段）
この発明は、従来のフォトエツチング法により形成され
るコイルに代り、絶縁被膜付きの線材を巻回形成したコ
イルが、折れにくいベースフィルム上に接合されてなり
、必要に応じ、上記コイルを覆うようにカバーフィルム
が接合されているフレキシブル回路板である。[Structure of the Invention] (Means for Solving the Problems) In place of the coil formed by the conventional photoetching method, the present invention provides a method in which a coil formed by winding a wire material with an insulating coating is formed on a base film that is hard to break. This is a flexible circuit board in which a cover film is bonded to cover the coil, if necessary.
又、この発明は、少なくとも下記工程を具備することを
特徴とするフレキシブル回路板の製造方法である。Further, the present invention is a method for manufacturing a flexible circuit board, characterized by comprising at least the following steps.
■銅箔が設（プられたターミナルを有する絶縁性ベース
フィルムの裏面に、熱硬化性接着フィルムを接合する工
程、
■上記接着フィルム上に、絶縁被膜付き線材を巻回して
なるコイルを加熱により接合する工程、■上記コイルの
端部を上記ターミナルの銅箔に接続する工程。 ゛
尚、必要に応じ、上記工程（２）の次に、上記コイルを
覆うようにカバーフィルムを接合する工程を加えても良
い。■A step of bonding a thermosetting adhesive film to the back side of an insulating base film that has terminals with copper foil installed.■A coil made by winding a wire with an insulating coating on the adhesive film is heated. Bonding step, ■ Connecting the end of the coil to the copper foil of the terminal. If necessary, after step (2) above, a step of bonding a cover film to cover the coil may be performed. You can also add it.
（作用）
この発明によれば、一本の絶縁膜付きコイルと折れにく
いフィルムによりコイル間の接触不良や導通不良を未然
に防止することが出来、この結果、歩留りを向上すると
共に小形化を実現出来る。(Function) According to this invention, poor contact and poor conduction between coils can be prevented by using a single coil with an insulating film and a film that is hard to break.As a result, yield is improved and miniaturization is realized. I can do it.
（実施例）
以下、図面を参照して、この発明の一実施例を詳細に説
明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
この発明によるフレキシブル回路板は、第１図乃至第２
図に示すように構成され、第１図は全体を示し、第２図
は各構成部品を分解して示している。The flexible circuit board according to the present invention is shown in FIGS.
It is constructed as shown in the figure, and FIG. 1 shows the whole, and FIG. 2 shows each component in an exploded manner.
即ち、例えばポリイミドからなる絶縁性ベースフィルム
２には、その一端にターミナル６が一体に設けられ、こ
のターミナル６の表面には銅箔１が形成されている。こ
のような絶縁性ベースフィルム２の裏面には、絶縁性ベ
ースフィルム２と同形状の熱硬化性接着フィルム３が接
合されている。That is, an insulating base film 2 made of polyimide, for example, is integrally provided with a terminal 6 at one end thereof, and a copper foil 1 is formed on the surface of this terminal 6. A thermosetting adhesive film 3 having the same shape as the insulating base film 2 is bonded to the back surface of the insulating base film 2.
この接着フィルム３上には、コイル４が形成されている
。このコイル４は、第２図（Ｃ）からも明らかなように
従来とは異なり、絶縁被膜付きの線材が巻回されてなっ
ており、その端部４ａは上記ターミナル６の銅箔１に接
続されている。更に必要に応じ、このコイル４を覆うよ
うに、カバーフィルム５が接合されている。つまり、コ
イル４は絶縁性ベースフィルム２とカバーフィルム５と
により挟持されている。尚、この発明のフレキシブル回
路板には、従来のようなスルーホールは設けられていな
い。A coil 4 is formed on this adhesive film 3. As is clear from FIG. 2(C), this coil 4 is different from the conventional one, and is made by winding a wire with an insulating coating, and its end 4a is connected to the copper foil 1 of the terminal 6. has been done. Furthermore, a cover film 5 is bonded to cover the coil 4 as required. That is, the coil 4 is sandwiched between the insulating base film 2 and the cover film 5. It should be noted that the flexible circuit board of the present invention is not provided with through holes as in the prior art.
さて次に、この発明のフレキシブル回路板の製造方法に
ついて説明する。Next, a method for manufacturing a flexible circuit board according to the present invention will be explained.
先ず、一端にターミナル６を有する例えばポリイミドか
らなる絶縁性ベースフィルム２を製作し、ターミナル６
の表面に銅箔１を形成する。First, an insulating base film 2 made of polyimide, for example, having a terminal 6 at one end is manufactured, and the terminal 6 is
Copper foil 1 is formed on the surface of.
次に、この絶縁性ベースフィルム２の裏面に、熱硬化性
接着フィルム３を所定温度で加熱しながら接合する。Next, a thermosetting adhesive film 3 is bonded to the back surface of the insulating base film 2 while being heated at a predetermined temperature.
次に、接着フィルム３上に、絶縁被膜付きの線材を巻回
してなるコイル４を接合する。この接合の方法としては
、例えば固定治具にコイル４を配置し、その上から接着
フィルム３付きベースフィルム２を載せ、１００℃〜１
３０’Ｃの温度にて加熱する。Next, a coil 4 formed by winding a wire with an insulating coating is bonded onto the adhesive film 3. As a method for this joining, for example, the coil 4 is placed on a fixing jig, the base film 2 with the adhesive film 3 is placed on top of the coil 4, and the temperature is
Heat at a temperature of 30'C.
その後、必要であれば、コイル４を覆うようにカバーフ
ィルム５を接合する。この接合の方法としては、例えば
カバーフィルム５は片面に接着剤付きのフィルムを使用
し、絶縁性ベースフィルム２、接着フィルム３及びコイ
ル４を接合後、加熱により接合する。Thereafter, if necessary, a cover film 5 is bonded to cover the coil 4. As a method of this joining, for example, the cover film 5 is a film with an adhesive on one side, and after the insulating base film 2, adhesive film 3, and coil 4 are joined, they are joined by heating.
最後に、コイル４の端部４ａを、ターミナル６の銅箔１
に半田付けにより接続すると、第１図に示すフレキシブ
ル回路板が得られる。Finally, attach the end 4a of the coil 4 to the copper foil 1 of the terminal 6.
When connected by soldering, the flexible circuit board shown in FIG. 1 is obtained.
［発明の効果コ
この発明によれば、接触不良やフィルムによってコイル
を固定するため、コイルの金属疲労が少なくなりコイル
自身の断線を起しにくくなり、導通不良の問題が解決さ
れ、フレキシブル回路板の小形化が可能となる。又、フ
レキシブル回路板の製造に当たって、エツチングやめっ
きを省略することが出来、歩留りの向上が図かれると共
に製造工程の簡略化が図かれる。[Effects of the invention] According to this invention, since the coil is fixed by poor contact or a film, the metal fatigue of the coil is reduced and the coil itself is less likely to break, which solves the problem of poor continuity and improves flexibility in flexible circuit boards. can be made smaller. Further, in manufacturing the flexible circuit board, etching and plating can be omitted, improving yield and simplifying the manufacturing process.
第１図はこの発明の一実施例に係るフレキシブル回路板
を示す一部断面を含む斜視図、第２図（ａ）〜（Ｃ）は
第１図のフレキシブル回路板を分解して示す斜視図、第
３図は従来のフレキシブル回路板を示す一部断面を含む
斜視図、第４図＜ａ）〜（Ｃ）は第３図のフレキシブル
回路板を分解して示す斜視図である。
１・・・銅箔、２・・・ベースフィルム、３・・・接着
フィルム、４・・・コイル、５・・・カバーフィルム、
６・・・ターミナル。
出願人代理人 弁理士 鈴江武彦
４コイル
第１図FIG. 1 is a perspective view including a partial cross section showing a flexible circuit board according to an embodiment of the present invention, and FIGS. 2(a) to (C) are exploded perspective views showing the flexible circuit board of FIG. 1. 3 is a partially cross-sectional perspective view of a conventional flexible circuit board, and FIGS. 4A to 4C are exploded perspective views of the flexible circuit board of FIG. DESCRIPTION OF SYMBOLS 1... Copper foil, 2... Base film, 3... Adhesive film, 4... Coil, 5... Cover film,
6...Terminal. Applicant's representative Patent attorney Takehiko Suzue 4 coils Figure 1
Claims (1)
にくい絶縁性ベースフィルムと、このベースフィルムの
裏面に接合された熱硬化性接着フィルムと、この接着フ
ィルム上に形成され絶縁被膜付き線材が巻回されてなり
端部が上記ターミナルの銅箔に接続されたコイルとを具
備することを特徴とするフレキシブル回路板。 （２）上記コイルを覆うように接合されたカバーフィル
ムを備えた特許請求の範囲第１項記載のフレキシブル回
路板。 （３）少なくとも下記工程を具備することを特徴とする
フレキシブル回路板の製造方法。 （１）銅箔が設けられたターミナルを有する絶縁性ベー
スフィルムの裏面に、熱硬化性接着フィルムを接合する
工程、 （２）上記接着フィルム上に、絶縁被膜付き線材を巻回
してなるコイルを加熱により接合する工程、（３）上記
コイルの端部を上記ターミナルの銅箔に接続する工程。 （４）上記工程（２）の次に、上記コイルを覆うように
カバーフィルムを接合する工程を備えた特許請求の範囲
第３項記載のフレキシブル回路板の製造方法。[Claims] (1) An insulating base film that is hard to break and has a terminal provided with copper foil on its surface, a thermosetting adhesive film bonded to the back surface of the base film, and a film formed on the adhesive film. 1. A flexible circuit board comprising: a coil formed by winding a wire with an insulating coating and having an end connected to the copper foil of the terminal. (2) The flexible circuit board according to claim 1, comprising a cover film bonded to cover the coil. (3) A method for manufacturing a flexible circuit board, comprising at least the following steps. (1) A step of bonding a thermosetting adhesive film to the back side of an insulating base film having a terminal provided with copper foil. (2) A coil formed by winding a wire with an insulating coating on the adhesive film. a step of joining by heating; (3) a step of connecting the end of the coil to the copper foil of the terminal; (4) The method for manufacturing a flexible circuit board according to claim 3, further comprising the step of joining a cover film to cover the coil after the step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28810686A JPS63141302A (en) | 1986-12-03 | 1986-12-03 | Flexible circuit plate and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28810686A JPS63141302A (en) | 1986-12-03 | 1986-12-03 | Flexible circuit plate and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63141302A true JPS63141302A (en) | 1988-06-13 |
Family
ID=17725875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28810686A Pending JPS63141302A (en) | 1986-12-03 | 1986-12-03 | Flexible circuit plate and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63141302A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020195224A (en) * | 2019-05-29 | 2020-12-03 | 日本精工株式会社 | Power generation unit and manufacturing method thereof |
-
1986
- 1986-12-03 JP JP28810686A patent/JPS63141302A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020195224A (en) * | 2019-05-29 | 2020-12-03 | 日本精工株式会社 | Power generation unit and manufacturing method thereof |
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